Stencil Printing Technology for Wafer Level Bumping at sub-100-Micron Pitch Using Pb-Free Alloys

2005 ◽  
Author(s):  
R.W. Kay ◽  
E. de Gourcuff ◽  
M.P.Y. Desmulliez ◽  
G.J. Jackson ◽  
H.A.H. Steen ◽  
...  
Keyword(s):  
Wafer Level ◽  
Printing Technology ◽  
Stencil Printing

Statistical analysis of stencil technology for wafer-level bumping

2014 ◽  
Vol 26 (2) ◽  
pp. 71-78
Author(s):  
Robert W. Kay ◽  
Gerard Cummins ◽  
Thomas Krebs ◽  
Richard Lathrop ◽  
Eitan Abraham ◽  
...  
Keyword(s):  
Statistical Analysis ◽  
Design Guidelines ◽  
Solder Paste ◽  
Wafer Level ◽  
Stencil Printing ◽  
Content Type ◽  
Bump Height ◽  
Box Plots ◽  
The Impact ◽  
Insight Into

Purpose – Wafer-level stencil printing of a type-6 Pb-free SAC solder paste was statistically evaluated at 200 and 150 μm pitch using three different stencil manufacturing technologies: laser cutting, DC electroforming and micro-engineered electroforming. This investigation looks at stencil differences in printability, pitch resolution, maximum achievable bump height, print co-planarity, paste release efficiency, and cleaning frequency. The paper aims to discuss these issues. Design/methodology/approach – In this paper, the authors present a statistical evaluation of the impact of stencil technology on type-6 tin-silver-copper paste printing. The authors concentrate on performances at 200 and 150 μm pitch of full array patterns. Key evaluated criteria include achievable reflowed bump heights, deposit co-planarity, paste release efficiency, and frequency of stencil cleaning. Box plots were used to graphically view print performance over a range of aperture sizes for the three stencil types. Findings – Fabrication technologies significantly affect print performance where the micro-engineered electroformed stencil produced the highest bump deposits and the lowest bump height deviation. Second in performance was the conventional electroformed, followed by the laser-cut stencil. Comparisons between the first and fifth consecutive print demonstrated no need for stencil cleaning in the case for the micro-engineered stencil for all but the smallest spacings between apertures. High paste transfer efficiencies, i.e. above 85 per cent, were achieved with the micro-engineered stencil using low aperture area ratios of 0.5. Originality/value – Stencil technology influences the maximum reflowed solder bump heights achievable, and bump co-planarity. To date, no statistical analysis comparing the impact of stencil technology for wafer-level bumping has been carried out for pitches of 200 μm and below. This paper gives new insight into how stencil technology impacts the print performance for fine pitch stencil printing. The volume of data collected for this investigation enabled detailed insight into the limitations of the printing process and as a result for suitable design guidelines to be developed. The finding also shows that the accepted industry guidelines on stencil design developed by the surface mount industry can be broken if the correct stencil technology is selected, thereby increasing the potential application areas of stencil printing.

Technical challenges of stencil printing technology for ultra fine pitch flip chip bumping

2004 ◽  
Vol 44 (5) ◽  
pp. 797-803 ◽  
Author(s):  
Dionysios Manessis ◽  
Rainer Patzelt ◽  
Andreas Ostmann ◽  
Rolf Aschenbrenner ◽  
Herbert Reichl
Keyword(s):  
Flip Chip ◽  
Printing Technology ◽  
Stencil Printing ◽  
Fine Pitch ◽  
Technical Challenges

A study to stencil printing technology for solder bump assembly

2009 ◽  
Author(s):  
Mu-Chun Wang ◽  
Zhen-Ying Hsieh ◽  
Kuo-Shu Huang ◽  
Chiao-Hao Tu ◽  
Shuang-Yuan Chen ◽  
...  
Keyword(s):  
Solder Bump ◽  
Printing Technology ◽  
Stencil Printing

4D printing technology, modern era: A short review

2020 ◽  
pp. 92-111
Author(s):  
Khodadad Mostakim ◽  
Nahid Imtiaz Masuk ◽  
Md. Rakib Hasan ◽  
Md. Shafikul Islam
Keyword(s):  
Smart Materials ◽  
Computer Aided Design ◽  
Short Review ◽  
Stimuli Responsive ◽  
4D Printing ◽  
Space Applications ◽  
Printing Technology ◽  
Practical Applications ◽  
Biomedical Technologies ◽  
Novel Material

The advancement in 3D printing has led to the rapid growth of 4D printing technology. Adding time, as the fourth dimension, this technology ushered the potential of a massive evolution in fields of biomedical technologies, space applications, deployable structures, manufacturing industries, and so forth. This technology performs ingenious design, using smart materials to create advanced forms of the 3-D printed specimen. Improvements in Computer-aided design, additive manufacturing process, and material science engineering have ultimately favored the growth of 4-D printing innovation and revealed an effective method to gather complex 3-D structures. Contrast to all these developments, novel material is still a challenging sector. However, this short review illustrates the basic of 4D printing, summarizes the stimuli responsive materials properties, which have prominent role in the field of 4D technology. In addition, the practical applications are depicted and the potential prospect of this technology is put forward.

Effect of ink and paperboard characteristics on flexographic print quality based on print density

TAPPI Journal ◽  
2011 ◽  
Vol 10 (9) ◽  
pp. 7-13
Author(s):  
KHODADAD MALMIRCHEGINI ◽  
FARSHAD SARKHOSH RAHMANI
Keyword(s):  
Water Absorption ◽  
Significant Influence ◽  
Particle Diameter ◽  
Print Quality ◽  
Printing Technology ◽  
Plastic Films ◽  
Printing Inks ◽  
Packaging Industry ◽  
Solids Content ◽  
Density Results

Flexography is an evolving printing technology that is suitable for printing on coated and uncoated paperboard and board, nonporous substrates including metalized and paperboard foils, and plastic films used especially in the packaging industry. This study evaluated the effect of paperboard and ink characteristics on flexographic print density in paperboard. Three commercial paperboards from different companies were prepared: brown kraft from Thailand, white kraft from Spain, and test liner from Iran. Four samples of process print inks from Iran were used in this investigation. Paperboard properties, such as roughness and water absorption, and ink characteristics, including solids content, PH and particle diameter, were measured. The inks were printed on paperboards using a roll no.15 applicator with a blade metering device, and the print densities were measured. Results showed that solids content, pH, and particle diameter of printing inks influenced print density, while the roughness and water absorption of the three types of paperboard had no significant influence on print density. Results also illustrated that two levels of ink viscosity (25–30 and 50–55 mPa·s) were insignificant to print density.

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