Barrier layer at metal-ceramic interface in ferroelectric MIM structures

1993 ◽  
Vol 3 (8) ◽  
pp. 1617-1623
Author(s):  
P. Gaucher ◽  
J. Hector ◽  
J. P. Ganne
Keyword(s):  
Barrier Layer ◽  
Metal Ceramic

Deposited emulsion particles in the pores of aluminum oxide film

1978 ◽  
Vol 36 (1) ◽  
pp. 450-451
Author(s):  
Michio Ashida ◽  
Yasukiyo Ueda
Keyword(s):  
Oxide Film ◽  
Acid Solution ◽  
Barrier Layer ◽  
Colloidal Particles ◽  
Oxalic Acid Solution ◽  
Anodic Oxide ◽  
Anodic Oxide Film ◽  
Carbon Replica ◽  
Sectioning Method ◽  
Thin Sectioning

An anodic oxide film is formed on aluminum in an acidic elecrolyte during anodizing. The structure of the oxide film was observed directly by carbon replica method(l) and ultra-thin sectioning method(2). The oxide film consists of barrier layer and porous layer constructed with fine hexagonal cellular structure. The diameter of micro pores and the thickness of barrier layer depend on the applying voltage and electrolyte. Because the dimension of the pore corresponds to that of colloidal particles, many metals deposit in the pores. When the oxide film is treated as anode in emulsion of polyelectrolyte, the emulsion particles migrate onto the film and deposit on it. We investigated the behavior of the emulsion particles during electrodeposition.Aluminum foils (99.3%) were anodized in either 0.25M oxalic acid solution at 30°C or 3M sulfuric acid solution at 20°C. After washing with distilled water, the oxide films used as anode were coated with emulsion particles by applying voltage of 200V and then they were cured at 190°C for 30 minutes.

Analytical and High-Resolution EM Study of Crystalline Phases formed at Metal-Ceramic Interface

1990 ◽  
Vol 48 (2) ◽  
pp. 426-427
Author(s):  
N. Merk ◽  
A. P. Tomsia ◽  
G. Thomas
Keyword(s):  
Cross Section ◽  
Dissimilar Materials ◽  
Ceramic Materials ◽  
Electron Micrograph ◽  
Scanning Electron Micrograph ◽  
Structural Applications ◽  
Metal Ceramic ◽  
The Subject ◽  
Ceramic Compounds ◽  
Scanning Electron

A recent development of new ceramic materials for structural applications involves the joining of ceramic compounds to metals. Due to the wetting problem, an interlayer material (brazing alloy) is generally used to achieve the bonding. The nature of the interfaces between such dissimilar materials is the subject of intensive studies and is of utmost importance to obtain a controlled microstructure at the discontinuities to satisfy the demanding properties for engineering applications . The brazing alloy is generally ductile and hence, does not readily fracture. It must also wett the ceramic with similar thermal expansion coefficient to avoid large stresses at joints. In the present work we study mullite-molybdenum composites using a brazing alloy for the weldment.A scanning electron micrograph from the cross section of the joining sequence studied here is presented in Fig. 1.

A 10-year follow-up study of fixed metal ceramic prosthodontics

1997 ◽  
Vol 24 (10) ◽  
pp. 713-717 ◽  
Author(s):  
R. NAPANKANGAS ◽  
M.A.M. SALONEN ◽  
A.M. RAUSTIA
Keyword(s):  
Follow Up Study ◽  
Metal Ceramic

Metal-ceramic nanocomposites designed for thermomechanical robustness

2020 ◽  
Author(s):  
Zhao Wang ◽  
Kevin Schmalbach ◽  
David Poerschke ◽  
R Lee Penn ◽  
Nathan Mara ◽  
...  
Keyword(s):  
Metal Ceramic ◽  
Ceramic Nanocomposites

A New Computational Interface for Catalysis

2019 ◽  
Author(s):  
Pavlo Kravchenko ◽  
Craig Plaisance ◽  
David Hibbitts
Keyword(s):  
Zeolite Catalyst ◽  
Metal Ceramic ◽  
Catalyst Systems ◽  
Computational Catalysis

This manuscript outlines the utility and power of our computational catalysis interface. This interface has been developed by our group and used extensively to study metal, ceramic, and zeolite catalyst systems.

THEORETICAL GROUNDS FOR FORMATION OF HIGH QUALITY METAL-CERAMIC COATINGS BY CARBOVIBRATING ELECTRODE ARC STRENGTHENING

2020 ◽  
pp. 2-11
Author(s):  
N. V. TITOV ◽  
◽  
A. V. KOLOMEYCHENKO ◽  
V. L. BASINYUK ◽  
I. N. KRAVCHENKO ◽  
...  
Keyword(s):  
Ceramic Coatings ◽  
High Quality ◽  
Metal Ceramic ◽  
Quality Metal

Amorphous Films at Metal/Ceramic Interfaces

2003 ◽  
Vol 94 (3) ◽  
pp. 272-276 ◽  
Author(s):  
Amir Avishai ◽  
Christina Scheu ◽  
Wayne D. Kaplan
Keyword(s):  
Amorphous Films ◽  
Metal Ceramic ◽  
Ceramic Interfaces

The Effect of Ball Pad Metallurgy and Ball Composition on Solder Ball Integrity of Plastic Ball Grid Array Packages

1998 ◽  
Author(s):  
C.H. Zhong ◽  
Sung Yi
Keyword(s):  
Failure Mode ◽  
Barrier Layer ◽  
Shear Force ◽  
Solder Ball ◽  
Ball Grid Array ◽  
Reliability Test ◽  
Shear Forces ◽  
Ball Shear ◽  
Plastic Ball ◽  
Plastic Ball Grid Array

Abstract Ball shear forces of plastic ball grid array (PBGA) packages are found to decrease after reliability test. Packages with different ball pad metallurgy form different intermetallic compounds (IMC) thus ball shear forces and failure modes are different. The characteristic and dynamic process of IMC formed are decided by ball pad metallurgy which includes Ni barrier layer and Au layer thickness. Solder ball composition also affects IMC formation dynamic process. There is basically no difference in ball shear force and failure mode for packages with different under ball pad metallurgy before reliability test. However shear force decreased and failure mode changed after reliability test, especially when packages exposed to high temperature. Major difference in ball shear force and failure mode was found for ball pad metallurgy of Ni barrier layer including Ni-P, pure Ni and Ni-Co. Solder ball composition was found to affect the IMC formation rate.

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