Residual Stress in Flip Chip Joining Using Anisotropic Conductive Adhesive

Author(s):  
Zhaonian Cheng ◽  
Liqiang Cao ◽  
Peng Sun ◽  
Johan Liu
2016 ◽  
Vol 168 ◽  
pp. 1763-1766 ◽  
Author(s):  
Laura Frisk ◽  
Sanna Lahokallio ◽  
Milad Mostofizadeh ◽  
Anniina Parviainen ◽  
Janne Kiilunen

1995 ◽  
Vol 05 (04) ◽  
pp. 273-276 ◽  
Author(s):  
ITSUO WATANABE ◽  
KENZO TAKEMURA ◽  
NAOYUKI SHIOZAWA ◽  
OSAMU WATANABE ◽  
KAZUYOSHI KOJIMA ◽  
...  

1999 ◽  
Vol 89-90 ◽  
pp. 484-490 ◽  
Author(s):  
Gautam Sarkar ◽  
S Mridha ◽  
Tan Tin Chong ◽  
Wu Yuen Tuck ◽  
Sem Chi Kwan

Sign in / Sign up

Export Citation Format

Share Document