Anti-Coking Performance of Ethyl Benzene Pyrolysis of Silicon-Based Films Prepared through Plasma-Enhanced Chemical Vapour Deposition

Silicon ◽  
2022 ◽  
Author(s):  
Wei Wang ◽  
Anjiang Tang ◽  
Shiyun Tang ◽  
Deju Wei ◽  
Lijun Chen
Keyword(s):  
Chemical Vapour Deposition ◽  
Vapour Deposition ◽  
Chemical Vapour ◽  
Ethyl Benzene ◽  
Silicon Based

Thermal Modulated Esr For The Study Of Defects In a-SiC:H Films

1994 ◽  
Vol 336 ◽  
Author(s):  
F. Demichelis ◽  
F. Giorgis ◽  
C. F. Pirri ◽  
E. Tresso ◽  
L. Ravera ◽  
...  
Keyword(s):  
Electron Spin Resonance ◽  
Chemical Vapour Deposition ◽  
Electron Spin ◽  
Vapour Deposition ◽  
Energy Gap ◽  
Chemical Vapour ◽  
Thermal Modulation ◽  
Defect Distribution ◽  
Spin Resonance ◽  
Silicon Based

ABSTRACTIn this work we present Thermal Modulation Electron Spin Resonance Measurements performed on a-SiC:H films prepared by Plasma Enhanced Chemical Vapour Deposition with energy gap in the range 1.8–2.5 eV. The results have been compared with previously obtained photothermal and photoconductive ones and have been interpreted by means of a defect distribution which takes into account both silicon based and carbon based defects.

Low-pressure chemical vapour deposition of mullite coatings in a cold-wall reactor

1999 ◽  
Vol 09 (PR8) ◽  
pp. Pr8-395-Pr8-402 ◽  
Author(s):  
B. Armas ◽  
M. de Icaza Herrera ◽  
C. Combescure ◽  
F. Sibieude ◽  
D. Thenegal
Keyword(s):  
Chemical Vapour Deposition ◽  
Vapour Deposition ◽  
Chemical Vapour ◽  
Low Pressure ◽  
Cold Wall ◽  
Pressure Chemical ◽  
Mullite Coatings

Thermodynamical and experimental conditions of hafnium carbide chemical vapour deposition

1999 ◽  
Vol 09 (PR8) ◽  
pp. Pr8-373-Pr8-380 ◽  
Author(s):  
P. Sourdiaucourt ◽  
A. Derré ◽  
P. Delhaès ◽  
P. David
Keyword(s):  
Chemical Vapour Deposition ◽  
Vapour Deposition ◽  
Chemical Vapour ◽  
Hafnium Carbide ◽  
Experimental Conditions

Reduction of carbon impurities in aluminium nitride from time-resolved chemical vapour deposition using trimethylaluminum

2020 ◽  
Author(s):  
Polla Rouf ◽  
Pitsiri Sukkaew ◽  
Lars Ojamäe ◽  
Henrik Pedersen
Keyword(s):  
Chemical Vapour Deposition ◽  
Vapour Deposition ◽  
Chemical Vapour ◽  
Aluminium Nitride ◽  
Methyl Groups ◽  
Time Resolved ◽  
Thermally Induced ◽  
Light Emitting ◽  
Carbon Impurities ◽  
Wide Range

<p>Aluminium nitride (AlN) is a semiconductor with a wide range of applications from light emitting diodes to high frequency transistors. Electronic grade AlN is routinely deposited at 1000 °C by chemical vapour deposition (CVD) using trimethylaluminium (TMA) and NH<sub>3</sub> while low temperature CVD routes to high quality AlN are scarce and suffer from high levels of carbon impurities in the film. We report on an ALD-like CVD approach with time-resolved precursor supply where thermally induced desorption of methyl groups from the AlN surface is enhanced by the addition of an extra pulse, H<sub>2</sub>, N<sub>2</sub> or Ar between the TMA and NH<sub>3</sub> pulses. The enhanced desorption allowed deposition of AlN films with carbon content of 1 at. % at 480 °C. Kinetic- and quantum chemical modelling suggest that the extra pulse between TMA and NH<sub>3</sub> prevents re-adsorption of desorbing methyl groups terminating the AlN surface after the TMA pulse. </p>

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