The Role of Organizational Failure Mode, Effects & Analysis(FMEA) in Risk Management and Its Impact on the Company's Performance

2020 ◽  
Author(s):  
Lokmane Hezla ◽  
Avdotin V.P ◽  
Plyuschicov V.G ◽  
Sambros N.B ◽  
Nadjla Hezla ◽  
...  
Keyword(s):  
Risk Management ◽  
Failure Mode ◽  
Organizational Failure ◽  
Mode Effects

scholarly journals Risk Management in Magnetic Resonance: Failure Mode, Effects, and Criticality Analysis

2013 ◽  
Vol 2013 ◽  
pp. 1-5 ◽  
Author(s):  
Antonella Petrillo ◽  
Roberta Fusco ◽  
Vincenza Granata ◽  
Salvatore Filice ◽  
Nicola Raiano ◽  
...  
Keyword(s):  
Risk Management ◽  
Magnetic Resonance ◽  
Failure Mode ◽  
Risk Index ◽  
Magnetic Resonance Examination ◽  
Mode Effects ◽  
Management Procedure ◽  
Critical Phases ◽  
Criticality Analysis ◽  
Examination Process

The aim of the study was to perform a risk management procedure in “Magnetic Resonance Examination” process in order to identify the critical phases and sources of radiological errors and to identify potential improvement projects including procedures, tests, and checks to reduce the error occurrence risk. In this study we used the proactive analysis “Failure Mode Effects Criticality Analysis,” a qualitative and quantitative risk management procedure; has calculated Priority Risk Index (PRI) for each activity of the process; have identified, on the PRI basis, the most critical activities and, for them, have defined improvement projects; and have recalculated the PRI after implementation of improvement projects for each activity. Time stop and audits are performed in order to control the new procedures. The results showed that the most critical tasks of “Magnetic Resonance Examination” process were the reception of the patient, the patient schedule drafting, the closing examination, and the organization of activities. Four improvement projects have been defined and executed. PRI evaluation after improvement projects implementation has shown that the risk decreased significantly following the implementation of procedures and controls defined in improvement projects, resulting in a reduction of the PRI between 43% and 100%.

scholarly journals ANALISIS PENINGKATAN KUALITAS PROSES PEMBANGUNAN GEDUNG 7 DENGAN PENDEKATAN QUALITY RISK MANAGEMENT (QRM) DAN FAILURE MODE EFFECTS AND CRITICALITY ANALYSIS (FMECA)

2020 ◽  
Vol 15 (2) ◽  
pp. 49-60
Author(s):  
Inggit Marodiyah ◽  
Indung Sudarso
Keyword(s):  
Risk Management ◽  
Failure Mode ◽  
Failure Modes ◽  
Quality Risk Management ◽  
Mode Effects ◽  
Safety Belt ◽  
Quality Risk ◽  
Criticality Analysis

Manajemen kualitas digunakan untuk mengevaluasi kualitas bangunan, sedangkan manajemen risiko digunakan untuk mengetahui risiko yang berpengaruh terhadap kualitas bangunan. Seperti sumber daya manusia yang tidak memakai alat pelindung diri (APD) saat melakukan pekerjaan dikarenakan dengan alasan pekerjaan semakin lama serta ribet dikerjakan. Sehingga dengan adanya beberapa proses yang belum terstandar, maka dapat berisiko mempengaruhi kualitas pembangunan yang tidak sesuai harapan. Tujuan dilakukan penelitian ini adalah untuk mengetahui tingkat risiko yang berpengaruh terhadap kualitas pembangunan dan menentukan mitigasi untuk peningkatan kualitas pembangunan. Metode yang di gunakan adalah Quality Risk Management (QRM) yang berfungsi mengevaluasi indikator yang mempengaruhi peningkatan kualitas dan Failure Modes Effects and Criticality Analysis (FMECA) untuk mengevaluasi dampak potensial dari setiap kegagalan dengan memberi skala prioritas demi mengetahui tingkat risiko. Hasil yang diperoleh dari pendekatan QRM dan FMECA yaitu pekerjaan rangka atap dengan RPN sebesar 42 dan plesteran dinding luar dengan RPN sebesar 28 yang tergolong risiko tinggi (Critical High ). Sehingga mitigasi risiko yang diberikan yaitu pemakaian APD seperti safety belt safety shoes, helmet serta konsentrasi agar dapat membantu mencegah atau mengatasi apabila risiko yang tidak di inginkan dapat mempengaruhi kualitas bangunan.  

Analytical electron microscopy of grain boundaries in Al-Cu metallizations

1992 ◽  
Vol 50 (2) ◽  
pp. 1684-1685
Author(s):  
J. R. Michael ◽  
A. D. Romig ◽  
D. R. Frear
Keyword(s):  
Electron Microscopy ◽  
Integrated Circuits ◽  
Failure Mode ◽  
Current Density ◽  
Thermal History ◽  
Analytical Electron Microscopy ◽  
Cu Metallization ◽  
Analytical Electron ◽  
Interconnect Lines

Al with additions of Cu is commonly used as the conductor metallizations for integrated circuits, the Cu being added since it improves resistance to electromigration failure. As linewidths decrease to submicrometer dimensions, the current density carried by the interconnect increases dramatically and the probability of electromigration failure increases. To increase the robustness of the interconnect lines to this failure mode, an understanding of the mechanism by which Cu improves resistance to electromigration is needed. A number of theories have been proposed to account for role of Cu on electromigration behavior and many of the theories are dependent of the elemental Cu distribution in the interconnect line. However, there is an incomplete understanding of the distribution of Cu within the Al interconnect as a function of thermal history. In order to understand the role of Cu in reducing electromigration failures better, it is important to characterize the Cu distribution within the microstructure of the Al-Cu metallization.

Failure Mode, Effects, and Criticality Analysis (FMECA)

1993 ◽  
Author(s):  
Robert Borgovini ◽  
Stephen Pemberton ◽  
Michael Rossi
Keyword(s):  
Failure Mode ◽  
Mode Effects ◽  
Criticality Analysis
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