Transient response of an edge interfacial crack in bonded dissimilar strips with a functionally graded interlayer under an antiplane shear impact

2018 ◽  
Vol 93 ◽  
pp. 177-182 ◽  
Author(s):  
Hyung Jip Choi
Keyword(s):  
Transient Response ◽  
Interfacial Crack ◽  
Functionally Graded ◽  
Antiplane Shear ◽  
Graded Interlayer

The Higher Order Crack Tip Fields for Interfacial Crack between Linear Functionally Graded and Homogeneous Piezoelectric Materials

2014 ◽  
Vol 1015 ◽  
pp. 97-100
Author(s):  
Yao Dai ◽  
Xiao Chong ◽  
Ying Chen
Keyword(s):  
Piezoelectric Materials ◽  
Electric Displacement ◽  
Interfacial Crack ◽  
Crack Tip ◽  
Higher Order ◽  
Functionally Graded ◽  
Linear Functions ◽  
Intensity Factors ◽  
Crack Tip Fields ◽  
Functionally Graded Piezoelectric Materials

The higher order crack-tip fields for an anti-plane crack situated in the interface between functionally graded piezoelectric materials (FGPMs) and homogeneous piezoelectric materials (HPMs) are presented. The mechanical and electrical properties of the FGPMs are assumed to be linear functions of y perpendicular to the crack. The crack surfaces are supposed to be insulated electrically. By using the method of eigen-expansion, the higher order stress and electric displacement crack tip fields for FGPMs and HPMs are obtained. The analytic expressions of the stress intensity factors and the electric displacement intensity factors are derived.

Computing the Stresses Induced Within Multi-Layered Elastic Media That Result From Sliding Contact With a Rigid Punch

2013 ◽  
Author(s):  
Stewart Chidlow ◽  
Mircea Teodorescu
Keyword(s):  
Contact Problem ◽  
Elastic Solid ◽  
Maximum Principal Stress ◽  
Functionally Graded ◽  
Material Failure ◽  
Rigid Punch ◽  
Vertical Displacements ◽  
The Fourier Transform ◽  
Graded Interlayer ◽  
Selection Of

This paper is concerned with the solution of the contact problem that results when a rigid punch is pressed into the surface of an inhomogeneously elastic solid comprising three distinct layers. The upper and lower layers of the solid are assumed to be homogeneous and are joined together by a functionally graded interlayer whose material properties progressively change from those of the coating to those of the substrate. By applying the Fourier transform to the governing boundary value problem (BVP), we may write the stresses and displacements within the solid in terms of indefinite integrals. In particular, the expressions for the horizontal and vertical displacements of the solid surface are used to formulate a coupled pair of integral equations which may be solved numerically to approximate the solution of the stamp problem. A selection of numerical results are then presented which illustrate the effects of friction on the contact problem and it is found that the presence of friction within the contact increases the magnitude of the maximum principal stress and changes its location. These observations indicate that material failure is much more likely to occur when friction is present within the contact as expected.

Elastodynamic Interaction of Two Offset Interfacial Cracks in Bonded Dissimilar Media With a Functionally Graded Interlayer Under Antiplane Shear Impact

2014 ◽  
Vol 81 (8) ◽  
Author(s):  
Hyung Jip Choi
Keyword(s):  
Stress Intensity ◽  
Stress Intensity Factors ◽  
Functionally Graded ◽  
Inverse Laplace Transform ◽  
Dynamic Mode ◽  
Cauchy Type ◽  
Intensity Factors ◽  
Interfacial Cracks ◽  
Graded Interlayer ◽  
The Impact

The impact response of bonded media with a functionally graded interlayer weakened by a pair of two offset interfacial cracks is investigated under the condition of antiplane deformation. The material nonhomogeneity in the graded interlayer is represented in terms of power-law variations of shear modulus and mass density between the dissimilar, homogeneous half-planes. Laplace and Fourier integral transforms are employed to reduce the crack problem to solving a system of Cauchy-type singular integral equations in the Laplace domain. The crack-tip behavior in the physical domain is recovered through the inverse Laplace transform to evaluate the dynamic mode III stress intensity factors as a function of time. As a result, the transient interaction of the offset interfacial cracks spaced apart by the graded interlayer is illustrated. The peak values of the dynamic stress intensity factors are also presented versus offset crack distance, elaborating the effects of various material and geometric parameters of the bonded system on the overshoot characteristics of the transient behavior in the near-tip regions, owing to the impact-induced interaction of singular stress fields between the two cracks.

Analysis of bonded finite wedges with an interfacial crack under antiplane shear loading

2009 ◽  
Vol 223 (10) ◽  
pp. 2213-2223 ◽  
Author(s):  
A R Shahani ◽  
M Ghadiri
Keyword(s):  
Singular Integral ◽  
Interfacial Crack ◽  
Singular Integral Equations ◽  
Shear Loading ◽  
Antiplane Shear ◽  
Complete Agreement ◽  
Free Condition ◽  
Special Cases ◽  
Crack Tips ◽  
Comparison Of The Results

Antiplane shear deformation of bonded finite wedges with an interface crack is studied in this article. The traction-free condition is imposed on the circular segment of the wedge. Boundary conditions on the radial edges are considered as traction—traction. In order to solve this problem a novel mathematical technique has been employed. This technique consists of the use of some recently proposed finite complex transforms, which have complex analogies to the standard finite Mellin transforms of the first and second kinds. However, for the problem of bonded wedges with an interfacial crack, first it is necessary to express the traction-free condition of the crack faces in the form of a singular integral equation, which is done in this article by describing an exact analytical method. The resultant singular integral equations are then solved numerically and the obtained results including the stress intensity factors at the crack tips are plotted. Comparison of the results in the special cases shows a complete agreement with those cited in the literature.

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