Low Temperature Solid State Bonding of Cu-In Fine-Pitch Interconnects

Author(s):  
Steffen Bickel ◽  
Iuliana Panchenko ◽  
Wataru Tachikawa ◽  
M. Jurgen Wolf
2016 ◽  
Vol 181 ◽  
pp. 165-168 ◽  
Author(s):  
Fengtian Hu ◽  
Penghui Xu ◽  
Wenqi Zhang ◽  
Anmin Hu ◽  
Ming Li

2012 ◽  
Vol 1 (1) ◽  
pp. P7-P10 ◽  
Author(s):  
Z. Chen ◽  
T. Luo ◽  
T. Hang ◽  
M. Li ◽  
A. Hu

2015 ◽  
Vol 44 (11) ◽  
pp. 4516-4524 ◽  
Author(s):  
Fengtian Hu ◽  
Shan Yang ◽  
Haozhe Wang ◽  
Anmin Hu ◽  
Ming Li

2013 ◽  
Vol 268 ◽  
pp. 368-372 ◽  
Author(s):  
Qin Lu ◽  
Zhuo Chen ◽  
Wenjing Zhang ◽  
Anmin Hu ◽  
Ming Li

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