Evaluation of the Delamination in a Flip Chip Using Anisotropic Conductive Adhesive Films Under Moisture/Reflow Sensitivity Test
2006 ◽
Vol 29
(3)
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pp. 551-559
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2005 ◽
Vol 8
(3)
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pp. 215-224
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Keyword(s):
2004 ◽
Vol 27
(1)
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pp. 161-166
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Keyword(s):
2003 ◽
Vol 2003
(0)
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pp. 623-624
1995 ◽
Vol 05
(04)
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pp. 273-276
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1999 ◽
Vol 89-90
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pp. 484-490
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2002 ◽
Vol 42
(8)
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pp. 1195-1204
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