Study on the Mechanical Behavior of Aluminum Alloy 5083 Friction Stir Welded Joint

2014 ◽  
Author(s):  
A-H. I. Mourad ◽  
M. Allam ◽  
A. El Domiaty
Keyword(s):  
Electron Microscopy ◽  
Scanning Electron Microscopy ◽  
Aluminum Alloy ◽  
Mechanical Behavior ◽  
Optical Microscopy ◽  
Welded Joint ◽  
Friction Stir ◽  
Aluminum Alloy 5083 ◽  
Tool Pin ◽  
Scanning Electron

The mechanical behavior of friction stir welded joints made of aluminum alloy 5083-H111 was studied in this investigation. Different welding processes parameters (rotational speeds, travelling speeds and tool pin shapes) were used to investigate the effect of process parameters on the strength and fracture properties of the joint. Scanning electron microscopy and optical microscopy analysis were conducted to study the effect of friction stir welding FSW process on the grain size in the welding zones. In general, the results illustrated that tool profile, the rotation speed and the traveling speed has great effect on the strength of the welded joint. Scanning electron microscopy and optical microscopy investigations showed that the grains inside the welding zone was refined and equiaxed resulting in higher hardness inside the nugget.

Investigation on the Corrosion Effect of Friction Stir Welded AA2024 T3 Aluminum Alloy Joints

2012 ◽  
Vol 525-526 ◽  
pp. 129-132 ◽  
Author(s):  
Yu E Ma ◽  
Zhen Qiang Zhao
Keyword(s):  
Electron Microscopy ◽  
Scanning Electron Microscopy ◽  
Aluminum Alloy ◽  
Welded Joint ◽  
Weld Zone ◽  
Base Material ◽  
Localized Corrosion ◽  
Aircraft Structure ◽  
Friction Stir ◽  
Scanning Electron

Before friction stir welded integral panels are used in main aircraft structure, the corrosion behavior of welded joint need to be studied in detail. 2024 T3 samples were designed and welded by friction stir welding; the microstructure crossing the weld zone was observed by scanning electron microscopy (SEM), the feature of different zones (base material, thermo-mechanical affected zone, nugget) was seen; the corrosion testing in NaCl smoking box was carried out, and microstructure was observed after corrosion, localized corrosion predominantly occurs in the thermo-mechanical affected zone.

Investigation of Porous Defects in Spray Formed 7XXX Aluminum Alloy

2014 ◽  
Vol 936 ◽  
pp. 1754-1758
Author(s):  
Yi Bin Yin ◽  
Yong An Zhang ◽  
Bai Qing Xiong ◽  
Feng Wang ◽  
Hong Wei Liu ◽  
...  
Keyword(s):  
Electron Microscopy ◽  
Scanning Electron Microscopy ◽  
Aluminum Alloy ◽  
Optical Microscopy ◽  
Field Emission ◽  
Spray Forming ◽  
Interconnected Pores ◽  
Scanning Electron

In this work, Al-10.8Zn-2.8Mg-1.9Cu alloy was manufactured by the spray forming technique. The microstructure of the spray-formed alloy was investigated by optical microscopy and field emission scanning electron microscopy. The results indicated that the porosity in the spray-deposited alloy was mainly composed of interstices, interconnected pores and gas pores. The distribution and types of porous defects were different, responding to position of the preform.

Friction Stir Welding of Precipitation Hardened Ni Based Alloys

2007 ◽  
Vol 539-543 ◽  
pp. 3763-3768 ◽  
Author(s):  
Hyun J. Jun ◽  
Raghavan Ayer ◽  
Thirumalai Neeraj ◽  
Russell Steel
Keyword(s):  
Electron Microscopy ◽  
Scanning Electron Microscopy ◽  
Transmission Electron Microscopy ◽  
Friction Stir Welding ◽  
Optical Microscopy ◽  
Grain Structure ◽  
Friction Stir ◽  
Transmission Electron ◽  
The Relationship ◽  
Scanning Electron

Commercial Waspaloy plates with two different initial microstructures (annealed and aged) were joined by Friction Stir Welding (FSW). This study presents the evolution of the grain structure, and precipitation, dissolution and reprecipitation of the γ' phase during FSW using Optical Microscopy, Scanning Electron Microscopy and Transmission Electron Microscopy. The relationship between microstructure and microhardness is also discussed.

Digital imaging: When should one take the plunge?

