scholarly journals Flow boiling characteristics in plain and porous coated microchannel heat sinks

2022 ◽  
Vol 183 ◽  
pp. 122152
Author(s):  
Vivian Y.S. Lee ◽  
Gary Henderson ◽  
Alex Reip ◽  
Tassos G. Karayiannis
Keyword(s):  
Flow Boiling ◽  
Heat Sinks ◽  
Microchannel Heat Sinks

Microchannel Size Effects on Two-Phase Local Heat Transfer and Pressure Drop in Silicon Microchannel Heat Sinks With a Dielectric Fluid

2007 ◽  
Author(s):  
Tannaz Harirchian ◽  
Suresh V. Garimella
Keyword(s):  
Heat Transfer ◽  
Heat Transfer Coefficient ◽  
Pressure Drop ◽  
Transfer Coefficient ◽  
Flow Boiling ◽  
Heat Sinks ◽  
Dielectric Fluid ◽  
Two Phase ◽  
Microchannel Heat Sinks ◽  
The Heat Transfer Coefficient

Two-phase heat transfer in microchannels can support very high heat fluxes for use in high-performance electronics-cooling applications. However, the effects of microchannel cross-sectional dimensions on the heat transfer coefficient and pressure drop have not been investigated extensively. In the present work, experiments are conducted to investigate the local flow boiling heat transfer in microchannel heat sinks. The effect of channel size on the heat transfer coefficient and pressure drop is studied for mass fluxes ranging from 250 to 1600 kg/m2s. The test sections consist of parallel microchannels with nominal widths of 100, 250, 400, 700, and 1000 μm, all with a depth of 400 μm, cut into 12.7 mm × 12.7 mm silicon substrates. Twenty-five microheaters embedded in the substrate allow local control of the imposed heat flux, while twenty-five temperature microsensors integrated into the back of the substrates enable local measurements of temperature. The dielectric fluid Fluorinert FC-77 is used as the working fluid. The results of this study serve to quantify the effectiveness of microchannel heat transport while simultaneously assessing the pressure drop trade-offs.

scholarly journals Optimal design of subcooled triangular microchannel heat sink exchangers with variable heat loads for high performance cooling

2021 ◽  
Vol 2116 (1) ◽  
pp. 012052
Author(s):  
David Olugbenga Ariyo ◽  
Tunde Bello-Ochende
Keyword(s):  
Heat Sink ◽  
High Performance ◽  
Flow Boiling ◽  
High Heat ◽  
Geometric Optimization ◽  
Heat Fluxes ◽  
Heat Sinks ◽  
Subcooled Flow Boiling ◽  
Subcooled Flow ◽  
Microchannel Heat Sinks

Abstract Deionized water at a temperature of 25 °C was used as the cooling fluid and aluminium as the heat sink material in the geometric optimization and parameter modelling of subcooled flow boiling in horizontal equilateral triangular microchannel heat sinks. The thermal resistances of the microchannels were minimized subject to fixed volume constraints of the heat sinks and microchannels. A computational fluid dynamics (CFD) ANSYS code used for both the simulations and the optimizations was validated by the available experimental data in the literature and the agreement was good. Fixed heat fluxes between 100 and 500 W/cm2 and velocities between 0.1 and 7.0 m/s were used in the study. Despite the relatively high heat fluxes in this study, the base temperatures of the optimal microchannel heat sinks were within the acceptable operating range for modern electronics. The pumping power requirements for the optimal microchannels are low, indicating that they can be used in the cooling of electronic devices.

FLOW BOILING HEAT TRANSFER OF R30 IN PARALLEL MICROCHANNEL HEAT SINKS

2019 ◽  
Vol 50 (10) ◽  
pp. 977-992 ◽  
Author(s):  
Zong-wei Zhang ◽  
Wen-di Xu ◽  
Zhao Wang ◽  
Cong Liu ◽  
Ke-lu Cui
Keyword(s):  
Heat Transfer ◽  
Boiling Heat Transfer ◽  
Flow Boiling ◽  
Heat Sinks ◽  
Flow Boiling Heat Transfer ◽  
Microchannel Heat Sinks
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