A reliable and environmentally friendly packaging technology-flip-chip joining using anisotropically conductive adhesive

1999 ◽  
Vol 22 (2) ◽  
pp. 186-190 ◽  
Author(s):  
J. Liu ◽  
A. Tolvgard ◽  
J. Malmodin ◽  
Z. Lai
2010 ◽  
Vol 2010 (1) ◽  
pp. 000548-000553
Author(s):  
Zhaozhi Li ◽  
Brian J. Lewis ◽  
Paul N. Houston ◽  
Daniel F. Baldwin ◽  
Eugene A. Stout ◽  
...  

Three Dimensional (3D) Packaging has become an industry obsession as the market demand continues to grow toward higher packaging densities and smaller form factor. In the meanwhile, the 3D die-to-wafer (D2W) packaging structure is gaining popularity due to its high manufacturing throughput and low cost per package. In this paper, the development of the assembly process for a 3D die-to-wafer packaging technology, that leverages the wafer level assembly technique and flip chip process, is introduced. Research efforts were focused on the high-density flip chip wafer level assembly techniques, as well as the challenges, innovations and solutions associated with this type of 3D packaging technology. Processing challenges and innovations addressed include flip chip fluxing methods for very fine-pitch and small bump sizes; wafer level flip chip assembly program creation and yield improvements; and set up of the Pb-free reflow profile for the assembled wafer. 100% yield was achieved on the test vehicle wafer that has totally 1,876 flip chip dies assembled on it. This work has demonstrated that the flip chip 3D die-to-wafer packaging architecture can be processed with robust yield and high manufacturing throughput, and thus to be a cost effective, rapid time to market alternative to emerging 3D wafer level integration methodologies.


Author(s):  
Muthiah Venkateswaran ◽  
Peter Borgesen ◽  
K. Srihari

Electrically conductive adhesives are emerging as a lead free, flux less, low temperature alternative to soldering in a variety of electronics and optoelectronics applications. Some of the potential benefits are obvious, but so far the adhesives have some limitations as well. The present work offers a critical evaluation of one approach to flip chip assembly, which lends itself particularly well to use with a high speed placement machine. Wafers were bumped by stencil printing of a thermoset conductive adhesive, which was then fully cured. In assembly, the conductive adhesive paste was stencil printed onto the pads of a printed circuit board and cured after die placement. The printing process was optimized to ensure robust assembly and the resulting reliability assessed.


2016 ◽  
Vol 168 ◽  
pp. 1763-1766 ◽  
Author(s):  
Laura Frisk ◽  
Sanna Lahokallio ◽  
Milad Mostofizadeh ◽  
Anniina Parviainen ◽  
Janne Kiilunen

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