scholarly journals An Integrated Liquid Metal Thermal Switch for Active Thermal Management of Electronics

2019 ◽  
Vol 9 (12) ◽  
pp. 2341-2351 ◽  
Author(s):  
Tianyu Yang ◽  
Thomas Foulkes ◽  
Beomjin Kwon ◽  
Jin Gu Kang ◽  
Paul V. Braun ◽  
...  
Keyword(s):  
Liquid Metal ◽  
Thermal Management ◽  
Thermal Switch ◽  
Thermal Management Of Electronics

Liquid Metal Alloy Based Vascular-Like Microchannel Networks for the Thermal Management of Electronics

2014 ◽  
Author(s):  
Zhi-Zhu He ◽  
Xu Xue ◽  
Jing Liu
Keyword(s):  
Heat Transfer ◽  
Liquid Metal ◽  
Thermal Management ◽  
High Efficiency ◽  
Cooling System ◽  
Metal Alloy ◽  
Outlet Channel ◽  
Thermal Management System ◽  
Thermal Management Of Electronics ◽  
Liquid Metal Alloy

In this paper, the heat transfer and hydrodynamics of the liquid metal alloy in the vascular-like microchannel networks based cooling system are numerically investigated and compared with the corresponding coolant by water. The whole microchannel networks are composed of two vascular-like networks which are vertically connected with each other. Each vascular-like network has a single inlet or outlet channel, and uniformly bifurcates over many distributed levels’ microchannels. The vascular-like networks combined with liquid metal alloy are used to design the high efficiency thermal management system for Electronics.

DEVELOPMENT OF MINIATURE HEAT PIPES FOR THERMAL MANAGEMENT OF ELECTRONICS IN ISRO SPACECRAFT

2018 ◽  
Author(s):  
Akhil Jaiswal ◽  
A. R. Anand ◽  
Simhachal Rao Chikkala ◽  
Venkata Raghavendra
Keyword(s):  
Thermal Management ◽  
Heat Pipes ◽  
Thermal Management Of Electronics

Recent Advancement on Liquid Metal Cooling for Thermal Management of Computer Chip

2010 ◽  
Author(s):  
Jing Liu ◽  
Yue-Guang Deng ◽  
Zhong-Shan Deng
Keyword(s):  
Liquid Metal ◽  
Thermal Management ◽  
New Technology ◽  
Air Cooling ◽  
Liquid Metal Coolant ◽  
Cooling Device ◽  
Chip Cooling ◽  
Cooling Method ◽  
Liquid Metal Cooling ◽  
Metal Coolant

Efficient cooling of a high performance computer chip has been an extremely important however becoming more and more tough issue. The recently invented liquid metal cooling method is expected to pave the way for high flux heat dissipation which is hard to tackle otherwise by many existing conventional cooling strategies. However, as a new thermal management method, its application also raised quite a few challenging fundamental and practical issues for solving. To illustrate the development of the new technology, this talk is dedicated to present an overview on the latest advancements made in the author’s lab in developing the new generation chip cooling device based on the liquid metal coolant with melting point around room temperature. The designing and optimization of the cooling device and component will be discussed. Several major barriers to prevent the new method from practical application such as erosion between liquid metal coolant and its substrate material will be outlined with good solutions clarified. Performance comparison between the new chip cooling method with commercially available products with highest quality such as air cooling, water cooling and heat pipe cooling devices were evaluated. Typical examples of using liquid metal cooling for the thermal management of a real PC or even super computer will be demonstrated. Further, miniaturizations on the prototype device by extending it as a MEMS cooling device or mini/micro channel liquid metal cooling device will also be explained. Along with the development of the hardware, some fundamental heat transfer issues in characterizing the liquid metal cooling device will be discussed through numerical or analytical model. Future challenging issues in pushing the new technology into large scale practices will be raised. From all the outputs obtained so far, it can be clearly seen that the new cooling strategy will find very promising and significant applications in a wide variety of engineering situations whenever thermal managements or heat transport are needed.

Characterization of Light Weight Heat Sink Materials for Thermal Management of Electronics

2007 ◽  
Author(s):  
Tunc Icoz ◽  
Mehmet Arik ◽  
John T. Dardis
Keyword(s):  
Thermal Management ◽  
Heat Sink ◽  
High Efficiency ◽  
Computational Study ◽  
Heat Sinks ◽  
Advanced Materials ◽  
Air Cooling ◽  
Thermal Management Of Electronics ◽  
Thermal Solution

Thermal management of electronics is a critical part of maintaining high efficiency and reliability. Adequate cooling must be balanced with weight and volumetric requirements, especially for passive air-cooling solutions in electronics applications where space and weight are at a premium. It should be noted that there are systems where thermal solution takes more than 95% of the total weight of the system. Therefore, it is necessary to investigate and utilize advanced materials to design low weight and compact systems. Many of the advanced materials have anisotropic thermal properties and their performances depend strongly on taking advantage of superior properties in the desired directions. Therefore, control of thermal conductivity plays an important role in utilization of such materials for cooling applications. Because of the complexity introduced by anisotropic properties, thermal performances of advanced materials are yet to be fully understood. Present study is an experimental and computational study on characterization of thermal performances of advanced materials for heat sink applications. Numerical simulations and experiments are performed to characterize thermal performances of four different materials. An estimated weight savings in excess of 75% with lightweight materials are observed compared to the traditionally used heat sinks.

Sign in / Sign up

Export Citation Format

Share Document