Study on the flow and heat transfer characteristics of pin-fin manifold microchannel heat sink

2022 ◽  
Vol 183 ◽  
pp. 122052
Author(s):  
Yuhui Pan ◽  
Rui Zhao ◽  
Yongle Nian ◽  
Wenlong Cheng
Keyword(s):  
Heat Transfer ◽  
Heat Sink ◽  
Microchannel Heat Sink ◽  
Heat Transfer Characteristics ◽  
Pin Fin ◽  
Transfer Characteristics ◽  
Flow And Heat Transfer ◽  
Manifold Microchannel

scholarly journals Flow and Heat Transfer Characteristics in Pin-Fin Arrays as a Heat Sink

1992 ◽  
Vol 12 (1Supplement) ◽  
pp. 239-242
Author(s):  
K. MINAKAMI ◽  
S. MOCHIZUKI ◽  
A. MURATA ◽  
Y. YAGI ◽  
H. IWASAKI
Keyword(s):  
Heat Transfer ◽  
Heat Sink ◽  
Heat Transfer Characteristics ◽  
Pin Fin ◽  
Transfer Characteristics ◽  
Flow And Heat Transfer ◽  
Pin Fin Arrays

The Characteristics of Fluid Flow and Heat Transfer in Wavy, Dimple and Wavy-Dimple Microchannels

2013 ◽  
Vol 394 ◽  
pp. 173-178 ◽  
Author(s):  
Liang Gong ◽  
Bo Wei
Keyword(s):  
Heat Transfer ◽  
Heat Sink ◽  
Microchannel Heat Sink ◽  
Wavy Wall ◽  
Heat Transfer Characteristics ◽  
Enhance Heat Transfer ◽  
Transfer Characteristics ◽  
Flow And Heat Transfer ◽  
Enhancing Heat Transfer ◽  
Flow Resistances

The flow and heat transfer characteristics were numerically studied in wave, dimple and wave-dimple microchannels for thermal managements on the chip of Intel i7-996X with heat flux of 0.56 W/mm2.The results show that, in microchannles heat sink, the dimple structure could reduce the flow resistances and the wavy wall could enhance heat transfer. According to the both advantages, two types of microchannel heat sink both with dimples and wavy walls were designed, and the flow and heat transfer characteristics were numerically studied. It is proved that the wave-dimple microchannels heat sink holds the characteristics of enhancing heat transfer with low pressure drop, which implies it has great potential of development and application prospect.

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