Assessment of hindered phenol antioxidants on processing stability of peroxide-cure LDPE by rheology and DSC analysis

2012 ◽  
Vol 126 (3) ◽  
pp. 939-946 ◽  
Author(s):  
Xiaohu Zhang ◽  
Hongmei Yang ◽  
Yihu Song ◽  
Qiang Zheng
Keyword(s):  
Dsc Analysis ◽  
Hindered Phenol ◽  
Phenol Antioxidants ◽  
Processing Stability

Influence of the chemical structure of para‐bridged group on the antioxidant behavior of hindered phenol antioxidants in HDPE resin

2020 ◽  
Vol 137 (46) ◽  
pp. 49505
Author(s):  
Cuiqin Li ◽  
Yang Li ◽  
Xinxin Xia ◽  
Jin Huang ◽  
Peng Sun ◽  
...  
Keyword(s):  
Chemical Structure ◽  
Hindered Phenol ◽  
Phenol Antioxidants

Synthesis and application of new macromolecular hindered phenol antioxidants of polyamide 6

2021 ◽  
pp. 51184
Author(s):  
Siyuan Jiang ◽  
Yufei Liu ◽  
Xiaoyu Zou ◽  
Min He ◽  
Kai Zhang ◽  
...  
Keyword(s):  
Polyamide 6 ◽  
Hindered Phenol ◽  
Phenol Antioxidants

Improving synthetic hindered phenol antioxidants: learning from vitamin E

2000 ◽  
Vol 70 (1) ◽  
pp. 89-96 ◽  
Author(s):  
K.D. Breese ◽  
J.-F. Lamèthe ◽  
C. DeArmitt
Keyword(s):  
Vitamin E ◽  
Hindered Phenol ◽  
Phenol Antioxidants

Shear Strength and Dsc Analysis of High-Temperature Solders

2013 ◽  
Vol 58 (2) ◽  
pp. 529-533 ◽  
Author(s):  
R. Koleňák ◽  
M. Martinkovič ◽  
M. Koleňáková
Keyword(s):  
Shear Strength ◽  
High Temperature ◽  
Lead Free ◽  
Dsc Analysis ◽  
Ultrasonic Activation ◽  
Metallic Substrates ◽  
Cu Substrate ◽  
Lead Free Solders

The work is devoted to the study of shear strength of soldered joints fabricated by use of high-temperature solders of types Bi-11Ag, Au-20Sn, Sn-5Sb, Zn-4Al, Pb-5Sn, and Pb-10Sn. The shear strength was determined on metallic substrates made of Cu, Ni, and Ag. The strength of joints fabricated by use of flux and that of joints fabricated by use of ultrasonic activation without flux was compared. The obtained results have shown that in case of soldering by use of ultrasound (UT), higher shear strength of soldered joints was achieved with most solders. The highest shear strength by use of UT was achieved with an Au-20Sn joint fabricated on copper, namely up to 195 MPa. The lowest average values were achieved with Pb-based solders (Pb-5Sn and Pb-10Sn). The shear strength values of these solders used on Cu substrate varied from 24 to 27 MPa. DSC analysis was performed to determine the melting interval of lead-free solders.

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