Reliability and safety estimates for fusion reactor liquid metal cooling system

1994 ◽  
Vol 2 (3-4) ◽  
pp. 311-317
Author(s):  
P. Chaika ◽  
V. Danilin ◽  
I. Kirillov ◽  
V. Osipov
Keyword(s):  
Liquid Metal ◽  
Fusion Reactor ◽  
Cooling System ◽  
Liquid Metal Cooling

Special Features of First-Wall Heat Transfer in Liquid-Metal Fusion Reactor Blankets

1987 ◽  
Vol 12 (1) ◽  
pp. 104-113 ◽  
Author(s):  
K. Taghavi ◽  
M. S. Tillack ◽  
H. Madarame
Keyword(s):  
Heat Transfer ◽  
Liquid Metal ◽  
Fusion Reactor ◽  
Wall Heat Transfer ◽  
First Wall

Heat dissipation system based on electromagnetic driven rotational flow of liquid metal coolant

2021 ◽  
pp. 1-14
Author(s):  
Lei Wang ◽  
Xudong Zhang ◽  
Dr. Jing Liu ◽  
Yixin Zhou
Keyword(s):  
Liquid Metal ◽  
Thermal Resistance ◽  
Heat Dissipation ◽  
High Efficiency ◽  
Cooling System ◽  
Electric Heater ◽  
Power Relationship ◽  
Rotational Flow ◽  
Large Power ◽  
Dissipation System

Abstract Liquid metal owns the highest thermal conductivity among all the currently available fluid materials. This property enables it to be a powerful coolant for the thermal management of large power device or high flux chip. In this paper, a high-efficiency heat dissipation system based on the electromagnetic driven rotational flow of liquid metal was demonstrated. The velocity distribution of the liquid metal was theoretically analyzed and numerically simulated. The results showed that the velocity was distributed unevenly along longitudinal section and the maximum velocity appears near the anode. On the temperature distribution profile of the heat dissipation system, the temperature on the electric heater side was much higher than the other regions and the role of the rotated liquid metal was to homogenize the temperature of the system. In addition, the thermal resistance model of the experimental device was established, and several relationships such as thermal resistance-power curve were experimentally measured. The heating power could be determined from the temperature-power relationship graph once the maximum control temperature was given. The heat dissipation method introduced in the paper provides a novel way for fabricating compact chip cooling system.

Recent Advancement on Liquid Metal Cooling for Thermal Management of Computer Chip

2010 ◽  
Author(s):  
Jing Liu ◽  
Yue-Guang Deng ◽  
Zhong-Shan Deng
Keyword(s):  
Liquid Metal ◽  
Thermal Management ◽  
New Technology ◽  
Air Cooling ◽  
Liquid Metal Coolant ◽  
Cooling Device ◽  
Chip Cooling ◽  
Cooling Method ◽  
Liquid Metal Cooling ◽  
Metal Coolant

Efficient cooling of a high performance computer chip has been an extremely important however becoming more and more tough issue. The recently invented liquid metal cooling method is expected to pave the way for high flux heat dissipation which is hard to tackle otherwise by many existing conventional cooling strategies. However, as a new thermal management method, its application also raised quite a few challenging fundamental and practical issues for solving. To illustrate the development of the new technology, this talk is dedicated to present an overview on the latest advancements made in the author’s lab in developing the new generation chip cooling device based on the liquid metal coolant with melting point around room temperature. The designing and optimization of the cooling device and component will be discussed. Several major barriers to prevent the new method from practical application such as erosion between liquid metal coolant and its substrate material will be outlined with good solutions clarified. Performance comparison between the new chip cooling method with commercially available products with highest quality such as air cooling, water cooling and heat pipe cooling devices were evaluated. Typical examples of using liquid metal cooling for the thermal management of a real PC or even super computer will be demonstrated. Further, miniaturizations on the prototype device by extending it as a MEMS cooling device or mini/micro channel liquid metal cooling device will also be explained. Along with the development of the hardware, some fundamental heat transfer issues in characterizing the liquid metal cooling device will be discussed through numerical or analytical model. Future challenging issues in pushing the new technology into large scale practices will be raised. From all the outputs obtained so far, it can be clearly seen that the new cooling strategy will find very promising and significant applications in a wide variety of engineering situations whenever thermal managements or heat transport are needed.

Liquid metal cooling issues for fusion and fission

2008 ◽  
Vol 83 (7-9) ◽  
pp. 943-947 ◽  
Author(s):  
H. Horiike ◽  
S. Konishi ◽  
H. Kondo ◽  
A. Yamaguchi
Keyword(s):  
Liquid Metal ◽  
Liquid Metal Cooling

Analysis of Thin Film Liquid Metal Protection of Fusion Reactor Limtter/Divertor Surfaces

1991 ◽  
Vol 19 (3P2B) ◽  
pp. 1765-1771 ◽  
Author(s):  
Neil B. Morley ◽  
Mark S. Tillack ◽  
Mohamed A. Abdou
Keyword(s):  
Thin Film ◽  
Liquid Metal ◽  
Fusion Reactor ◽  
Metal Protection

The applications of Cu substrate in liquid metal cooling systems

2018 ◽  
Vol 227 ◽  
pp. 116-119 ◽  
Author(s):  
Tomasz Gancarz ◽  
Katarzyna Berent
Keyword(s):  
Liquid Metal ◽  
Cooling Systems ◽  
Cu Substrate ◽  
Liquid Metal Cooling

scholarly journals Multi-scale simulation of single crystal hollow turbine blade manufactured by liquid metal cooling process

2018 ◽  
Vol 28 (1) ◽  
pp. 78-84 ◽  
Author(s):  
Xuewei Yan ◽  
Hang Zhang ◽  
Ning Tang ◽  
Changbo Sun ◽  
Qingyan Xu ◽  
...  
Keyword(s):  
Liquid Metal ◽  
Single Crystal ◽  
Turbine Blade ◽  
Cooling Process ◽  
Multi Scale ◽  
Hollow Turbine Blade ◽  
Liquid Metal Cooling
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