Design and fabrication of a low-volume, high-temperature injection mould leveraging a ‘rapid tooling’ approach

2019 ◽  
Vol 105 (9) ◽  
pp. 3797-3813 ◽  
Author(s):  
Hamed Kalami ◽  
R. J. Urbanic
Keyword(s):  
High Temperature ◽  
Rapid Tooling ◽  
Injection Mould ◽  
Low Volume

Examination of Microstructure of Cement Composite Material for Renovation of Horizontal Structures

2019 ◽  
Vol 808 ◽  
pp. 103-108
Author(s):  
Lenka Mészárosová ◽  
Vít Černý ◽  
Rostislav Drochytka ◽  
Winfried Malorny
Keyword(s):  
Thermal Conductivity ◽  
Composite Material ◽  
High Temperature ◽  
Surface Temperature ◽  
Cement Composite ◽  
Volume Weight ◽  
Coefficient Of Thermal Conductivity ◽  
New Material ◽  
Properties Of Materials ◽  
Low Volume

Development of new material is focused on modification of properties of materials with silicate binder so that these could be used for renovation of horizontal structures of high-temperature devices and at the same time contribute to reduction of heat transportation of constructions with higher surface temperature (in this case 200 and 500 °C). Main requirements for this material is low volume weight and low coefficient of thermal conductivity. This paper assesses influence of exposition to higher temperatures on microstructure.

A review on advancements in applications of fused deposition modelling process

2020 ◽  
Vol 26 (4) ◽  
pp. 669-687 ◽  
Author(s):  
Sathies T. ◽  
Senthil P. ◽  
Anoop M.S.
Keyword(s):  
Additive Manufacturing ◽  
Research Work ◽  
Rapid Tooling ◽  
Future Research ◽  
Fused Deposition Modelling ◽  
Content Type ◽  
Fused Deposition ◽  
Low Volume ◽  
Customized Products

Purpose Fabrication of customized products in low volume through conventional manufacturing incurs a high cost, longer processing time and huge material waste. Hence, the concept of additive manufacturing (AM) comes into existence and fused deposition modelling (FDM), is at the forefront of researches related to polymer-based additive manufacturing. The purpose of this paper is to summarize the research works carried on the applications of FDM. Design/methodology/approach In the present paper, an extensive review has been performed related to major application areas (such as a sensor, shielding, scaffolding, drug delivery devices, microfluidic devices, rapid tooling, four-dimensional printing, automotive and aerospace, prosthetics and orthosis, fashion and architecture) where FDM has been tested. Finally, a roadmap for future research work in the FDM application has been discussed. As an example for future research scope, a case study on the usage of FDM printed ABS-carbon black composite for solvent sensing is demonstrated. Findings The printability of composite filament through FDM enhanced its application range. Sensors developed using FDM incurs a low cost and produces a result comparable to those conventional techniques. EMI shielding manufactured by FDM is light and non-oxidative. Biodegradable and biocompatible scaffolds of complex shapes are possible to manufacture by FDM. Further, FDM enables the fabrication of on-demand and customized prosthetics and orthosis. Tooling time and cost involved in the manufacturing of low volume customized products are reduced by FDM based rapid tooling technique. Results of the solvent sensing case study indicate that three-dimensional printed conductive polymer composites can sense different solvents. The sensors with a lower thickness (0.6 mm) exhibit better sensitivity. Originality/value This paper outlines the capabilities of FDM and provides information to the user about the different applications possible with FDM.

The Influence of Ni on the Microstructure of Co-Base ODS Alloys

2012 ◽  
Vol 535-537 ◽  
pp. 1011-1014 ◽  
Author(s):  
Lin Zhang ◽  
Xin Bo He ◽  
Ming Li Qin ◽  
Ye Liu ◽  
Xuan Hui Qu
Keyword(s):  
Solid Solution ◽  
High Temperature ◽  
Mechanical Alloying ◽  
Cleavage Fracture ◽  
Fracture Strength ◽  
Volume Fraction ◽  
Secondary Phases ◽  
The Matrix ◽  
Ods Alloys ◽  
Low Volume

Co-based ODS alloys strengthened by γ΄ precipitates and nanosized oxides are promising high-temperature structural materials. Single solid solution of Al and W in the matrix can not be achieved after mechanical alloying, resulting in the formation of low volume fraction of γ΄ phase and several kinds of secondary phases. The addition of Ni promotes the precipitation of γ΄ phase and reduces the amount of secondary phases by the enlargement of the solid solution limit of Al and W within the matrix. In comparison with the lower fracture strength and cleavage fracture mode of the alloy without the addition of Ni, Ni-containing Co-base ODS alloys exhibit much higher fracture strength and obvious ductile facture mode.

High Temperature Capacitors Based on [0001] and [1120] Sapphire Dielectrics

2010 ◽  
Vol 2010 (HITEC) ◽  
pp. 000182-000187
Author(s):  
Liang-Yu Chen
Keyword(s):  
High Temperature ◽  
Room Temperature ◽  
Dielectric Material ◽  
Dielectric Materials ◽  
Dielectric Constants ◽  
Polycrystalline Alumina ◽  
Temperature Range ◽  
Sapphire Substrates ◽  
Low Volume ◽  
Parallel Resistance

The test results of the dielectric properties of [0001] (C-plane) and [1120] (A-plane) sapphire (single crystalline Al2O3) at high temperatures indicate that these materials have very stable dielectric constants and low dielectric losses (compared with polycrystalline alumina) at low frequencies in the temperature range from room temperature to 550°C. Therefore, sapphire materials have become likely candidate dielectric materials for high temperature capacitors. This paper reports prototype low-volume (∼100pF) capacitors based on sapphire dielectrics for high temperature and low frequency applications. Low-volume parallel-plate capacitors using C-plane and A-plane sapphire as dielectric material were fabricated by stacking metallized sapphire substrates. These prototype capacitors were characterized in the temperature range from room temperature to 550°C by measuring the capacitance and parallel resistance of these devices at 120Hz, 1kHz, 10kHz, 100kHz, and 1MHz. The capacitance and equivalent parallel resistance of these capacitors were all directly measured by an AC LCZ impedance meter in controlled temperature environments. These prototype devices demonstrate stable capacitances over a wide temperature range, and therefore, have the potential to be integrated with silicon carbide (SiC) devices to enable high temperature electronics. The needs of thin-film metallization and encapsulation for these sapphire substrates are also discussed.

scholarly journals The interstellar medium local to HD 10125 (O9.7II)

2003 ◽  
Vol 212 ◽  
pp. 700-701
Author(s):  
Silvina Cichowolski ◽  
E. Marcelo Arnal ◽  
Cristina E. Cappa ◽  
Sergey Pineault ◽  
Nicole St-Louis
Keyword(s):  
High Temperature ◽  
Interstellar Medium ◽  
Massive Stars ◽  
Mechanical Energy ◽  
Volume Density ◽  
Stellar Winds ◽  
Gas Distribution ◽  
Huge Number ◽  
Structure And Dynamics ◽  
Low Volume

The structure and dynamics of the interstellar medium (ISM) are strongly affected by the action of massive stars. They deposit in the ISM a huge number of ionizing photons and transfer to it vast amounts of mechanical energy via their powerful stellar winds. As a consequence, massive stars create what is known as an interstellar bubble, i.e., a minimum in the gas distribution characterized by a low volume density and a high temperature, surrounded by an expanding envelope (Weaver et al. 1977). The star should be seen projected onto, or close to, the centre of the H i minimum.

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