ScienceGate
Advanced Search
Author Search
Journal Finder
Blog
Sign in / Sign up
ScienceGate
Search
Author Search
Journal Finder
Blog
Sign in / Sign up
Thermo-mechanical sub-modelling of BGA components in PCB reflow
Proceedings of the 36th International Spring Seminar on Electronics Technology
◽
10.1109/isse.2013.6648252
◽
2013
◽
Cited By ~ 1
Author(s):
Stoyan Stoyanov
◽
Alexander Dabek
◽
Chris Bailey
Download Full-text
Sign in / Sign up
Close
Export Citation Format
Close
Share Document
Close