Wettability and thermal stability of fluorocarbon films deposited by deep reactive ion etching

2005 ◽  
Vol 23 (3) ◽  
pp. 434-439 ◽  
Author(s):  
Yan Xin Zhuang ◽  
Aric Menon
Author(s):  
Yan Xin Zhuang ◽  
Aric K. Menon

Fluorocarbon films, which can be used to minimize stiction of silicon microstructures, have been deposited by passivation process in deep reactive ion etching tool. The wettability, surface energy, nano-scale adhesive force, and thermal stability have been investigated by contact angle measuring system, atomic force microscopy (AFM) and ellipsometry. The fluorocarbon films are good for anti-stiction applications due to their high water contact angle (110°), low surface energy (14.5mJ/m2), low nano-scale adhesive force (33 nN) and high thermal stability up to 300°C.


2011 ◽  
Vol 21 (10) ◽  
pp. 105001
Author(s):  
Ahmet Erten ◽  
Milan Makale ◽  
Xuekun Lu ◽  
Bernd Fruhberger ◽  
Santosh Kesari ◽  
...  

2017 ◽  
Vol 9 (27) ◽  
pp. 23263-23263
Author(s):  
Bryan W. K. Woo ◽  
Shannon C. Gott ◽  
Ryan A. Peck ◽  
Dong Yan ◽  
Mathias W. Rommelfanger ◽  
...  

2014 ◽  
Vol 113 ◽  
pp. 35-39 ◽  
Author(s):  
Jayalakshmi Parasuraman ◽  
Anand Summanwar ◽  
Frédéric Marty ◽  
Philippe Basset ◽  
Dan E. Angelescu ◽  
...  

2006 ◽  
Vol 16 (12) ◽  
pp. 2570-2575 ◽  
Author(s):  
Yiyong Tan ◽  
Rongchun Zhou ◽  
Haixia Zhang ◽  
Guizhang Lu ◽  
Zhihong Li

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