Flat-band voltage shift of 4H-SiC MOS capacitors induced by interface dipole layer formation at the oxide-semiconductor and oxide-oxide interfaces

2021 ◽  
pp. 108115
Author(s):  
Tae-Hyeon Kil ◽  
Munetaka Noguchi ◽  
Hiroshi Watanabe ◽  
Koji Kita
2000 ◽  
Vol 621 ◽  
Author(s):  
Cheon-Hong Kim ◽  
Juhn-Suk Yoo ◽  
Kee-Chan Park ◽  
Min-Koo Han

ABSTRACTWe report the oxide charging effects on metal oxide semiconductor (MOS) structure caused by PH3/He ion shower doping. The parallel negative shift of flat-band voltage occurred for the ion-doped PETEOS samples even after thermal annealing. When the ion dose was higher, this shift was larger. These results show that a considerable amount of positive charges were induced inside the oxide films after PH3/He ion shower doping process. For the same ion dose, the flat-band voltage shift is larger when the thickness of PETEOS is thicker. When the ion dose was 1.5×1017cm−2 and the thickness of PETEOS was 80nm, the shift of flat-band voltage was larger than −7V. We can conclude that PH3/He ion shower doping process induces the positive charges, which result in the flat band voltage shift of MOS capacitors, in the bulk oxide films when oxide films are exposed to ion shower doping.


2005 ◽  
Vol 483-485 ◽  
pp. 705-708 ◽  
Author(s):  
Marc Avice ◽  
Ulrike Grossner ◽  
Edouard V. Monakhov ◽  
Joachim Grillenberger ◽  
Ola Nilsen ◽  
...  

In this study, electrical properties of Al2O3 deposited by Atomic Layer Deposition (ALCVD) on n-type 4H-SiC were investigated. Metal-Oxide-Semiconductor (MOS) capacitors were characterized by various electrical techniques such as Capacitance-Voltage (CV), Current- Voltage (IV) and Deep Level Transient Spectroscopy (DLTS) measurements. Two different oxidants, H2O and O3, have been used for the oxide deposition. After deposition, the flat-band voltage shift is much less using O3 than H2O (~ 7V versus ~ 20V). Annealing treatment has been carried out at different temperatures in Ar atmosphere up to 700°C. Whereas the flat-band voltage shift can be reduced by annealing, the leakage current remains rather high.


2020 ◽  
Vol 13 (11) ◽  
pp. 111006
Author(s):  
Li-Chuan Sun ◽  
Chih-Yang Lin ◽  
Po-Hsun Chen ◽  
Tsung-Ming Tsai ◽  
Kuan-Ju Zhou ◽  
...  

2017 ◽  
Vol 7 (1) ◽  
Author(s):  
Sung Heo ◽  
Hyoungsun Park ◽  
Dong-Su Ko ◽  
Yong Su Kim ◽  
Yong Koo Kyoung ◽  
...  

2017 ◽  
Vol 897 ◽  
pp. 167-170
Author(s):  
Hamid Amini Moghadam ◽  
Sima Dimitrijev ◽  
Ji Sheng Han ◽  
Daniel Haasmann

The existence of a turnaround in flat-band voltage shift of stressed MOS capacitors, fabricated on N-type 4H–SiC substrates, is reported in this paper. The turnaround is observed by room-temperature C–V measurements, after two minutes gate-bias stressing of the MOS capacitors at different temperatures. The existence of this turnaround effect demonstrates that a mechanism, in addition to the well-stablished tunneling to the near-interface oxide traps, is involved in the threshold voltage instability of 4H–SiC MOSFETs. This newly identified mechanism occurs due to charge redistribution of the compound polar species that exist in the SiO2–SiC transitional layer.


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