Simulation of Electromigration Test Structures with and without Extrusion Monitors

2006 IEEE International Conference on Semiconductor Electronics ◽

10.1109/smelec.2006.380799 ◽

2006 ◽

Author(s):

Verena Hein ◽

Gisbert Hoelzer ◽

Torsten Schroeter ◽

Yvonne Yeo ◽

Tan Hong Mui

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