Electromigration of Gold Metallization

2021 ◽  
Author(s):  
Christine Hau-Riege ◽  
YouWen Yau
Keyword(s):  
Gold Metallization

Electromigration and Electrochemical Reaction Mixed Failure Mechanism in Gold Interconnection System

1999 ◽  
Author(s):  
Hide Murayama ◽  
Makoto Yamazaki ◽  
Shigeru Nakajima
Keyword(s):  
Failure Mechanism ◽  
Failure Rate ◽  
Electrochemical Reaction ◽  
Dielectric Films ◽  
Failure Rates ◽  
Interlayer Dielectric ◽  
Bipolar Devices ◽  
Gold Metallization

Abstract Power bipolar devices with gold metallization experience high failure rates. The failures are characterized as shorts, detected during LSI testing at burn-in. Many of these shorted locations are the same for the failed devices. From a statistical lot analysis, it is found that the short failure rate is higher for devices with thinner interlayer dielectric films. Based upon these results, a new electromigration and electrochemical reaction mixed failure mechanism is proposed for the failure.

Silicon-based microelectrodes for neurophysiology fabricated using a gold metallization/nitride passivation system

1996 ◽  
Vol 5 (2) ◽  
pp. 117-121 ◽  
Author(s):  
G. Ensell ◽  
D.J. Banks ◽  
D.J. Ewins ◽  
W. Balachandran ◽  
P.R. Richards
Keyword(s):  
Silicon Based ◽  
Gold Metallization

scholarly journals Effect of Chromium–Gold and Titanium–Titanium Nitride–Platinum–Gold Metallization on Wire/Ribbon Bondability

2006 ◽  
Vol 29 (4) ◽  
pp. 707-713 ◽  
Author(s):  
Jianbiao Pan ◽  
Robert M. Pafchek ◽  
Frank F. Judd ◽  
Jason B. Baxter
Keyword(s):  
Titanium Nitride ◽  
Gold Metallization

Lead-Free Solder/Gold Metallization Interdiffusion in Electronic Interconnects – Challenges and their Control

2008 ◽  
Author(s):  
Nausha Asrar
Keyword(s):  
Solder Joint ◽  
Coefficient Of Thermal Expansion ◽  
Void Formation ◽  
Lead Free ◽  
Gold Content ◽  
Lead Free Solder ◽  
Whisker Formation ◽  
Tin Whisker ◽  
Free Solder ◽  
Gold Metallization

Abstract While considerable amount of researches and investigations have been made on lead-free solder joint reliability, limited number of literatures are available on the effect of gold content on lead-free solder joint performance. The challenges of lead-free solder/gold metallization interdiffusion during high temperature application/test are: gold embrittlement, intermetallics growth, void formation, and tin-whisker formation. Tin whiskers causing system failures in earth and space-based applications have been reported. This paper illustrates a few case histories of such challenges. The results confirmed that the synergistic effects of void formation, intermetallic compounds formation due to the thick gold plating, and coefficient of thermal expansion mismatch between organic and ceramic substrates resulted in brittle fracture of the solder joint. The tin whisker formation was attributed to the compressive stress in the tin solder material, which was caused by diffusion of the end-cap metallization, formation of intermetallics, and thermal cycling of the soldered components.

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