Molecular dynamics simulation of the interfacial evolution and whisker growth of copper-tin coating under electrothermal coupling

2022 ◽  
Vol 202 ◽  
pp. 110981
Author(s):  
Long Zhang ◽  
Dengjie Xiong ◽  
Junfeng Li ◽  
Limeng Yin ◽  
Zongxiang Yao ◽  
...  
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