Fabrication of Sn-plated Cu foam for high-efficiency transient-liquid-phase bonding

2022 ◽  
Vol 30 ◽  
pp. 103058
Author(s):  
Jiaxin Liu ◽  
Zhenyu Lei ◽  
Qing Wang ◽  
Yun Mou ◽  
Mingxiang Chen
Keyword(s):  
Liquid Phase ◽  
High Efficiency ◽  
Transient Liquid Phase ◽  
Transient Liquid Phase Bonding ◽  
Cu Foam

Transient liquid phase bonding of Cu and Al using metallic particles interlayers

2021 ◽  
pp. 095440542098823
Author(s):  
Alireza Zaheri ◽  
Mohammadreza Farahani ◽  
Alireza Sadeghi ◽  
Naser Souri
Keyword(s):  
Liquid Phase ◽  
Mechanical Test ◽  
Transient Liquid Phase ◽  
Transient Liquid Phase Bonding ◽  
Joint Interface ◽  
Test Results ◽  
X Ray Diffraction ◽  
X Ray ◽  
Metallic Particles ◽  
Powder Interlayer

The bonding strength, and microstructures of Cu and Al couples using metallic powders as interlayer during transient liquid phase bonding (TLP bonding) were investigated. The interfacial morphologies and microstructures were studied by scanning electron microscopy equipped with energy dispersive X-ray spectroscopy, and X-ray diffraction. First, to explore the optimum bonding time and temperature, nine samples were bonded without interlayers in a vacuum condition. Mechanical test results indicated that bonding at 560°C in 20 min returns the highest bond strength (84% of Al). This bonding condition was used to join ten samples with powder interlayers. Powders were prepared by mixing different combinations of Cu, Al (+Fe nanoparticles) and Zn. In the bonding zone, different Cu9Al4, CuAl, and CuAl2 intermetallic co-precipitate. The strongest bonding is formed in the sample with the 70Al (+Fe)-30Cu powder interlayer. Powder interlayers present thinner and more uniform intermetallic layers at the joint interface.

scholarly journals Simulation of Transient Liquid Phase Bonding Process and the Influence of Interlayer Thickness

2020 ◽  
Vol 923 ◽  
pp. 012006
Author(s):  
B. Benita ◽  
D.S. Samuvel Prem Kumar ◽  
R. Pravin ◽  
N.Samuel Dinesh Hynes ◽  
J.Angela Jennifa Sujana
Keyword(s):  
Liquid Phase ◽  
Transient Liquid Phase ◽  
Bonding Process ◽  
Transient Liquid Phase Bonding ◽  
Interlayer Thickness

scholarly journals Transient Liquid Phase Bonding of Semi-Solid Metal 7075 Aluminum Alloy using ZA27 Zinc Alloy Interlayer

Metals ◽  
2018 ◽  
Vol 8 (8) ◽  
pp. 637 ◽  
Author(s):  
Chaiyoot Meengam ◽  
Yongyuth Dunyakul ◽  
Dech Maunkhaw ◽  
Suppachai Chainarong
Keyword(s):  
Aluminum Alloy ◽  
Liquid Phase ◽  
Bonding Strength ◽  
Transient Liquid Phase ◽  
Solid Metal ◽  
Bonding Time ◽  
Zinc Alloy ◽  
Transient Liquid Phase Bonding ◽  
Bonding Zone ◽  
Semi Solid

Transient Liquid Phase Bonding (TLPB) process of semi-solid metal 7075 aluminum alloys (SSM7075) using 50 μm thick of ZA27 zinc alloys as interlayers for the experiment were carried out under bonding temperatures of 480 and 540 °C and bonding times of 30, 60, 90 and 120 min respectively. In the bonding zone, the semi-solid state of ZA27 zinc alloy interlayers were diffused into the SSM7075 aluminum alloy. Examination of the bonding zone using Scanning Electron Microscope (SEM) and Energy-dispersive X-ray spectroscopy (EDS) showed that the precipitation of the intermetallic compound of η(Zn–Al–Cu), β(Al2Mg3Zn3), T′(Zn10Al35Cu55) and MgZn2 were formed in the bonding zone. The better homogenized microstructure in the bonding zone was formed when increasing bonding time and bonding temperature. The highest bonding strength was recorded at 17.44 MPa and average hardness was at 87.67 HV with the bonding time of 120 min and temperature at 540 °C. Statistically, the coefficient of determination analysis of bonding strength data was at 99.1%.

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