scholarly journals Evaluation of the Delamination in a Flip Chip Using Anisotropic Conductive Adhesive Films Under Moisture/Reflow Sensitivity Test

2006 ◽  
Vol 29 (3) ◽  
pp. 551-559 ◽  
Author(s):  
T. Ikeda ◽  
W.-K. Kim ◽  
N. Miyazaki
2016 ◽  
Vol 168 ◽  
pp. 1763-1766 ◽  
Author(s):  
Laura Frisk ◽  
Sanna Lahokallio ◽  
Milad Mostofizadeh ◽  
Anniina Parviainen ◽  
Janne Kiilunen

1995 ◽  
Vol 05 (04) ◽  
pp. 273-276 ◽  
Author(s):  
ITSUO WATANABE ◽  
KENZO TAKEMURA ◽  
NAOYUKI SHIOZAWA ◽  
OSAMU WATANABE ◽  
KAZUYOSHI KOJIMA ◽  
...  

1999 ◽  
Vol 89-90 ◽  
pp. 484-490 ◽  
Author(s):  
Gautam Sarkar ◽  
S Mridha ◽  
Tan Tin Chong ◽  
Wu Yuen Tuck ◽  
Sem Chi Kwan

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