Direct observation of the behavior of grain boundaries during continuous dynamic recrystallization in an Al–4Mg–0.3Sc alloy

2003 ◽  
Vol 51 (15) ◽  
pp. 4367-4378 ◽  
Author(s):  
L.M. Dougherty ◽  
I.M. Robertson ◽  
J.S. Vetrano
Keyword(s):  
Dynamic Recrystallization ◽  
Grain Boundaries ◽  
Direct Observation ◽  
Continuous Dynamic Recrystallization ◽  
Continuous Dynamic

scholarly journals Flow modelling of Ti6Al4V under large strains

2020 ◽  
Vol 321 ◽  
pp. 12028
Author(s):  
HOGREFE Katharina ◽  
BUZOLIN Ricardo ◽  
POLETTI María Cecilia
Keyword(s):  
Flow Stress ◽  
Dynamic Recrystallization ◽  
Grain Boundaries ◽  
Large Strain ◽  
Microstructural Characterization ◽  
Internal Variables ◽  
Large Strains ◽  
Continuous Dynamic Recrystallization ◽  
Flow Modelling ◽  
Continuous Dynamic

This work uses flow stresses obtained experimentally at different strain rates and temperatures to validate flow modelling results. Flow curves of Ti6Al4V are measured via torsion experiments with a Gleeble® 3800 up to effective strains of 8. A physically based model that describes the evolutions of microstructure and the flow stress in the β-phase field was developed. A model of continuous dynamic recrystallization (CDRX) based on the work of Gourdet and Montheillet [1] for aluminium alloys is combined in this work with elements taken from Kocks and Mecking [2]. The model consists of a detailed description of the microstructure, based on different dislocation density populations and grain boundaries. All these internal variables evolve according to a production and a recovery term correlated mathematically with the temperature and the strain rate. The modelled output variables besides the flow stress are the total, the interior and the wall dislocation densities as well as the subgrain and grain sizes developed by continuous dynamic recrystallization. The model describes the softening occurring during large strain deformations, which is partly produced by the formation of new high angle grain boundaries (HAGB). The fraction of HAGB was used to determine the recrystallization grade, validated with microstructural characterization.

scholarly journals Microstructural evolution during high-temperature tensile creep at 1,500°C of a MoSiBTiC alloy

2020 ◽  
Vol 39 (1) ◽  
pp. 136-145 ◽  
Author(s):  
Sojiro Uemura ◽  
Shiho Yamamoto Kamata ◽  
Kyosuke Yoshimi ◽  
Sadahiro Tsurekawa
Keyword(s):  
Grain Size ◽  
Grain Boundaries ◽  
Microstructural Evolution ◽  
Grain Boundary Sliding ◽  
Primary Creep ◽  
Tensile Creep ◽  
Tertiary Creep ◽  
Continuous Dynamic Recrystallization ◽  
Continuous Dynamic ◽  
Creep Regime

AbstractMicrostructural evolution in the TiC-reinforced Mo–Si–B-based alloy during tensile creep deformation at 1,500°C and 137 MPa was investigated via scanning electron microscope-backscattered electron diffraction (SEM-EBSD) observations. The creep curve of this alloy displayed no clear steady state but was dominated by the tertiary creep regime. The grain size of the Moss phase increased in the primary creep regime. However, the grain size of the Moss phase was found to remarkably decrease to <10 µm with increasing creep strain in the tertiary creep regime. The EBSD observations revealed that the refinement of the Moss phase occurred by continuous dynamic recrystallization including the transformation of low-angle grain boundaries to high-angle grain boundaries. Accordingly, the deformation of this alloy is most likely to be governed by the grain boundary sliding and the rearrangement of Moss grains such as superplasticity in the tertiary creep regime. In addition, the refinement of the Moss grains surrounding large plate-like T2 grains caused the rotation of their surfaces parallel to the loading axis and consequently the cavitation preferentially occurred at the interphases between the end of the rotated T2 grains and the Moss grains.

Numerical Modeling of Continuous Dynamic Recrystallization in Sn-Based Solder Connection Under Cyclic Loading

2021 ◽  
Author(s):  
Marta Kuczynska ◽  
Ulrich Becker ◽  
Youssef Maniar ◽  
Steffen Weihe
Keyword(s):  
Grain Size ◽  
Dynamic Recrystallization ◽  
Cyclic Load ◽  
Fe Simulation ◽  
Operation Time ◽  
Inelastic Strain ◽  
Parameter Study ◽  
Continuous Dynamic Recrystallization ◽  
Gradual Evolution ◽  
Continuous Dynamic

Abstract The reoccurring cyclic load imposed onto soldered electronic components during their operation time leads to accumulation of inelastic strains in the structure. On a microscale level, the degree of plastic deformation is determined by the formation and annihilation of dislocations, leading to continuous refinement by creation of new grain boundaries, precipitates relocation and growth. This microstructure rearrangement, triggered by an increasing amount of inelastic deformation, is defined as dynamic recrystallization. This work presents a macroscale modelling approach for the description of continuous dynamic recrystallization observed in Sn-based solder connections. The model used in this work describes kinetics of macroscopic gradual evolution of equivalent grain size, where the initial grain size is continuously refined with increasing accumulated inelastic strain until a saturation grain size is reached. The rate and distribution of dynamic recrystallization is further numerically modelled dependent on the effective accumulated inelastic strain and governing stress multiaxiality. A parameter study of the presented model and its employment in finite element (FE) simulation is further described. Finally, FE simulation of the grain size evolution is demonstrated on an example of a bulky sample under isothermal cyclic mechanical loading, as well as a BGA-like structure under tensile, shear and mixed mode cyclic load.

