Enhancing the properties of the SAC305-soldered joint: heat treatment of the nickel-plated copper substrate before reflow soldering

Author(s):  
Yulong Li ◽  
Xiang Deng ◽  
Min Lei ◽  
Xuewen Li ◽  
Hua Ouyang
Author(s):  
João Costa ◽  
Delfim Soares ◽  
Senhorinha F. Teixeira ◽  
Fátima Cerqueira ◽  
Francisco Macedo ◽  
...  

In the present work two different types of case studies are modelled, carried out involving the fusing of a material using the CFD (Computational Fluid Dynamics) software Ansys Fluent, using the VOF method (Volume of Fluid) to capture the position of the existing interfaces and the Solidification/melting method which uses an enthalpy-porosity approach to simulate the fusion of the material. The first case focus itself in the analysis of fusing process and dropping behavior of the melted plate in the presence of a thermal source. The validation is made using a study found in the bibliography and then using water as the melting material given that its behavior is well known. Then tin is used as the melting material followed by the use of SAC 405 as the melting plate. This study compares various materials properties and verifies the influence of some of these particular properties by changing them (surface tension and heat of fusion). The second case focus on the simulation of a geometry obtained at balance at a constant temperature by the SAC 405 soldering alloy in the presence of a component and the copper substrate on top of a PCB.


Nanomaterials ◽  
2021 ◽  
Vol 11 (11) ◽  
pp. 2819
Author(s):  
Junghyun Park ◽  
Donghyun Kim ◽  
Hyunsik Kim ◽  
Junghoon Lee ◽  
Wonsub Chung

The heat dissipation of a metal heat sink for passive cooling can be enhanced by surface modifications to increase its thermal emissivity, which is reflected by a darker surface appearance. In this study, copper electrodeposition followed by heat treatment was applied to a copper substrate. The heat treatment formed a nanoporous oxide layer containing CuO and Cu2O, which has a dark blackish color and therefore increased the thermal emissivity of the surface. The heat dissipation performance was evaluated using the sample as a heat sink for an LED module. The surface-treated copper heat sink with a high thermal emissivity oxide layer enhanced the heat dissipation of the LED module and allowed it to be operated at a lower temperature. With an increase in the heat treatment, the thermal emissivity increases to 0.865, but the thermal diffusivity is lower than the copper substrate by ~12%. These results indicate that the oxide layer is a thermal barrier for heat transfer, thus optimization between the oxide thickness and thermal emissivity is required by evaluating heat dissipation performance in operating conditions. In this study, an oxide layer with an emissivity of 0.857 and ~5% lower thermal diffusivity than the copper substrate showed the lowest LED operating temperature.


2018 ◽  
Vol 192 ◽  
pp. 01024
Author(s):  
Niwat Mookam ◽  
Kannachai Kanlayasiri

In this paper, the influences of soldering time on the wettability and intermetallic phase between Sn-3.0Cu lead-free solder and copper substrate were investigated. Reflow soldering was performed at 350 ° C under variable soldering times of 10, 20, 40, 60, 120, 240 and 480 s. The results indicated that the wettability and intermetallic growth depend on the soldering time. In addition, the Cu6Sn5 and Cu3Sn intermetallic phases with a hexagonal crystal structure were found between the lead-free solder and the copper substrate. The growth of intermetallic phases increased with soldering time, and the growth of intermetallic phases remarkably depended on grain boundary diffusion and was volume diffusion-controlled for Cu6Sn5 and Cu3Sn, respectively.


2019 ◽  
Vol 72 (1) ◽  
pp. 54-65
Author(s):  
Ming Yang ◽  
Zhengfeng Jia ◽  
Denghu Wei ◽  
Yunxia Wang ◽  
Xianjuan Pang ◽  
...  

Purpose The purpose of this paper is to investigate the tribological properties of carbonized polydopamine/reduced graphene oxide (CPDA/rGO) composite coatings. Design/methodology/approach CPDA/rGO composite coatings were prepared using the spray technique and subsequent pyrolysis under argon. The transmission electron microscopy, field-emission scanning electron microscopy, X-ray diffraction, X-ray photoelectron spectroscopy and Raman spectroscopy revealed the conversion of PDA and GO into CPDA and rGO, respectively. Findings The results of tribological investigations show that the CPDA/rGO composite coatings with heat treatment at 300°C possess much better friction-reduction and anti-wear properties. Originality/value The worn surfaces of the PDA/GO composite films after heat treatment at 300°C were much smoother than that of the copper substrate. The tribofilms containing C, N, O and Cu played an important role on reducing friction and increasing wear resistance.


