scholarly journals Study of Diebond Machine Platform on Theta Rotation Performance

Author(s):  
Edwin M. Graycochea Jr. ◽  
Rennier S. Rodriguez ◽  
Frederick Ray I. Gomez

Theta rotation on die during diebond process is one of the critical machine responses especially for land grid array (LGA) device with tight tolerances requirement. The paper focuses on the die theta rotation tolerance capability with critical design for LGA device evaluated on two different diebond machine platforms. The evaluation was narrowed down into two main diebond machines with the objective of attaining the best performance in terms of die theta rotation tolerance capability. The study used a side-by-side comparison analysis in terms of theta rotation on the two machines and presented the effect of machine selection on the theta rotation response. Theta rotation was monitored and both machines satisfied the specification of 1 degree of maximum rotation, though diebond Machine 1 was able to produce a more stable diebonding with only around less than 0.15 degree of theta rotation variation. For future works, the selected diebond machine could be used for devices with critical requirement.

Author(s):  
Rennier Rodriguez ◽  
Edwin Graycochea Jr. ◽  
Frederick Ray Gomez

The paper focuses on the die placement tolerance capability with critical design for land grid array (LGA) device evaluated on two different die attach machine platforms. The evaluation was narrowed down into two main die attach machines with the objective of attaining the best performance in terms of die placement tolerance capability. Die placement tolerance were quantified and only die attach Machine B was able to satisfy the specification of less than 30 microns. The study used a bar graph comparison in terms of die placement tolerance on the two machines and presented the effect of machine selection on die placement tolerance capability. For future works, the selected die attach machine could be used for devices with critical requirement.


Author(s):  
Edwin Graycochea Jr. ◽  
Rennier Rodriguez ◽  
Frederick Ray Gomez ◽  
Bryan Christian Bacquian

The paper is focused on the glue voids reduction of quad-flat no-leads (QFN) devices evaluated on different die attach machine platforms. The evaluation was narrowed-down into two main die attach machines with the objective of attaining the best performance in terms of reducing or eliminating the glue voids. Glue voids were quantified and only die attach Machine B was able to satisfy the specification. The study used analysis of variance on the two machines and presented the effect of machine selection on glue voids reduction. For future works, the selected die attach machine could be used for devices with critical requirement.


2019 ◽  
Vol 1 (2) ◽  
pp. 25-33
Author(s):  
Mei Ling Phang ◽  
Swee Huay Heng

Information sharing has become prevalent due to the expansion of social networking in this 21st century. However, electronic devices are vulnerable to various kinds of attacks. Information might be disclosed, modified and accessed by an unauthorised third party which consequently leads to the breach of confidentiality, integrity and availability of the information. Therefore, it is of utmost importance to employ the technology of cryptography and steganography to protect information assets. Cryptography and steganography have weaknesses when they are working alone. Therefore, crypto-steganography, the combination of cryptography and steganography are introduced to overcome the weaknesses in order to provide a double layer of security and protection. This paper provides a general overview of steganography and cryptography as well as a comparison analysis of different crypto-steganographic schemes. A secure crypto-steganographic system for healthcare is then developed with the implementation and integration of the secure crypto-steganographic scheme proposed by Juneja and Sandhu. This healthcare system enables users to store and deliver message in a more secure way while achieving the main goals of both cryptography and steganography.


GIS Business ◽  
2019 ◽  
Vol 14 (6) ◽  
pp. 577-585
Author(s):  
T. Vivekanandan ◽  
S. Sachithanantham

In inventory control, suitable models for various real life systems are constructed with the objective of determining the optimal inventory level.  A new type of inventory model using the so-called change of distribution property is analyzed in this paper. There are two machines M1 and M2  in series and the output of M1 is the input of M2. Hence a reserve inventory between M1 and M2 is to be maintained. The method of obtaining the optimal size of reserve inventory, assuming cost of excess inventory, cost of shortage and when the rate of consumption of M2  is a constant, has already been attempted.  In this paper, it is assumed that the repair time of M1  is a random variable and the distribution of the same undergoes a change of distribution  after the truncation point X0 , which is taken to be a random variable.  The optimal size of the reserve inventory is obtained under the above said  assumption . Numerical illustrations are also provided.


Author(s):  
D.S. Patrick ◽  
L.C. Wagner ◽  
P.T. Nguyen

Abstract Failure isolation and debug of CMOS integrated circuits over the past several years has become increasingly difficult to perform on standard failure analysis functional testers. Due to the increase in pin counts, clock speeds, increased complexity and the large number of power supply pins on current ICS, smaller and less equipped testers are often unable to test these newer devices. To reduce the time of analysis and improve the failure isolation capabilities for failing ICS, failure isolation is now performed using the same production testers used in product development, multiprobe and final test. With these production testers, the test hardware, program and pattern sets are already available and ready for use. By using a special interface that docks the production test head to failure isolation equipment such as the emission microscope, liquid crystal station and E-Beam prober, the analyst can quickly and easily isolate the faillure on an IC. This also enables engineers in design, product engineering and the waferfab yield enhancement groups to utilize this equipment to quickly solve critical design and yield issues. Significant cycle time savings have been achieved with the migration to this method of electrical stimulation for failure isolation.


2013 ◽  
pp. 76-81
Author(s):  
Thi Anh Thu Nguyen ◽  
Thi Mai Dung Nguyen

Background: Colorblind disability causes difficulties for people in daily life. Derived from the critical requirement to detect the patients in order to help prevent inappropriate careers, especially careers related to transportation, this research aim to determine the situations and the distributions of different types of visual disabilities. Materials: 1174 students (787 boys and 387 girls) including 2 groups: occupation group and transportation group were tested with ISHIHARA chromatic plates for colour vision deficiencies (CVD) (CVD iclude the total colour blindness, red- green blindness, red-blindness, green- blindness). The results are showed as follow: (i) Frequency of CVD boys among boy group is 4.70%; (ii) Frequency of CVD girls among girls group is 2.58%; (iii) In boy group, among 3 types of red- green blindness, the green-blindness has the higher frequency (3.18%) comparision with these ones of the red- green blindness and red-blindness. The total colour defiency was hardly; (iv) Frequency of CVD students among occupation group is 4.15%; (v) Frequency of CVD students among transportation group is 3.83%.


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