DESIGN OF A MULTI-LEVEL FAULT-TOLERANT MESH (MFTM) FOR HIGH RELIABILITY APPLICATIONS

1995 ◽  
Vol 02 (04) ◽  
pp. 419-429
Author(s):  
SHAMBHU J. UPADHYAYA ◽  
I-SHYAN HWANG
Keyword(s):  
System Reliability ◽  
Fault Tolerant ◽  
High Reliability ◽  
Operational Reliability ◽  
Variable Number ◽  
Hierarchical Design ◽  
Processor Arrays ◽  
Design Paradigm ◽  
Multi Level ◽  
Overall Reliability

This paper presents a novel technique for the enhancement of operational reliability of processor arrays by a multi-level fault-tolerant design approach. The key idea of the design is based on the well known hierarchical design paradigm. The proposed fault-tolerant architecture uses a flexible reconfiguration of redundant nodes, thereby offering a better spare utilization than existing two-level redundancy schemes. A variable number of spares is provided at each level of redundancy which enables a flexible reconfiguration as well as area efficient layouts and better spare utilization. The spare nodes at each level can replace any of the failed primary nodes, not only at the same level but also those at the lower levels. The architecture can be adopted to increase the system reliability in Multi Chip Modules (MCMs). The main contributions of our work are the higher degree of fault tolerance, higher overall reliability, flexibility, and a better spare utilization.

scholarly journals Issues in Design and Development of Reliable Configurable Distributed Checkout and Launch System for Mission Critical Aero-Space Flight Vehicles

2020 ◽  
Vol 9 (4S2) ◽  
pp. 77-81
Keyword(s):  
System Reliability ◽  
Fault Tolerant ◽  
High Reliability ◽  
Critical Parameters ◽  
Health Checks ◽  
Flight Vehicles ◽  
Mission Critical ◽  
Criticality Analysis

Role of Configurable Distributed Checkout and Launch System (CDCLS) is pivotal in carrying out quick health checks and launching of Aerospace Flight Vehicles. Configurable Distributed Architecture provides flexibility for connecting nodes and scaling Distributed System. Different configurations can be derived from the Master Configuration. Since, Ultra high reliability and infallible performance of the CDCLS is of paramount importance, Safety criticality and Mission criticality analysis needs to be carried out for determination of mission critical parameters. These critical parameters need to be addressed by required fault tolerant architecture, which can be implemented in Hardware and Software for achieving system reliability objective (Say, 0.99).

Reliability analysis and state transfer scheduling optimization of degrading load-sharing system equipped with warm standby components

2021 ◽  
pp. 1748006X2110017
Author(s):  
Sheng-Jia Ruan ◽  
Yan-Hui Lin
Keyword(s):  
Reliability Analysis ◽  
System Reliability ◽  
High Reliability ◽  
Quadrature Rule ◽  
Load Sharing ◽  
Measurement Information ◽  
Model Parameters ◽  
Scheduling Optimization ◽  
State Transfer ◽  
Warm Standby

Standby redundancy can meet system safety requirements in industries with high reliability standards. To evaluate reliability of standby systems, failure dependency among components has to be considered especially when systems have load-sharing characteristics. In this paper, a reliability analysis and state transfer scheduling optimization framework is proposed for the load-sharing 1-out-of- N: G system equipped with M warm standby components and subject to continuous degradation process. First, the system reliability function considering multiple dependent components is derived in a recursive way. Then, a Monte Carlo method is developed and the closed Newton-Cotes quadrature rule is invoked for the system reliability quantification. Besides, likelihood functions are constructed based on the measurement information to estimate the model parameters of both active and standby components, whose degradation paths are modeled by the step-wise drifted Wiener processes. Finally, the system state transfer scheduling is optimized by the genetic algorithm to maximize the system reliability at mission time. The proposed methodology and its effectiveness are illustrated through a case study referring to a simplified aircraft hydraulic system.

scholarly journals Fault-tolerant multi-level logic decoder for nanoscale crossbar memory arrays

2007 ◽  
Author(s):  
M. Haykel Ben Jamaa ◽  
David Atienza ◽  
Giovanni De Micheli ◽  
Kirsten E. Moselund ◽  
Didier Bouvet ◽  
...  
Keyword(s):  
Fault Tolerant ◽  
Multi Level ◽  
Memory Arrays

A Dynamic Service Pool Size Configuration Mechanism for Service-Oriented Workflow

2011 ◽  
Vol 186 ◽  
pp. 499-504 ◽  
Author(s):  
Pan He ◽  
Jie Xu ◽  
Kai Gui Wu ◽  
Jun Hao Wen
Keyword(s):  
System Reliability ◽  
Environmental Changes ◽  
Point Of View ◽  
Pool Size ◽  
Reliability Model ◽  
Optimal Method ◽  
Service Oriented ◽  
Overall Reliability

Service-oriented workflows are the fundamental structures in service-oriented applications and changes in the workflow could cause dramatic changes in system reliability. In several ways to re-heal workflows in execution, re-sizing service pools in the workflow is practical and easy to implement. In order to quickly adjust to workflow or environmental changes, this paper presents a dynamic service pool size configuration mechanism from the point of view of maintaining workflow reliability. An architecture-based reliability model is used to evaluate the overall reliability of a workflow with service pools and an optimal method is proposed to get the combination of service pool size aiming at minimizing the sum of service pool size subject to the workflow reliability requirement. A case study is used to explain this method and experiment results show how to change service pool size to meet the workflow reliability requirements.

Aluminum Reflow Sputtering

MRS Bulletin ◽  
1995 ◽  
Vol 20 (11) ◽  
pp. 53-56 ◽  
Author(s):  
Kuniko Kikuta
Keyword(s):  
Integrated Circuit ◽  
High Speed ◽  
Lower Cost ◽  
High Reliability ◽  
Device Fabrication ◽  
Damascene Process ◽  
Aspect Ratios ◽  
Multi Level ◽  
Poor Adhesion ◽  
Lower Resistivity

The scaling of integrated-circuit device dimensions in the horizontal direction has caused an increase in aspect ratios of contact holes and vias without a corresponding scaledown in vertical dimensions. Conventional sputtering has become unreliable for handling higher aspect-ratio via/contact holes because of its poor step coverage. Several studies have attempted to overcome this problem by using W-CVD and reflow technology. The W-CVD is used for practical device fabrications. However, this technique has several problems such as poor adhesion to SiO2, poor W surface morphology, greater resistivity than Al, and the need of an etch-back process.Al reflow technology using a conventional DC magnetron sputtering system can simplify device-fabrication processes and achieve high reliability without Al/W interfaces. In particular, the Al reflow technology is profitable for multi-level interconnections in combination with a damascene process by using Al chemical mechanical polishing (CMP). These interconnections are necessary for miniaturized and high-speed devices because they provide lower resistivity than W and simplify fabrication processes, resulting in lower cost.This article describes recent Al reflow sputtering technologies as well as application of via and interconnect metallization.

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