Carbon Nanotube as Thermal Interface Material Enhanced with Liquid Metal Alloy

Author(s):  
Yulong Ji ◽  
Gen Li ◽  
Chao Chang ◽  
Yuqing Sun ◽  
Hongbin Ma
2015 ◽  
Vol 137 (9) ◽  
Author(s):  
Yulong Ji ◽  
Gen Li ◽  
Chao Chang ◽  
Yuqing Sun ◽  
Hongbin Ma

Vertically aligned carbon nanotube (VACNT) films with high thermal conductance and mechanical compliance offer an attractive combination of properties for thermal interface applications. In current work, VACNT films synthesized by the chemical vapor deposition method were used as thermal interface material (TIM) and investigated experimentally. The liquid metal alloy (LMA) with melting point of 59 °C was used as bonding material to attach VACNT films onto copper plates. In order to enhance the contact area of LMA with the contact surface, the wettability of the contact surface was modified by plasma treatment. The thermal diffusivity, thermal conductivity, and thermal resistance of the synthesized samples were measured and calculated by the laser flash analysis (LFA) method. Results showed that: (1) VACNT films can be used as TIM to enhance the heat transfer performance of the contact surface; (2) the LMA can be used as bonding material, and its performance is dependent on the LMA wettability on the contact surface. (3) When applying VACNT film as the TIM, LMA is used as the bonding material. After plasma treatment, comparison of VACNT films with the dry contact between copper and silicon showed that thermal diffusivity can be increased by about 160%, the thermal conductivity can be increased by about 100%, and the thermal resistance can be decreased by about 31%. This study shows the advantages of using VACNT films as TIMs in microelectronic packaging.


2016 ◽  
Vol 138 (8) ◽  
Author(s):  
Gen Li ◽  
Yulong Ji ◽  
Qingzhen Zhang ◽  
Bohan Tian ◽  
Hongbin Ma

A high thermal conductivity thermal paste can be developed by mixing the oxidized liquid metal alloy (OLMA) with graphene. Four kinds of graphene-OLMA pastes were synthesized at graphene concentrations of 0.25 wt%, 0.75 wt%, 1.5 wt%, and 2.0 wt%, respectively. The paste structures were characterized by MicroXCT-400, which can be used to readily measure the air pocket size, and their thermal conductivities measured by a laser flash analysis method. It is found that the OLMA structure is very different from the liquid metal alloy (LMA), and a small amount of air pockets were formed in the OLMA. The air pocket size significantly affected the thermal conductivity of the graphene-OLMA paste. When the graphene concentration increased, as shown in Fig. 1(c)-(e), the paste's thermal conductivity increased. However, more air pockets were formed around the graphene. In particular, when the graphene concentration increased to 2.0 wt%, clusters of graphene, as shown in Fig. 1(f), were formed resulting in the formation of big air pockets in the thermal paste, which directly affected the thermal conductivity as shown in Fig. 1(g). We thought that when the graphene concentration increases, the thermal conductivity should increases. But the results show that it was not and then we used MicroCT to see the internal structure of the thermal paste and found that the air pockets were formed and significantly affects the thermal performance.


Author(s):  
P. D. Lobanov ◽  
O. N. Kashinsky ◽  
A. S. Kurdyumov ◽  
N. A. Pribaturin

An experimental study of dynamic processes during pulsed gas injection into quiescent liquids was performed. Both water and low melting temperature metal alloy were used as test liquids. Air and argon were used as gas phase. The test sections were vertical cylindrical columns 25 and 68 mm inner diameter. Measurements of flow parameters during gas injection were performed. Water – air experiments were performed at room temperature, the temperature of liquid metal alloy was 135 deg C. Time records of pressure in the liquid and in gas phase above the liquid were obtained. Measurements of liquid temperature and level of liquid surface were performed. It was shown that at pulse gas injection into liquid metal high amplitude pressure fluctuation may arise. Also the fluctuation variation of the free surface of the liquid may appear which are connected with the oscillations of the gas volume. Experimental data obtained may be used for verification & validation of modern CFD codes.


Author(s):  
Amer M. Hamdan ◽  
Aric R. McLanahan ◽  
Robert F. Richards ◽  
Cecilia D. Richards

This work presents the characterization of a thermal interface material consisting of an array of mercury micro droplets deposited on a silicon die. Three arrays were tested, a 40 × 40 array (1600 grid) and two 20 × 20 arrays (400 grid). All arrays were assembled on a 4 × 4 mm2 silicon die. An experimental facility which measures the thermal resistance across the mercury array under steady state conditions is described. The thermal interface resistance of the arrays was characterized as a function of the applied load. A thermal interface resistance as low as 0.253 mm2 K W−1 was measured. A model to predict the thermal resistance of a liquid-metal micro droplet array was developed and compared to the experimental results. The model predicts the deformation of the droplet array under an applied load and then the geometry of the deformed droplets is used to predict the thermal resistance of the array. The contact resistance of the mercury arrays was estimated based on the experimental and model data. An average contact resistance was estimated to be 0.14 mm2 K W−1.


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