Correlation Studies Between Laser Ultrasonic Inspection Data and Finite-element Modeling Results in Evaluation of Solder Joint Quality in Microelectronic Packages

2021 ◽  
Author(s):  
Vishnu Vardhan Busi Reddy ◽  
Saurabh Gupta ◽  
Jaimal Williamson ◽  
Suresh Sitaraman
Keyword(s):  
Finite Element ◽  
Flip Chip ◽  
Ultrasonic Inspection ◽  
Ball Grid Array ◽  
Reliability Testing ◽  
Thermal Cycles ◽  
Laser Ultrasonic ◽  
Correlation Studies ◽  
Microelectronic Packages ◽  
Ball Grid Array Packages

Abstract Laser Ultrasonic Inspection (LUI) is a non-destructive and non-contact technique to evaluate the quality of solder ball interconnections in area-array microelectronic packages. Dual-Fiber Array Laser Ultrasonic Inspection System was demonstrated identifying defects and failures in chip-scale packages, ball grid array packages, and flip-chip ball grid array packages. The location and severity of the defects and failures in packages have been identified accurately using this system. Further, it is important to establish the correlation between LUI results and the severity of the failures for failure mode analysis, which will enable us to eliminate the need for destructive testing and allow the study of failure evolution in a given sample under continued reliability testing. This paper discusses correlation studies between experimental LUI results and finite-element simulation results from the flip-chip ball grid array packages subjected to thermal cycling reliability testing. The correlation equations will help in predicting the severity of the failures at a given number of thermal cycles based on LUI results. Furthermore, the life of the microelectronic packages can be predicted accurately from LUI results at a fewer number of thermal cycles.

scholarly journals Measurement Capability of Laser Ultrasonic Inspection System for Evaluation of Ball-Grid Array Package Solder Balls

2021 ◽  
Vol 18 (4) ◽  
pp. 183-189
Author(s):  
Vishnu V. B. Reddy ◽  
Jaimal Williamson ◽  
Suresh K. Sitaraman
Keyword(s):  
Flip Chip ◽  
Ultrasonic Inspection ◽  
Reference Sample ◽  
Ball Grid Array ◽  
Inspection System ◽  
Laser Ultrasonic ◽  
Fiber Array ◽  
Measurement Capability ◽  
Repeatability And Reproducibility ◽  
Ball Grid Array Packages

Abstract Laser ultrasonic inspection is a novel, noncontact, and nondestructive technique to evaluate the quality of solder interconnections in microelectronic packages. In this technique, identification of defects or failures in solder interconnections is performed by comparing the out-of-plane displacement signals, which are produced from the propagation of ultrasonic waves, from a known good reference sample and sample under test. The laboratory-scale dual-fiber array laser ultrasonic inspection system has successfully demonstrated identifying the defects and failures in the solder interconnections in advanced microelectronic packages such as chip-scale packages, plastic ball grid array packages, and flip-chip ball grid array packages. However, the success of any metrology system depends upon precise and accurate data to be useful in the microelectronic industry. This paper has demonstrated the measurement capability of the dual-fiber array laser ultrasonic inspection system using gage repeatability and reproducibility analysis. Industrial flip-chip ball grid array packages have been used for conducting experiments using the laser ultrasonic inspection system and the inspection data are used to perform repeatability and reproducibility analysis. Gage repeatability and reproducibility studies have also been used to choose a known good reference sample for comparing the samples under test.

Improvement of ELK Reliability in Flip Chip Packages using Bond-on-Lead (BOL) Interconnect Structure

2010 ◽  
Vol 2010 (1) ◽  
pp. 000197-000203 ◽  
Author(s):  
Eric Ouyang ◽  
MyoungSu Chae ◽  
Seng Guan Chow ◽  
Roger Emigh ◽  
Mukul Joshi ◽  
...  
Keyword(s):  
Finite Element ◽  
Flip Chip ◽  
Low Cost ◽  
Reliability Testing ◽  
Element Simulation ◽  
Testing Data ◽  
Flip Chip Packaging ◽  
Solder Mask ◽  
The Cost ◽  
Low K

In this paper, a novel flip chip interconnect structure called Bond-On-Lead (BOL) and its ability to reduce stress in the sensitive sub-surface ELK (Extra Low K) layers of the die is presented. BOL is a new low cost flip chip packaging solution which was developed by STATSChipPAC to dramatically reduce the cost of flip chip packaging. The BOL solution allows for efficient substrate routing by virtue of the use of narrow BOL pads and the removal of solder mask in the area of the BOL pads, which eliminates the limitations associated with solder mask opening sizes and positional tolerances. In addition to the compelling cost benefits, modeling results are confirmed with empirical reliability testing data to show that BOL is superior to the traditional Bond-on-Capture Pad (BOC) configuration from a mechanical stress and reliability perspective. The focus of this paper is on the theoretical analysis of the stress, strain, and warpage associated with the BOL configuration compared with the traditional BOC structure. For the package deformation, the global finite element method is used to simulate the package warpage. For the local bumping reliability, the focus is on the ELK layers which are the critical locations affecting the package's reliability. The local finite element simulation is conducted to compare the critical ELK layers stresses with BOL structure vs. with traditional BOC structure.

Finite element analysis of thermal distributions of solder ball in flip chip ball grid array using ABAQUS

2013 ◽  
Vol 30 (1) ◽  
pp. 14-18 ◽  
Author(s):  
Yap Boon Kar ◽  
Noor Azrina Talik ◽  
Zaliman Sauli ◽  
Jean Siow Fei ◽  
Vithyacharan Retnasamy
Keyword(s):  
Finite Element Analysis ◽  
Finite Element ◽  
Solder Ball ◽  
Flip Chip ◽  
Ball Grid Array ◽  
Element Analysis
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