Recent Progress of High Density Multi-Layer Printed Circuit Boards and the Discussions Towards the Future. Utilization of Multi-Layer Printed Circuit Boards in Advanced Applications. Personal Computer.

Mitsuo SAITOU; Makoto GOSHIMA

doi:10.5104/jiep1986.9.76

Recent Progress of High Density Multi-Layer Printed Circuit Boards and the Discussions Towards the Future. Utilization of Multi-Layer Printed Circuit Boards in Advanced Applications. Personal Computer.

Circuit Technology ◽

10.5104/jiep1986.9.76 ◽

1994 ◽

Vol 9 (2) ◽

pp. 76-82

Author(s):

Mitsuo SAITOU ◽

Makoto GOSHIMA

Keyword(s):

Personal Computer ◽

Recent Progress ◽

Printed Circuit Boards ◽

High Density ◽

Circuit Boards ◽

Printed Circuit ◽

The Future ◽

Future Utilization ◽

Advanced Applications

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Recent Progress of High Density Multi-Layer Printed Circuit Boards and the Discussions Towards the Future. Utilization of Multi-Layer Printed Circuit Boards in Advanced Applications. Video Movie.

Circuit Technology ◽

10.5104/jiep1986.9.94 ◽

1994 ◽

Vol 9 (2) ◽

pp. 94-98

Author(s):

Nobuyuki NISHITANI

Keyword(s):

Recent Progress ◽

Printed Circuit Boards ◽

High Density ◽

Circuit Boards ◽

Printed Circuit ◽

The Future ◽

Future Utilization ◽

Advanced Applications

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Recent Progress of High Density Multi-Layer Printed Circuit Boards and the Discussions Towards the Future. Utilization of Multi-Layer Printed Circuit Boards in Advanced Applications. Portable Telephone.

Circuit Technology ◽

10.5104/jiep1986.9.83 ◽

1994 ◽

Vol 9 (2) ◽

pp. 83-87

Author(s):

Takumi FURUKAWA

Keyword(s):

Recent Progress ◽

Printed Circuit Boards ◽

High Density ◽

Circuit Boards ◽

Printed Circuit ◽

The Future ◽

Future Utilization ◽

Advanced Applications

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Recent Progress of High Density Multi-Layer Printed Circuit Boards and the Discussions Towards the Future. The Development Trend of Materials for Advanced Multilayer-PWB.

Circuit Technology ◽

10.5104/jiep1986.9.70 ◽

1994 ◽

Vol 9 (2) ◽

pp. 70-75

Author(s):

Tsuyoshi MATSUMOTO ◽

Hiroyuki KOBAYASHI

Keyword(s):

Recent Progress ◽

Printed Circuit Boards ◽

Development Trend ◽

High Density ◽

Circuit Boards ◽

Printed Circuit ◽

The Future ◽

The Development Trend

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Recent Progress of High Density Multi-Layer Printed Circuit Boards and the Discussions Towards the Future. Utilization of Multi-Layer Printed Circuit Boards in Advanced Applications. Low Dielectric Constant High Density Multilayer Printed Wiring Board for Large Scale Computer.

Circuit Technology ◽

10.5104/jiep1986.9.88 ◽

1994 ◽

Vol 9 (2) ◽

pp. 88-93 ◽

Cited By ~ 1

Author(s):

Motoyo WAJIMA

Keyword(s):

Large Scale ◽

Printed Circuit Boards ◽

High Density ◽

Low Dielectric Constant ◽

Circuit Boards ◽

Printed Wiring Board ◽

Printed Circuit ◽

Low Dielectric ◽

Wiring Board ◽

Future Utilization

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Recent Progress of High Density Multi-Layer Printed Circuit Boards and the Discussions Towards the Future.Basic Consideration on the Multi-Layer Printed Circuit Boards from the View Point of Electronic Design.

Circuit Technology ◽

10.5104/jiep1986.9.65 ◽

1994 ◽

Vol 9 (2) ◽

pp. 65-69

Author(s):

Hidetaka HAYASHI ◽

Noboru SCHIBUYA

Keyword(s):

Recent Progress ◽

Printed Circuit Boards ◽

High Density ◽

Circuit Boards ◽

View Point ◽

Printed Circuit ◽

Electronic Design

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Discussion on Failure Mechanism and Modeling of Electrochemical Migration of High Density Printed Circuit Boards in Dust Environment

2018 12th International Conference on Reliability, Maintainability, and Safety (ICRMS) ◽

10.1109/icrms.2018.00068 ◽

2018 ◽

Author(s):

Yilin Zhou ◽

Yanyu Chen ◽

Wenrui Lu

Keyword(s):

Failure Mechanism ◽

Printed Circuit Boards ◽

High Density ◽

Electrochemical Migration ◽

Circuit Boards ◽

Printed Circuit

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A new probing technique for high-speed/high-density printed circuit boards

IEEE International Conference on Test, 2005. ◽

10.1109/test.2005.1584094 ◽

2006 ◽

Author(s):

K.P. Parker

Keyword(s):

High Speed ◽

Printed Circuit Boards ◽

High Density ◽

Circuit Boards ◽

Printed Circuit

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Effects of Voiding on the Degradation of Microvias in High Density Interconnect Printed Circuit Boards Under Thermomechanical Stresses

IEEE Transactions on Components Packaging and Manufacturing Technology ◽

10.1109/tcpmt.2014.2322105 ◽

2014 ◽

Vol 4 (8) ◽

pp. 1374-1379 ◽

Cited By ~ 1

Author(s):

Roozbeh Bakhshi ◽

Michael H. Azarian ◽

Michael G. Pecht

Keyword(s):

Printed Circuit Boards ◽

High Density ◽

Circuit Boards ◽

Printed Circuit

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Environmental assessment of halogen-free printed circuit boards, a design for environment (DfE) project with the high density packaging user group (HDPUG)

IEEE International Symposium on Electronics and the Environment, 2004. Conference Record. 2004 ◽

10.1109/isee.2004.1299685 ◽

2004 ◽

Author(s):

S. O'Connell ◽

A. Whitley ◽

R. Bergman ◽

T. Brady ◽

J. Burkitt ◽

...

Keyword(s):

Environmental Assessment ◽

Printed Circuit Boards ◽

High Density ◽

Design For Environment ◽

User Group ◽

Circuit Boards ◽

Printed Circuit ◽

Halogen Free ◽

High Density Packaging

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Laser drilling of high density printed circuit boards

10.1364/cleo.1981.fd1 ◽

1981 ◽

Author(s):

Heinz E. Klauser

Keyword(s):

Printed Circuit Boards ◽

Laser Drilling ◽

High Density ◽

Circuit Boards ◽

Printed Circuit

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