Thermal stability and interfacial structure evolution of Bi2Te3-based micro thermoelectric devices

2022 ◽  
Vol 896 ◽  
pp. 163090
Author(s):  
Hao Tang ◽  
Hui Bai ◽  
Xiao Yang ◽  
Yu Cao ◽  
Kechen Tang ◽  
...  
Keyword(s):  
Thermal Stability ◽  
Interfacial Structure ◽  
Structure Evolution ◽  
Thermoelectric Devices

Optimization of C/TiC duplex diffusion barrier coatings for SiC /Ti composites based on interfacial structure evolution exploration

2018 ◽  
Vol 44 (14) ◽  
pp. 16528-16534 ◽  
Author(s):  
Minjuan Wang ◽  
Hao Huang ◽  
Xu Huang ◽  
Mao Wen ◽  
Kwang Leong Choy ◽  
...  
Keyword(s):  
Diffusion Barrier ◽  
Interfacial Structure ◽  
Structure Evolution ◽  
Barrier Coatings

scholarly journals Catalytic activity, thermal stability and structural evolution of PdCu single-atom alloy catalysts: the effects of size and morphology

RSC Advances ◽  
2022 ◽  
Vol 12 (1) ◽  
pp. 62-71
Author(s):  
Qing Liu ◽  
Xiaoxu Wang ◽  
Lu Li ◽  
Keke Song ◽  
Yanzhou Wang ◽  
...  
Keyword(s):  
Thermal Stability ◽  
Catalytic Activity ◽  
Catalytic Properties ◽  
Structural Evolution ◽  
Md Simulations ◽  
Single Atom ◽  
Structure Evolution ◽  
Size And Morphology ◽  
Alloy Catalysts ◽  
Single Atom Alloy

Catalytic properties and structure evolution of a PdCu nanoalloy with a novel crown-jewel structure are explored using DFT calculations and MD simulations.

Diffusion barriers for CeFe4Sb12/Cu thermoelectric devices

2013 ◽  
Vol 1490 ◽  
pp. 197-202 ◽  
Author(s):  
Laetitia Boulat ◽  
Romain Viennois ◽  
Didier Ravot ◽  
Nicole Fréty
Keyword(s):  
Thermal Stability ◽  
Thermoelectric Material ◽  
Diffusion Barrier ◽  
Copper Electrode ◽  
Diffusion Barriers ◽  
Tantalum Nitride ◽  
Thermoelectric Devices ◽  
Microstructural Study ◽  
Copper Material ◽  
Thermal Stability Of

ABSTRACTThe efficiency of a tantalum nitride interlayer as a diffusion barrier for CeFe4Sb12 thermoelectric material against electrode copper material has been investigated. The thermal stability of CeFe4Sb12/TaN/Cu stackings has been investigated after annealing at 600°C from a microstructural study. CeFe4Sb12 and Cu appear to chemically react through the formation of CeCu2 and Cu2Sb phases whereas no reaction is observed for CeFe4Sb12 with TaN. This study showed that the TaN interlayer cannot inhibit the diffusion of Sb from the skutterudite substrate to the copper electrode but prevents the diffusion of Ce and consequently the formation of the CeCu2 phase.

scholarly journals Structure Evolution and Thermal Stability of High-Energy- Density Li-Ion Battery Cathode Li2VO2F

2017 ◽  
Vol 164 (7) ◽  
pp. A1552-A1558 ◽  
Author(s):  
Xiaoya Wang ◽  
Yiqing Huang ◽  
Dongsheng Ji ◽  
Fredrick Omenya ◽  
Khim Karki ◽  
...  
Keyword(s):  
Thermal Stability ◽  
Energy Density ◽  
High Energy ◽  
High Energy Density ◽  
Structure Evolution ◽  
Li Ion Battery ◽  
Li Ion ◽  
Thermal Stability Of
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