scholarly journals In-situ characterization of continuous dynamic recrystallization during hot torsion of an Al–Si–Mg alloy

2020 ◽  
Vol 822 ◽  
pp. 153282 ◽  
Author(s):  
David Canelo-Yubero ◽  
Zsolt Kovács ◽  
J.F. Thierry Simonet Fotso ◽  
Domonkos Tolnai ◽  
Norbert Schell ◽  
...  
Keyword(s):  
Dynamic Recrystallization ◽  
Mg Alloy ◽  
In Situ Characterization ◽  
Continuous Dynamic Recrystallization ◽  
Hot Torsion ◽  
Continuous Dynamic

Modelling continuous dynamic recrystallization of aluminum alloys based on the polycrystal plasticity approach

2020 ◽  
Vol 131 ◽  
pp. 102710 ◽  
Author(s):  
S.F. Chen ◽  
D.Y. Li ◽  
S.H. Zhang ◽  
H.N. Han ◽  
H.W. Lee ◽  
...  
Keyword(s):  
Aluminum Alloys ◽  
Dynamic Recrystallization ◽  
Continuous Dynamic Recrystallization ◽  
Polycrystal Plasticity ◽  
Continuous Dynamic

scholarly journals Investigation on Sub-Solvus Recrystallization Mechanisms in an Advanced γ-γ’ Nickel-Based Superalloy GH4151

Materials ◽  
2020 ◽  
Vol 13 (20) ◽  
pp. 4553
Author(s):  
Shaomin Lv ◽  
Jinbin Chen ◽  
Xinbo He ◽  
Chonglin Jia ◽  
Kang Wei ◽  
...  
Keyword(s):  
Dynamic Recrystallization ◽  
Hot Deformation ◽  
Energy Surface ◽  
Electron Backscatter Diffraction ◽  
True Strain ◽  
Continuous Dynamic Recrystallization ◽  
Nickel Based Superalloy ◽  
Transmission Electron ◽  
Continuous Dynamic ◽  
Backscatter Diffraction

Sub-solvus dynamic recrystallization (DRX) mechanisms in an advanced γ-γ’ nickel-based superalloy GH4151 were investigated by isothermal compression experiments at 1040 °C with a strain rate of 0.1 s−1 and various true strain of 0.1, 0.3, 0.5, and 0.7, respectively. This has not been reported in literature before. The electron backscatter diffraction (EBSD) and transmission electron microscope (TEM) technology were used for the observation of microstructure evolution and the confirmation of DRX mechanisms. The results indicate that a new dynamic recrystallization mechanism occurs during hot deformation of the hot-extruded GH4151 alloy. The nucleation mechanism can be described as such a feature, that is a primary γ’ (Ni3(Al, Ti, Nb)) precipitate embedded in a recrystallized grain existed the same crystallographic orientation, which is defined as heteroepitaxial dynamic recrystallization (HDRX). Meanwhile, the conventional DRX mechanisms, such as the discontinuous dynamic recrystallization (DDRX) characterized by bulging grain boundary and continuous dynamic recrystallization (CDRX) operated through progressive sub-grain merging and rotation, also take place during the hot deformation of the hot-extruded GH4151 alloy. In addition, the step-shaped structures can be observed at grain boundaries, which ensure the low-energy surface state during the DRX process.

Hot Compression Deformation Behavior of Mg-Gd-Y-Zn-Zr Alloy

2014 ◽  
Vol 680 ◽  
pp. 15-22 ◽  
Author(s):  
Guang Lu ◽  
Zhi Ping Xie ◽  
Zhi Min Zhang ◽  
Yong Biao Yang ◽  
Bao Cheng Li
Keyword(s):  
Flow Stress ◽  
Magnesium Alloy ◽  
Dynamic Recrystallization ◽  
Strain Rate ◽  
Great Influence ◽  
Peak Stress ◽  
Maximum Error ◽  
Continuous Dynamic Recrystallization ◽  
Stress Behaviors ◽  
Continuous Dynamic

The deformation behaviors of as-cast Mg-11Gd-2Y-Zn-Zr magnesium alloy were investigated by compression test with Gleeble-1500 thermal simulator at temperature of 623-753K and strain rate of 0.01-0.5 s-1. The flow stress behaviors of the magnesium alloy were carried out at a strain of 0.7. The strain rate and deformation temperature had great influence on the flow stress behaviors. The flow stress increases with increasing strain rate and decreasing temperature. The flow stress has more than one peak stress at a strain rate of 0.5s-1showing continuous dynamic recrystallization (DRX) mechanism, while other flow stresses exhibited only one peak stress indicating discontinuous dynamic recrystallization (DDRX) mechanism. It was also found that the flow stress behavior could be described by the hyperbolic sine constitutive equation, in which the determined average activation energy is 273.426 kJ·mol-1. The maximum error value between calculated value and experimental value is 5.5%. The deformation map was also established, and the best parameter for hot working was found to be 0.1s-1/753k approximately.

Sign in / Sign up

Export Citation Format

Share Document