Fabrication of high thermal conductivity silicon nitride ceramics by pressureless sintering with MgO and Y2O3 as sintering additives

2020 ◽  
Vol 46 (17) ◽  
pp. 27175-27183
Author(s):  
Tao Lu ◽  
Tun Wang ◽  
Yingfei Jia ◽  
Maomao Ding ◽  
Ying Shi ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Silicon Nitride ◽  
High Thermal Conductivity ◽  
Pressureless Sintering ◽  
Sintering Additives ◽  
Nitride Ceramics

Fracture Resistance Behavior of High-Thermal-Conductivity Silicon Nitride Ceramics

2013 ◽  
Vol 11 (5) ◽  
pp. 872-882 ◽  
Author(s):  
You Zhou ◽  
Tatsuki Ohji ◽  
Hideki Hyuga ◽  
Yu-ichi Yoshizawa ◽  
Norimitsu Murayama ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Silicon Nitride ◽  
Fracture Resistance ◽  
High Thermal Conductivity ◽  
Nitride Ceramics

Spark Plasma Sintered Silicon Nitride Ceramics with High Thermal Conductivity Using MgSiN2as Additives

2009 ◽  
Vol 92 (9) ◽  
pp. 2122-2124 ◽  
Author(s):  
Gui-hua Peng ◽  
Min Liang ◽  
Zhen-hua Liang ◽  
Qing-yu Li ◽  
Wen-lan Li ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Silicon Nitride ◽  
High Thermal Conductivity ◽  
Nitride Ceramics ◽  
Spark Plasma ◽  
Sintered Silicon

High Thermal Conductivity Silicon Nitride Ceramics

2012 ◽  
Vol 49 (4) ◽  
pp. 380-384 ◽  
Author(s):  
Kiyoshi Hirao ◽  
You Zhou ◽  
Hideki Hyuga ◽  
Tatsuki Ohji ◽  
Dai Kusano
Keyword(s):  
Thermal Conductivity ◽  
Silicon Nitride ◽  
High Thermal Conductivity ◽  
Nitride Ceramics

Preparation and Properties of Silicon Nitride Ceramics by Nitrided Pressureless Sintering (NPS) Process

2006 ◽  
Vol 317-318 ◽  
pp. 125-130 ◽  
Author(s):  
In Sub Han ◽  
Seung Ho Cheon ◽  
Yong Hee Chung ◽  
Doo Won Seo ◽  
Shi Woo Lee ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Silicon Nitride ◽  
Pressureless Sintering ◽  
Thermal Shock Test ◽  
Shock Test ◽  
Low Thermal Expansion ◽  
Metal Contents ◽  
Nitride Ceramics ◽  
Original Laboratory ◽  
Si Addition

Silicon nitride ceramics were prepared by new nitrided pressureless sintering (NPS) process in this study. The microstructures, strengths and thermal properties of the NPS silicon nitride ceramics containing three types of Al2O3 and Y2O3 sintering additives were investigated. Additionally, we have investigated the effect of silicon metal contents changing with 0, 5, 10, 15 and 20 wt% in each composition. The silicon nitride was successfully densified using NPS process, particularly at the starting composition of 5 wt.% Al2O3, 5 wt.% Y2O3, and 5 wt.% Si addition. The maximum flexural strengths and relative densities of these specimens were 500 MPa and 98%, respectively. The flexural strength of sintered specimens after the thermal shock test between 30oC and 1300oC for 20,000 cycles was maintained with the original laboratory strength of 500MPa by low thermal expansion coefficient, 2.9 × 10-6/oC, and high thermal conductivity, 28 W/m⋅oC.

scholarly journals Development of high-thermal-conductivity silicon nitride ceramics

2015 ◽  
Vol 3 (3) ◽  
pp. 221-229 ◽  
Author(s):  
You Zhou ◽  
Hideki Hyuga ◽  
Dai Kusano ◽  
Yu-ichi Yoshizawa ◽  
Tatsuki Ohji ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Silicon Nitride ◽  
High Thermal Conductivity ◽  
Nitride Ceramics

Study on the thermal conductivity of silicon nitride ceramics with magnesia and yttria as sintering additives

2002 ◽  
Vol 57 (1) ◽  
pp. 15-19 ◽  
Author(s):  
Yuanbo Lin ◽  
Xiao-Shan Ning ◽  
Heping Zhou ◽  
Kexin Chen ◽  
Rong Peng ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Silicon Nitride ◽  
Sintering Additives ◽  
Nitride Ceramics
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