1996 ◽  
Vol 54 ◽  
pp. 602-603
Author(s):  
John F. Mansfield
Keyword(s):  
Electron Microscopy ◽  
Scanning Electron Microscopy ◽  
Transmission Electron Microscopy ◽  
Optical Microscopy ◽  
Digital Imaging ◽  
Storage Devices ◽  
Major Benefit ◽  
Transmission Electron ◽  
New Instrument ◽  
Scanning Electron

The current imaging trend in optical microscopy, scanning electron microscopy (SEM) or transmission electron microscopy (TEM) is to record all data digitally. Most manufacturers currently market digital acquisition systems with their microscope packages. The advantages of digital acquisition include: almost instant viewing of the data as a high-quaity positive image (a major benefit when compared to TEM images recorded onto film, where one must wait until after the microscope session to develop the images); the ability to readily quantify features in the images and measure intensities; and extremely compact storage (removable 5.25” storage devices which now can hold up to several gigabytes of data).The problem for many researchers, however, is that they have perfectly serviceable microscopes that they routinely use that have no digital imaging capabilities with little hope of purchasing a new instrument.

Investigation of Die Tilting of Packages with Single and Multi-chips

2018 ◽  
Author(s):  
Lo Chea Wee ◽  
Tan Sze Yee ◽  
Gan Sue Yin ◽  
Goh Cin Sheng
Keyword(s):  
Electron Microscopy ◽  
Scanning Electron Microscopy ◽  
Electron Beam ◽  
Optical Microscopy ◽  
Device Performance ◽  
Electronic Components ◽  
Area Of Interest ◽  
On Chip ◽  
Scanning Electron

Abstract Advanced package technology often includes multi-chips in one package to accommodate the technology demand on size & functionality. Die tilting leads to poor device performance for all kinds of multi-chip packages such as chip by chip (CbC), chip on chip (CoC), and the package with both CbC and CoC. Traditional die tilting measured by optical microscopy and scanning electron microscopy has capability issue due to wave or electron beam blocking at area of interest by electronic components nearby. In this paper, the feasibility of using profilemeter to investigate die tilting in single and multi-chips is demonstrated. Our results validate that the profilemeter is the most profound metrology for die tilting analysis especially on multi-chip packages, and can achieve an accuracy of <2μm comparable to SEM.

The External Morphology of the Eggs of Culex (Culex) saltanensis (Diptera: Culicidae) Under Scanning Electron Microscopy

2020 ◽  
Author(s):  
J R Santos-Mallet ◽  
T D Balthazar ◽  
A A Oliveira ◽  
W A Marques ◽  
A Q Bastos ◽  
...  
Keyword(s):  
Electron Microscopy ◽  
Scanning Electron Microscopy ◽  
Electron Microscope ◽  
Scanning Electron Microscope ◽  
Optical Microscopy ◽  
Osmium Tetroxide ◽  
Neotropical Region ◽  
External Morphology ◽  
Metal Supports ◽  
Scanning Electron

Abstract The aim of the present study was to describe the morphology of the eggs of Culex (Culex) saltanensis Dyar that occurs in the Neotropical region. Eggs of the Cx. (Cux.) saltanensis were collected at the Mata Atlântica FIOCRUZ campus, fixed in 1% osmium tetroxide, prepared for mounting on metal supports, observed under a scanning electron microscope, and described morphologically. The eggs had a coniform shape with a length of approximately 0.5 mm (505–510 µm) and a width in the median portion of 117 µm (113–123 µm). Upper portion is lined with tubers of irregular shape and varying sizes (0.64–1.31 µm), located on a cross-linked matrix forming bands observed under optical microscopy. The micropyle is encased in a necklace of approximately 6.6-µm plates arranged in a flower-like shape. Comparing Cx. (Cux.) saltanensis eggs with several species of different genera, important divergent characteristics can be observed. However, this study points to the need for new descriptions of eggs of species belonging to the same subgenus in order to analyze if there will be differences between them. Culex (Cux.) saltanensis eggs have particular characteristics not observed in eggs of other Culicidae genera.

Damage Analysis of Heat Resistant Steels

2007 ◽  
Vol 537-538 ◽  
pp. 303-306
Author(s):  
Tamás Bíró ◽  
László Dévényi
Keyword(s):  
Electron Microscopy ◽  
Scanning Electron Microscopy ◽  
Optical Microscopy ◽  
Damage Analysis ◽  
Resistant Steel ◽  
Heat Resistant Steel ◽  
Advantages And Disadvantages ◽  
Heat Resistant ◽  
Heat Resistant Steels ◽  
Scanning Electron

This paper shows the result of some metallographical examinations that have been carried out on low-alloyed Cr-Mo-V heat resistant steel. The aim of this research is to present and compare the advantages and disadvantages of the mainly applied metallographical methods. These techniques are optical microscopy, scanning electron microscopy, replica method and special applications of these methods. We have proved that using the investigated methods together gives much more information about the lifetime of the specimen than using these techniques particularly.

scholarly journals Digital Imaging: When Should One Take The Plunge?

