STRESS RELAXATION IN SOLIDS

1987 ◽  
Vol 48 (C8) ◽  
pp. C8-3-C8-13 ◽  
Author(s):  
J. KUBÁT ◽  
M. RIGDAHL
Keyword(s):  
Stress Relaxation

Stress Relaxation and the Formation of Silicides in the Process of the Crystallization of NI-NB Films on SI

1991 ◽  
Vol 49 ◽  
pp. 898-899
Author(s):  
N. Rozhanski ◽  
V. Lifshitz
Keyword(s):  
Thin Films ◽  
Stress Relaxation ◽  
Integrated Circuits ◽  
Direct Evidence ◽  
Alloy Film ◽  
Diffusion Barriers ◽  
Effective Barrier

Thin films of amorphous Ni-Nb alloys are of interest since they can be used as diffusion barriers for integrated circuits on Si. A native SiO2 layer is an effective barrier for Ni diffusion but it deformation during the crystallization of the alloy film lead to the appearence of diffusion fluxes through it and the following formation of silicides. This study concerns the direct evidence of the action of stresses in the process of the crystallization of Ni-Nb films on Si and the structure of forming NiSi2 islands.

Comparative study of the effective parameters on residual stress relaxation in welded aluminum plates under cyclic loading

2020 ◽  
Vol 21 (5) ◽  
pp. 505
Author(s):  
Yousef Ghaderi Dehkordi ◽  
Ali Pourkamali Anaraki ◽  
Amir Reza Shahani
Keyword(s):  
Residual Stress ◽  
Cyclic Loading ◽  
Stress Relaxation ◽  
Stress Amplitude ◽  
Cyclic Plasticity ◽  
Mean Stress ◽  
Effective Parameters ◽  
Perfect Plasticity ◽  
Residual Stress Relaxation ◽  
Aluminum Plates

The prediction of residual stress relaxation is essential to assess the safety of welded components. This paper aims to study the influence of various effective parameters on residual stress relaxation under cyclic loading. In this regard, a 3D finite element modeling is performed to determine the residual stress in welded aluminum plates. The accuracy of this analysis is verified through experiment. To study the plasticity effect on stress relaxation, two plasticity models are implemented: perfect plasticity and combined isotropic-kinematic hardening. Hence, cyclic plasticity characterization of the material is specified by low cycle fatigue tests. It is found that the perfect plasticity leads to greater stress relaxation. In order to propose an accurate model to compute the residual stress relaxation, the Taguchi L18 array with four 3-level factors and one 6-level is employed. Using statistical analysis, the order of factors based on their effect on stress relaxation is determined as mean stress, stress amplitude, initial residual stress, and number of cycles. In addition, the stress relaxation increases with an increase in mean stress and stress amplitude.

WIELAND-K88

Alloy Digest ◽  
2005 ◽  
Vol 54 (12) ◽  
Keyword(s):  
Thermal Conductivity ◽  
Corrosion Resistance ◽  
High Temperature ◽  
Stress Relaxation ◽  
Copper Alloy ◽  
Elevated Temperatures ◽  
Heat Treating ◽  
Relaxation Resistance ◽  
Temperature Performance ◽  
Very High

Abstract Wieland K-88 is a copper alloy with very high electrical and thermal conductivity, good strength, and excellent stress relaxation resistance at elevated temperatures. This datasheet provides information on composition, physical properties, hardness, elasticity, and tensile properties. It also includes information on high temperature performance and corrosion resistance as well as forming, heat treating, machining, joining, and surface treatment. Filing Code: CU-738. Producer or source: Wieland Metals Inc.

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