Novel transient liquid phase bonding method using In-coated Cu sheet for high-temperature die attach
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2017 ◽
Vol 28
(11)
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pp. 7827-7833
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2021 ◽
Ag–Sn Transient Liquid Phase Bonding for High Temperature Electronic Packaging: Effect of Ag Content
2020 ◽
Vol 10
(10)
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pp. 1604-1610
2013 ◽
Vol 28
(5)
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pp. 2448-2456
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2017 ◽
Vol 37
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pp. 561-570
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2017 ◽
Vol 32
(1)
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pp. 441-451
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2010 ◽
Vol 33
(3)
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pp. 563-570
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Keyword(s):
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