Author(s):  
R. M. Anderson

Aluminum-copper-silicon thin films have been considered as an interconnection metallurgy for integrated circuit applications. Various schemes have been proposed to incorporate small percent-ages of silicon into films that typically contain two to five percent copper. We undertook a study of the total effect of silicon on the aluminum copper film as revealed by transmission electron microscopy, scanning electron microscopy, x-ray diffraction and ion microprobe techniques as a function of the various deposition methods.X-ray investigations noted a change in solid solution concentration as a function of Si content before and after heat-treatment. The amount of solid solution in the Al increased with heat-treatment for films with ≥2% silicon and decreased for films <2% silicon.


Author(s):  
E. Bischoff ◽  
O. Sbaizero

Fiber or whisker reinforced ceramics show improved toughness and strength. Bridging by intact fibers in the crack wake and fiber pull-out after failure contribute to the additional toughness. These processes are strongly influenced by the sliding and debonding resistance of the interfacial region. The present study examines the interface in a laminated 0/90 composite consisting of SiC (Nicalon) fibers in a lithium-aluminum-silicate (LAS) glass-ceramic matrix. The material shows systematic changes in sliding resistance upon heat treatment.As-processed samples were annealed in air at 800 °C for 2, 4, 8, 16 and 100 h, and for comparison, in helium at 800 °C for 4 h. TEM specimen preparation of as processed and annealed material was performed with special care by cutting along directions having the fibers normal and parallel to the section plane, ultrasonic drilling, dimpling to 100 pm and final ionthinning. The specimen were lightly coated with Carbon and examined in an analytical TEM operated at 200 kV.


Author(s):  
A.H. Advani ◽  
L.E. Murr ◽  
D. Matlock

Thermomechanically induced strain is a key variable producing accelerated carbide precipitation, sensitization and stress corrosion cracking in austenitic stainless steels (SS). Recent work has indicated that higher levels of strain (above 20%) also produce transgranular (TG) carbide precipitation and corrosion simultaneous with the grain boundary phenomenon in 316 SS. Transgranular precipitates were noted to form primarily on deformation twin-fault planes and their intersections in 316 SS.Briant has indicated that TG precipitation in 316 SS is significantly different from 304 SS due to the formation of strain-induced martensite on 304 SS, though an understanding of the role of martensite on the process has not been developed. This study is concerned with evaluating the effects of strain and strain-induced martensite on TG carbide precipitation in 304 SS. The study was performed on samples of a 0.051%C-304 SS deformed to 33% followed by heat treatment at 670°C for 1 h.


Author(s):  
R. Padmanabhan ◽  
W. E. Wood

Intermediate high temperature tempering prior to subsequent reaustenitization has been shown to double the plane strain fracture toughness as compared to conventionally heat treated UHSLA steels, at similar yield strength levels. The precipitation (during tempering) of metal carbides and their subsequent partial redissolution and refinement (during reaustenitization), in addition to the reduction in the prior austenite grain size during the cycling operation have all been suggested to contribute to the observed improvement in the mechanical properties. In this investigation, 300M steel was initially austenitized at 1143°K and then subjected to intermediate tempering at 923°K for 1 hr. before reaustenitizing at 1123°K for a short time and final tempering at 583°K. The changes in the microstructure responsible for the improvement in the properties have been studied and compared with conventionally heat treated steel. Fig. 1 shows interlath films of retained austenite produced during conventionally heat treatment.


Author(s):  
M. A. McCoy

Transformation toughening by ZrO2 inclusions in various ceramic matrices has led to improved mechanical properties in these materials. Although the processing of these materials usually involves standard ceramic powder processing techniques, an alternate method of producing ZrO2 particles involves the devtrification of a ZrO2-containing glass. In this study the effects of glass composition (ZrO2 concentration) and heat treatment on the morphology of the crystallization products in a MgO•Al2•SiO2•ZrO2 glass was investigated.


Author(s):  
A. W. West

The influence of the filament microstructure on the critical current density values, Jc, of Nb-Ti multifilamentary superconducting composites has been well documented. However the development of these microstructures during composite processing is still under investigation.During manufacture, the multifilamentary composite is given several heat treatments interspersed in the wire-drawing schedule. Typically, these heat treatments are for 5 to 80 hours at temperatures between 523 and 573K. A short heat treatment of approximately 3 hours at 573K is usually given to the wire at final size. Originally this heat treatment was given to soften the copper matrix, but recent work has shown that it can markedly change both the Jc value and microstructure of the composite.


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