Liner Sweep Voltammetry Electroplating Method to Synthesize Large Monocrystalline Cu Cones for Interconnection

Electronic Materials Letters ◽

10.1007/s13391-021-00322-8 ◽

2021 ◽

Author(s):

Hua Hu ◽

Ruoxun Zhang ◽

Yunwen Wu ◽

Huiqin Ling ◽

Tao Hang ◽

...

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