1997 ◽  
Vol 5 (4) ◽  
pp. 14-15
Author(s):  
John F. Mansfield
Keyword(s):  
Electron Microscopy ◽  
Scanning Electron Microscopy ◽  
Transmission Electron Microscopy ◽  
Optical Microscopy ◽  
Digital Imaging ◽  
High Quality ◽  
Storage Devices ◽  
Major Benefit ◽  
Transmission Electron ◽  
Scanning Electron

The current imaging trend in optical microscopy, scanning electron microscopy (SEM) or transmission electron microscopy (TEM) is to record all data digitally. Most manufacturers currently market digital acquisition systems with their microscope packages. The advantages of digital acquisition include: almost instant viewing of the data as a high-quality positive image (a major benefit when compared to TEM images recorded onto film, where one must wait until after the microscope session to develop the images); the ability to readily quantify features in the images and measure intensities; and extremely compact storage (removable 5.25” storage devices which now can hold up to several gigabytes of data).

Identification of Nd163 phase in melt-textured NdBa2Cu3O7−δ bulk samples

2003 ◽  
Vol 18 (9) ◽  
pp. 2050-2054 ◽  
Author(s):  
Marcello Gombos ◽  
Vicente Gomis ◽  
Anna Esther Carrillo ◽  
Antonio Vecchione ◽  
Sandro Pace ◽  
...  
Keyword(s):  
Electron Microscopy ◽  
Scanning Electron Microscopy ◽  
Optical Microscopy ◽  
Room Temperature ◽  
Polarized Light ◽  
Energy Dispersive ◽  
X Ray ◽  
Spontaneous Formation ◽  
The Stability ◽  
Scanning Electron

In this work, we report on the observation of Nd1Ba6Cu3O10,5 (Nd163) phase of the NdBaCuO system in melt-textured Nd123 bulk samples grown from a mixture of Nd123 and Nd210 phase powders. The observation was performed with polarized light optical microscopy and scanning electron microscopy–energy dispersive x-ray analyses. Images of the identified phase crystals show an aspect quite different from Nd422 crystals. Unexpectedly, Nd163 was individuated, even in “pure” Nd123 samples. Moreover, after long exposure to air, Nd163 disappeared completely in samples synthesized from powders containing Nd210. Thermogravimetry analyses of powders show that the stability of this phase in air is limited to temperatures higher than 900 °C, so Nd163 is unstable and highly reactive at room temperature. Moreover, an explanation of the observation of Nd163 in Nd210 free samples, based on the spontaneous formation of Nd163 phase in a Nd123 melt, is proposed.

Determination of cotton fiber maturity and linear density (fineness) by examination of fiber cross-sections. Part 2: A comparison optical and scanning electron microscopy

2014 ◽  
Vol 84 (18) ◽  
pp. 1939-1947 ◽  
Author(s):  
Geoffrey RS Naylor ◽  
Margaret Pate ◽  
Graham J Higgerson
Keyword(s):  
Electron Microscopy ◽  
Scanning Electron Microscopy ◽  
Cell Wall ◽  
Optical Microscopy ◽  
Cross Sections ◽  
Linear Density ◽  
Wall Area ◽  
Density Values ◽  
Fiber Maturity ◽  
Scanning Electron

Previous researchers established a set of reference cottons with known fiber maturity and linear density (fineness) values based on the analysis of a large number of individual transverse fiber cross-sections viewed under the optical microscope. Part 1 identified that the limited optical resolution of the captured images may be the source of a significant systematic error in the assigned values of cell wall area and hence fiber maturity and linear density values. In this paper the optical microscopy technique was implemented. Individual cross-sections were measured using this approach and also higher resolution and higher magnification images were obtained using scanning electron microscopy. It was found that the data obtained from optical microscopy were similar to the SEM data, with the perimeter being 2% smaller, the cell wall area being 6% larger and the maturity ratio values being 8% higher. It was concluded that the combined approach of utilizing SEM in conjunction with optical imaging is a useful approach for verifying and perhaps correcting the data obtained from optical imaging. Further the SEM images highlighted that the current experimental protocol does not adequately address the challenge of ensuring that the fibers are mounted normal to the plane of cutting the transverse cross-section. Modeling demonstrated that while maturity ratio values are relatively insensitive to this misalignment, measured cell wall area values and hence fiber linear density values will be overestimated. This may be the major source of error associated with the technique and warrants further attention in future studies.

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