Thermal-Aware 3D Placement

Integrated Circuits and Systems - Three Dimensional Integrated Circuit Design ◽

10.1007/978-1-4419-0784-4_5 ◽

2009 ◽

pp. 103-144 ◽

Cited By ~ 1

Author(s):

Jason Cong ◽

Guojie Luo

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