Software tools for microalgae biorefineries: Cultivation, separation, conversion process integration, modeling, and optimization

2022 ◽  
Vol 61 ◽  
pp. 102597
Author(s):  
Alei Ahmadi Kasani ◽  
Amin Esmaeili ◽  
Abooali Golzary
2011 ◽  
Vol 6 (5) ◽  
pp. 696-712 ◽  
Author(s):  
Hon Loong Lam ◽  
Jiří Jaromír Klemeš ◽  
Zdravko Kravanja ◽  
Petar Sabev Varbanov

Author(s):  
Jose-Maria Carazo ◽  
I. Benavides ◽  
S. Marco ◽  
J.L. Carrascosa ◽  
E.L. Zapata

Obtaining the three-dimensional (3D) structure of negatively stained biological specimens at a resolution of, typically, 2 - 4 nm is becoming a relatively common practice in an increasing number of laboratories. A combination of new conceptual approaches, new software tools, and faster computers have made this situation possible. However, all these 3D reconstruction processes are quite computer intensive, and the middle term future is full of suggestions entailing an even greater need of computing power. Up to now all published 3D reconstructions in this field have been performed on conventional (sequential) computers, but it is a fact that new parallel computer architectures represent the potential of order-of-magnitude increases in computing power and should, therefore, be considered for their possible application in the most computing intensive tasks.We have studied both shared-memory-based computer architectures, like the BBN Butterfly, and local-memory-based architectures, mainly hypercubes implemented on transputers, where we have used the algorithmic mapping method proposed by Zapata el at. In this work we have developed the basic software tools needed to obtain a 3D reconstruction from non-crystalline specimens (“single particles”) using the so-called Random Conical Tilt Series Method. We start from a pair of images presenting the same field, first tilted (by ≃55°) and then untilted. It is then assumed that we can supply the system with the image of the particle we are looking for (ideally, a 2D average from a previous study) and with a matrix describing the geometrical relationships between the tilted and untilted fields (this step is now accomplished by interactively marking a few pairs of corresponding features in the two fields). From here on the 3D reconstruction process may be run automatically.


2016 ◽  
Vol 21 (10) ◽  
pp. 48-49
Author(s):  
Guntram Doelfs
Keyword(s):  

Bei Asklepios wissen Manager und Chefärzte dank eines Software-Tools immer genau, wie es aktuell um die Qualität in allen Kliniken des Konzerns bestellt ist. Im Interview schildert Projektmanager Stefan Kruse die Vorteile der IT-Lösung.


Author(s):  
D. P. Gangwar ◽  
Anju Pathania

This work presents a robust analysis of digital images to detect the modifications/ morphing/ editing signs by using the image’s exif metadata, thumbnail, camera traces, image markers, Huffman codec and Markers, Compression signatures etc. properties. The details of the whole methodology and findings are described in the present work. The main advantage of the methodology is that the whole analysis has been done by using software/tools which are easily available in open sources.


Controlling ◽  
2002 ◽  
Vol 14 (1) ◽  
pp. 25-30 ◽  
Author(s):  
Yvette Hahne ◽  
Hans Schmitz ◽  
Andreas Vetter
Keyword(s):  

MRS Bulletin ◽  
1997 ◽  
Vol 22 (10) ◽  
pp. 49-54 ◽  
Author(s):  
E. Todd Ryan ◽  
Andrew J. McKerrow ◽  
Jihperng Leu ◽  
Paul S. Ho

Continuing improvement in device density and performance has significantly affected the dimensions and complexity of the wiring structure for on-chip interconnects. These enhancements have led to a reduction in the wiring pitch and an increase in the number of wiring levels to fulfill demands for density and performance improvements. As device dimensions shrink to less than 0.25 μm, the propagation delay, crosstalk noise, and power dissipation due to resistance-capacitance (RC) coupling become significant. Accordingly the interconnect delay now constitutes a major fraction of the total delay limiting the overall chip performance. Equally important is the processing complexity due to an increase in the number of wiring levels. This inevitably drives cost up by lowering the manufacturing yield due to an increase in defects and processing complexity.To address these problems, new materials for use as metal lines and interlayer dielectrics (ILDs) and alternative architectures have surfaced to replace the current Al(Cu)/SiO2 interconnect technology. These alternative architectures will require the introduction of low-dielectric-constant k materials as the interlayer dielectrics and/or low-resistivity conductors such as copper. The electrical and thermomechanical properties of SiO2 are ideal for ILD applications, and a change to material with different properties has important process-integration implications. To facilitate the choice of an alternative ILD, it is necessary to establish general criterion for evaluating thin-film properties of candidate low-k materials, which can be later correlated with process-integration problems.


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