Two- and three-photon spectroscopy of ZnO under uniaxial stress

1998 ◽  
Vol 184-185 (1-2) ◽  
pp. 686-690 ◽  
Author(s):  
J Wrzesinski
Keyword(s):  
TAPPI Journal ◽  
2012 ◽  
Vol 11 (1) ◽  
pp. 61-66 ◽  
Author(s):  
DOEUNG D. CHOI ◽  
SERGIY A. LAVRYKOV ◽  
BANDARU V. RAMARAO

Delamination between layers occurs during the creasing and subsequent folding of paperboard. Delamination is necessary to provide some stiffness properties, but excessive or uncontrolled delamination can weaken the fold, and therefore needs to be controlled. An understanding of the mechanics of delamination is predicated upon the availability of reliable and properly calibrated simulation tools to predict experimental observations. This paper describes a finite element simulation of paper mechanics applied to the scoring and folding of multi-ply carton board. Our goal was to provide an understanding of the mechanics of these operations and the proper models of elastic and plastic behavior of the material that enable us to simulate the deformation and delamination behavior. Our material model accounted for plasticity and sheet anisotropy in the in-plane and z-direction (ZD) dimensions. We used different ZD stress-strain curves during loading and unloading. Material parameters for in-plane deformation were obtained by fitting uniaxial stress-strain data to Ramberg-Osgood plasticity models and the ZD deformation was modeled using a modified power law. Two-dimensional strain fields resulting from loading board typical of a scoring operation were calculated. The strain field was symmetric in the initial stages, but increasing deformation led to asymmetry and heterogeneity. These regions were precursors to delamination and failure. Delamination of the layers occurred in regions of significant shear strain and resulted primarily from the development of large plastic strains. The model predictions were confirmed by experimental observation of the local strain fields using visual microscopy and linear image strain analysis. The finite element model predicted sheet delamination matching the patterns and effects that were observed in experiments.


2021 ◽  
Vol 13 (10) ◽  
pp. 5675
Author(s):  
Josip Brnic ◽  
Marino Brcic ◽  
Sebastian Balos ◽  
Goran Vukelic ◽  
Sanjin Krscanski ◽  
...  

Knowledge of the properties and behavior of materials under certain working conditions is the basis for the selection of the proper material for the design of a new structure. This paper deals with experimental investigations of the mechanical properties of unalloyed high quality steel S235JRC + C (1.0122) and its behavior under conditions of high temperatures, creep and mechanical fatigue. The response of the material at high temperatures (20–700 °C) is shown in the form of engineering stress-strain diagrams while that at creep behavior (400–600 °C) is shown in the form of creep curves. Furthermore, based on uniaxial fully reversed mechanical fatigue tests (R=−1), a stress-life (S-N) fatigue diagram has been constructed and the fatigue (endurance) limit of the material is calculated The experimentally determined value of tensile strength at room temperature is 534 MPa. The calculated value of the fatigue limit, also at room temperature, using the modified staircase method and based on the mechanical fatigue tests data, is 202 MPa. With regard to creep resistance, steel 1.0122 can be considered creep-resistant only at a temperature of 400 °C and at an applied stress not exceeding 50% of the yield strength corresponding to this temperature.


1985 ◽  
Vol 56 (1) ◽  
pp. 125-130 ◽  
Author(s):  
D. P. Osterman ◽  
S. J. Williamson

Physica B+C ◽  
1983 ◽  
Vol 120 (1-3) ◽  
pp. 401-404 ◽  
Author(s):  
S. Kawarazaki ◽  
N. Kunitomi ◽  
R.M. Nicklow ◽  
H.G. Smith
Keyword(s):  

Author(s):  
N. A. Zontsika ◽  
A. Abdul-Latif ◽  
S. Ramtani

Motivated by the already developed micromechanical approach (Abdul-Latif et al., 2002, “Elasto-Inelastic Self-Consistent Model for Polycrystals,” ASME J. Appl. Mech., 69(3), pp. 309–316.), a new extension is proposed for describing the mechanical strength of ultrafine-grained (ufg) materials whose grain sizes, d, lie in the approximate range of 100 nm < d < 1000 nm as well as for the nanocrystalline (nc) materials characterized by d≤100 nm. In fact, the dislocation kinematics approach is considered for characterizing these materials where grain boundary is taken into account by a thermal diffusion concept. The used model deals with a soft nonincremental inclusion/matrix interaction law. The overall kinematic hardening effect is described naturally by the interaction law. Within the framework of small deformations hypothesis, the elastic part, assumed to be uniform and isotropic, is evaluated at the granular level. The heterogeneous inelastic part of deformation is locally determined. In addition, the intragranular isotropic hardening is modeled based on the interaction between the activated slip systems within the same grain. Affected by the grain size, the mechanical behavior of the ufg as well as the nc materials is fairly well described. This development is validated through several uniaxial stress–strain experimental results of copper and nickel.


Sign in / Sign up

Export Citation Format

Share Document