Overview of conductive adhesive joining technology in electronics packaging applications

2002 ◽  
Author(s):  
J. Liu ◽  
Z. Lai ◽  
H. Kristiansen ◽  
C. Khoo
Keyword(s):  
Electronics Packaging ◽  
Conductive Adhesive ◽  
Joining Technology

Coalescence Characteristics of Fusible Particles in Solderable Isotropic Conductive Adhesives (ICAs)

2008 ◽  
Vol 580-582 ◽  
pp. 213-216
Author(s):  
Seong Hyuk Lee ◽  
Jung Hee Lee ◽  
Jin Woon Lee ◽  
Jong Min Kim
Keyword(s):  
Numerical Analysis ◽  
Numerical Method ◽  
Volume Fraction ◽  
Conductive Adhesive ◽  
Conductive Adhesives ◽  
Joining Technology ◽  
Isotropic Conductive Adhesives

A new hybrid soldering and conductive adhesive joining technology using a fusible lowmelting- point alloy (LMPA) have been developed. A numerical method for numerical analysis of fusible particles behavior is proposed to investigate coalescence characteristics of fusible particles in solderable isotropic conductive adhesives (ICAs). For finding out suitable conditions to obtain reliable conduction paths, the present study examines the influence of process-related parameters such as volume fraction and viscosity on coalescence characteristics of fusible particles.

A Novel Anisotropic Conductive Adhesive for Lead-Free Surface Mount Electronics Packaging

2005 ◽  
Author(s):  
S. Manian Ramkumar ◽  
Krishnaswami Srihari
Keyword(s):  
Surface Area ◽  
Electronics Packaging ◽  
Conductive Adhesive ◽  
Lead Free ◽  
The Novel ◽  
Small Surface ◽  
Surface Mount ◽  
Anisotropic Conductive Adhesive ◽  
Fine Pitch ◽  
Very High

The electronics industry, in recent years, has been focusing primarily on product miniaturization and lead-free assembly. The need for product miniaturization is due to the continuous demand for portable electronic products that are multifunctional, yet smaller, faster, cheaper, and lighter. This is forcing the industry to design and assemble products with miniature passive and active devices. These devices typically have fine pitch footprints that provide a very small surface area for attachment. The solder attach technique relies primarily on the formation of intermetallics between the mating metallic surfaces. With a reduction in the surface area of the pads, the ratio of intermetallic to solder is very high once the solder joint is formed. This could result in unreliable solder joints, due to the brittle nature of intermetallics. In addition, the need to eliminate lead-based materials as a means of interconnection has renewed the industry’s interest in exploring other means of assembling surface mount devices reliably. This paper discusses the performance characteristics and preliminary research findings pertaining to a novel Anisotropic Conductive Adhesive (ACA) for electronics packaging applications, utilizing the Z Bond™ technology from Nexaura Systems, LLC. Typically, ACAs require the application of pressure during the curing process, to establish the electrical connection. The novel ACA uses a magnetic field to align the particles in the Z-axis direction and eliminates the need for pressure during curing. The formation of conductive columns within the polymer matrix provides a very high insulation resistance between adjacent conductors. The novel ACA also enables mass curing of the adhesive, eliminating the need for sequential assembly. The novel ACA’s I-V characteristics and performance under thermal and temperature-humidity aging are discussed in detail.

Benefits of Thermoplastic Conductive Adhesive in Advanced Electronics Packaging Applications

1997 ◽  
Vol 14 (2) ◽  
pp. 16-21
Author(s):  
M.G. Firmstone ◽  
P.M. Bartholomew ◽  
G. Paterson ◽  
R. Dietz ◽  
P. Robinson
Keyword(s):  
Electronics Packaging ◽  
Conductive Adhesive
Sign in / Sign up

Export Citation Format

Share Document