Self-healing and stretchable conductor based on embedded liquid metal patterns within imprintable dynamic covalent elastomer

2022 ◽  
Author(s):  
Xiaoliang Chen ◽  
Peng Sun ◽  
Hongmiao Tian ◽  
Xiangming Li ◽  
Chunhui Wang ◽  
...  
Keyword(s):  
Liquid Metal ◽  
Electronic Devices ◽  
Electronic Systems ◽  
Self Healing ◽  
Next Generation ◽  
Critical Elements ◽  
Stretchable Conductors ◽  
Stretchable Conductor

Flexible and stretchable conductors are critical elements for constructing soft electronic systems and have recently attracted tremendous attention. Next generation electronic devices call for self-healing conductors that can mimic the...

scholarly journals A mechanically and electrically self-healing graphite composite dough for stencil-printable stretchable conductors

2016 ◽  
Vol 4 (19) ◽  
pp. 4150-4154 ◽  
Author(s):  
Tongfei Wu ◽  
Biqiong Chen
Keyword(s):  
Self Healing ◽  
Ambient Conditions ◽  
Graphite Composite ◽  
Stretchable Conductors ◽  
Highly Stretchable ◽  
Stretchable Conductor

A graphite composite dough exhibited rapid mechanically and electrically self-healing properties under ambient conditions and showed potential for highly stretchable conductor applications.

A reversible and highly conductive adhesive: towards self-healing and recyclable flexible electronics

2020 ◽  
Vol 8 (23) ◽  
pp. 7772-7785 ◽  
Author(s):  
Qiming Yan ◽  
Meng Zhou ◽  
Heqing Fu
Keyword(s):  
Flexible Electronics ◽  
Electronic Devices ◽  
Conductive Adhesive ◽  
Self Healing ◽  
Next Generation ◽  
Conductive Adhesives ◽  
Flexible Electronic ◽  
Flexible Electronic Devices

Flexible conductive adhesives are important materials for the next generation of flexible electronic devices.

Smart Passivation Materials with a Microencapsulated Liquid Metal for Self-Healing Conductors in Sustainable Electronic Devices

2018 ◽  
Vol 2018 (1) ◽  
pp. 000293-000297
Author(s):  
Kunmo Chu ◽  
Byong Gwon Song ◽  
Yongsung Kim ◽  
Chang Seung Lee
Keyword(s):  
Liquid Metal ◽  
Electronic Packaging ◽  
Electronic Devices ◽  
Passivation Layer ◽  
Self Healing ◽  
Mechanical Stimuli ◽  
Electric Circuits

Abstract Passivation and self-healing of electric circuits are of importance in the area of electronic packaging for improving durability of devices. In particular, flexible or stretchable devices are vulnerable to mechanical stimuli, such as cutting, piercing, scratching, and pressing. The damage to a circuit results in the breakdown of devices. Therefore, a passivation layer has been essential to preserve the soft circuits and provide self-healing of the electrical pathways after they are damaged.

Materials and structural designs of stretchable conductors

2019 ◽  
Vol 48 (11) ◽  
pp. 2946-2966 ◽  
Author(s):  
Naoji Matsuhisa ◽  
Xiaodong Chen ◽  
Zhenan Bao ◽  
Takao Someya
Keyword(s):  
Electronic Devices ◽  
Soft Robotics ◽  
Next Generation ◽  
Materials Engineering ◽  
Stretchable Conductors

Stretchable conductors developed through structural and materials engineering are contributing to the realization of next-generation soft electronic devices for healthcare and soft-robotics.

Thermal challenges in next generation electronic systems - summary of panel presentations and discussions

2002 ◽  
Vol 25 (4) ◽  
pp. 569-575 ◽  
Author(s):  
S.V. Garimella ◽  
Y.K. Joshi ◽  
A. Bar-Cohen ◽  
R. Mahajan ◽  
K.C. Toh ◽  
...  
Keyword(s):  
Electronic Systems ◽  
Next Generation

Make It Stereoscopic: Interfacial Design for Full-Temperature Adaptive Flexible Zinc-Air Batteries

2021 ◽  
Author(s):  
Zengxia Pei ◽  
Luyao Ding ◽  
Cheng Wang ◽  
Qiangqiang Meng ◽  
Ziwen Yuan ◽  
...  
Keyword(s):  
Electronic Devices ◽  
Power Source ◽  
Next Generation ◽  
Full Temperature ◽  
Temperature Adaptability ◽  
Zinc Air Batteries

Flexible zinc-air batteries (ZABs) have been scrutinized as a type of promising flexible power source for next-generation electronic devices, but the batteries’ temperature adaptability has been a major hurdle due...

An ultra-low hysteresis, self-healing and stretchable conductor based on dynamic disulfide covalent adaptable networks

2022 ◽  
Author(s):  
weibo kong ◽  
Yunyun Yang ◽  
Yanjun Wang ◽  
Hongfei Cheng ◽  
Peiyao Yan ◽  
...  
Keyword(s):  
Mechanical Properties ◽  
Health Monitoring ◽  
Self Healing ◽  
Soft Robots ◽  
Stretchable Conductor

Stretchable self-healing conductors can autonomously restore their electrical and mechanical properties after experiencing damage, thus being valuable in the application of prostheses, soft robots, and health monitoring. Currently, most reported...

Convective Cooling of Compact Electronic Devices via Liquid Metals with Low Melting Points

2021 ◽  
Author(s):  
Guilin Liu ◽  
Jing Liu
Keyword(s):  
Heat Transfer ◽  
Melting Point ◽  
Liquid Metal ◽  
High Performance ◽  
Flow Resistance ◽  
Heat Dissipation ◽  
Liquid Metals ◽  
Electronic Devices ◽  
Convective Cooling ◽  
Heat Exchanger Design

Abstract The increasingly high power density of today's electronic devices requires the cooling techniques to produce highly effective heat dissipation performance with as little sacrifice as possible to the system compactness. Among the currently available thermal management schemes, the convective liquid metal cooling provides considerably high performance due to their unique thermal properties. This paper firstly reviews the studies on convective cooling using low-melting-point metals published in the past few decades. A group of equations for the thermophysical properties of In-Ga-Sn eutectic alloy is then documented by rigorous literature examination, following by a section of correlations for the heat transfer and flow resistance calculation to partially facilitate the designing work at the current stage. The urgent need to investigate the heat transfer and flow resistance of forced convection of low-melting-point metals in small/mini-channels, typical in compact electronic devices, is carefully argued. Some special aspects pertaining to the practical application of this cooling technique, including the entrance effect, mixed convection, and compact liquid metal heat exchanger design, are also discussed. Finally, future challenges and prospects are outlined.

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