A reliable and environmentally friendly packaging technology-flip-chip joining using anisotropically conductive adhesive
1999 ◽
Vol 22
(2)
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pp. 186-190
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Keyword(s):
Keyword(s):
2006 ◽
Vol 29
(3)
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pp. 551-559
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2004 ◽
Vol 27
(1)
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pp. 161-166
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Keyword(s):
1996 ◽
Vol 19
(3)
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pp. 644-660
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Keyword(s):