Flip Chip Assembly Using Carbon Nanotube Bumps and Anisotropic Conductive Adhesive Film

2019 ◽  
Vol 27 (1) ◽  
pp. 825-830
Author(s):  
Xia Zhang ◽  
Teng Wang ◽  
Pär Berggren ◽  
Si Chen ◽  
Johan Liu
Keyword(s):  
Carbon Nanotube ◽  
Flip Chip ◽  
Conductive Adhesive ◽  
Adhesive Film ◽  
Anisotropic Conductive Adhesive ◽  
Flip Chip Assembly

Process Modeling and Thermal/Mechanical Behavior of ACA/ACF Type Flip-Chip Packages

2001 ◽  
Vol 123 (4) ◽  
pp. 331-337 ◽  
Author(s):  
K. N. Chiang ◽  
C. W. Chang ◽  
C. T. Lin
Keyword(s):  
Tensile Stress ◽  
Process Modeling ◽  
Flip Chip ◽  
Thermal Loading ◽  
Conductive Adhesive ◽  
Adhesive Film ◽  
Anisotropic Conductive Adhesive ◽  
Fine Pitch ◽  
Assembly Technology ◽  
Conductive Particles

Development of flip-chip-on-glass (FCOG) assembly technology using anisotropic conductive adhesive/film (ACA/ACF) is currently underway to achieve fine pitch interconnections between driver IC and flat panel display. Conductive adhesives are characterized by fine-pitch capability and more environment compatibility. Anisotropic conductive adhesive/film (ACA/ACF) is composed of an adhesive resin and conductive particles, such as metallic or metal-coated polymer particles. In contrast to a solder type flip chip interconnection, the electric current passing through conductive particles becomes the dominant conduction paths. The interconnection between the particles and the conductive surfaces is constructed by the elastic/plastic deformation of conductive particles with contact pressure, which is maintained by tensile stress in the adhesive. Although loss of electric contact can occur when the adhesive expands or swells in the Z- axis direction, delamination and cracking can occur in the adhesive layer while the tensile stress is excessive. In addition to performing processing simulations as well as reliability modeling, this research investigates the contact force that is developed and relaxed within the interconnection during the process sequence by using nonlinear finite element simulations. Environmental effects, such as high temperature and thermal loading, are also discussed. Moreover, a parametric study is performed for process design. To improve performance and reliability, variables such as ACF materials, proper processing conditions are discussed as well. Furthermore, this study presents a novel method called equivalent spring method, capable of significantly reducing the analysis CPU time and make process modeling and contact analysis of the 3D ACA/ACF process possible.

Evaluation of a Conductive Adhesive Based Approach to Lead Free Flip Chip Assembly

2002 ◽  
Author(s):  
Muthiah Venkateswaran ◽  
Peter Borgesen ◽  
K. Srihari
Keyword(s):  
High Speed ◽  
Flip Chip ◽  
Printed Circuit Board ◽  
Critical Evaluation ◽  
Conductive Adhesive ◽  
Circuit Board ◽  
Lead Free ◽  
Conductive Adhesives ◽  
Flip Chip Assembly ◽  
Placement Machine

Electrically conductive adhesives are emerging as a lead free, flux less, low temperature alternative to soldering in a variety of electronics and optoelectronics applications. Some of the potential benefits are obvious, but so far the adhesives have some limitations as well. The present work offers a critical evaluation of one approach to flip chip assembly, which lends itself particularly well to use with a high speed placement machine. Wafers were bumped by stencil printing of a thermoset conductive adhesive, which was then fully cured. In assembly, the conductive adhesive paste was stencil printed onto the pads of a printed circuit board and cured after die placement. The printing process was optimized to ensure robust assembly and the resulting reliability assessed.

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