Separation and Validation of Bond-Wire and Solder Layer Failure Modes in IGBT Modules

2022 ◽  
pp. 1-1
Author(s):  
Wenzhao Liu ◽  
Dao Zhou ◽  
Francesco Iannuzzo ◽  
Michael Hartmann ◽  
Frede Blaabjerg
Keyword(s):  
Failure Modes ◽  
Igbt Modules ◽  
Bond Wire ◽  
Solder Layer

Separation of Bond-Wire and Solder Layer Failure Modes in IGBT Power Modules

2020 ◽  
Author(s):  
Wenzhao Liu ◽  
Dao Zhou ◽  
Michael Hartmann ◽  
Francesco Iannuzzo ◽  
Frede Blaabjerg
Keyword(s):  
Failure Modes ◽  
Power Modules ◽  
Bond Wire ◽  
Solder Layer

Wire Bond Failures in Power Modules

2003 ◽  
Author(s):  
S. Ramminger ◽  
G. Wachutka
Keyword(s):  
Failure Modes ◽  
Wire Bonding ◽  
Shear Forces ◽  
Reliable System ◽  
Insulated Gate Bipolar Transistor ◽  
Self Heating ◽  
Material Fatigue ◽  
Igbt Modules ◽  
Power Modules ◽  
Temperature Swing

Power modules are key components for traction applications, railway locomotives, streetcars and elevators, all of which are equipped with Insulated Gate Bipolar Transistor (IGBT) modules. In this application field, a highly reliable system is of uppermost interest. Reliability tests show that wire bonding and soldering may cause the modules to fail. The packaging setup is a multilayer system in which different materials are soldered together. During a temperature swing caused by self-heating and/or by changes in the ambient temperature, the layers expand differently. This generally causes shear forces at the terminations of joint interfaces finally leading to material fatigue and shorter life. In this paper, we give an overview of the wire bonding technique used in power modules and discuss the mechanisms and failure modes associated with it.

Failure Modes Associated with Plastic Packages and Copper Bond Wires

2015 ◽  
Author(s):  
Kevin Berger ◽  
Sultan Ali Lilani
Keyword(s):  
Failure Modes ◽  
Paper Briefly ◽  
Plastic Part ◽  
Acoustic Microscope ◽  
Intended Application ◽  
X Ray ◽  
Plastic Packages ◽  
Microscope Images ◽  
Bond Wires ◽  
Bond Wire

Abstract The Aerospace and Defense (A&D) markets are starting to use plastic packages more significantly for Space and Military ruggedized applications. But plastic packages are also inherently less reliable than ceramic devices for A&D applications. The key to the successful use of plastic devices in A&D application is to qualify the devices for the intended application using industry accepted plastic encapsulated microcircuit (PEM) qualification techniques. This paper briefly recaps the test techniques known to be effective in assessing plastic part reliability. But more importantly, it presents actual PEM qualification data gathered over the last 15 years involving over 400 individual PEM Qual lots. The paper also shows the failures modes associated with plastic packages and Cu bond wires. SEM, X-Ray, and Acoustic Microscope images were obtained for the failure modes associated with plastic packages and Cu bond wire.

scholarly journals Reliability Analysis and Fault-Tolerant Operation in a Multilevel Inverter for Industrial Application

Electronics ◽  
2021 ◽  
Vol 11 (1) ◽  
pp. 98
Author(s):  
Mohammad Fahad ◽  
Marwan Alsultan ◽  
Shafiq Ahmad ◽  
Adil Sarwar ◽  
Mohd Tariq ◽  
...  
Keyword(s):  
Failure Modes ◽  
Fault Tolerant ◽  
Power Converter ◽  
Open Circuit ◽  
Multilevel Inverter ◽  
Modulation Scheme ◽  
Level Control ◽  
Power Semiconductor ◽  
Harmonic Elimination ◽  
Igbt Modules

The extensive employment of power semiconductor devices in multilevel inverters (MLIs) has the consequence of increased failure probabilities. With numerous applications demanding highly reliable inverters, several fault-tolerant schemes have been devised to address switch open-circuit faults. This paper analyzes a multilevel inverter topology for IGBT modules undergoing open-circuit faults, a major impediment to reliable operation within a power converter. Reconfiguration of modulation is performed post-fault. A modulation scheme is implemented across failure modes as a hybrid of nearest level control and selective harmonic elimination. Reliability assessment of the topology is performed, including a comparison with previous literature in terms of component requirements and reliability. Simulation results validate the proposed solutions.

scholarly journals Investigation and Classification of Short-Circuit Failure Modes Based on Three-Dimensional Safe Operating Area for High-Power IGBT Modules

2018 ◽  
Vol 33 (2) ◽  
pp. 1075-1086 ◽  
Author(s):  
Yuxiang Chen ◽  
Wuhua Li ◽  
Francesco Iannuzzo ◽  
Haoze Luo ◽  
Xiangning He ◽  
...  
Keyword(s):  
High Power ◽  
Failure Modes ◽  
Short Circuit ◽  
Three Dimensional ◽  
Igbt Modules ◽  
Safe Operating
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