Electrical Properties Of Copper-Filled Electrically Conductive Adhesives And Pressure-Dependent Conduction Behavior Of Copper Particles

2010 ◽  
pp. 387-410
Author(s):  
Y.-S. Lin ◽  
S.-S. Chiu
Keyword(s):  
Electrical Properties ◽  
Conductive Adhesives ◽  
Electrically Conductive ◽  
Electrically Conductive Adhesives ◽  
Copper Particles ◽  
Conduction Behavior

scholarly journals Fabrication of Novel Printable Electrically Conductive Adhesives (ECAs) with Excellent Conductivity and Stability Enhanced by the Addition of Polyaniline Nanoparticles

Nanomaterials ◽  
2019 ◽  
Vol 9 (7) ◽  
pp. 960 ◽  
Author(s):  
Jiayue Wen ◽  
Yanhong Tian ◽  
Chunjin Hang ◽  
Zhen Zheng ◽  
He Zhang ◽  
...  
Keyword(s):  
Electrical Properties ◽  
Oxidative Polymerization ◽  
Conductive Adhesives ◽  
Electrically Conductive ◽  
Electrically Conductive Adhesives ◽  
Potential Applications ◽  
Negative Effect ◽  
Order Of Magnitude ◽  
Low Temperature Bonding ◽  
The Cost

Electrically conductive adhesives (ECAs) are one of the low temperature bonding materials. It can be used to replace toxic Sn-Pb solder. The key issue for the application of ECAs is how to improve their electrical properties. In the present study, we develop an effective method to promote the electrical properties of ECAs by addition of polyaniline (PANI) nanoparticles. PANIs were synthesized via a facile one-step chemical oxidative polymerization method. After adding 0.5 wt% PANI nanoparticles, the conductivity of ECAs increased dramatically by an order of magnitude. The bulk resistivity of 8.8 × 10−5 Ω·cm is achieved for 65 wt% silver fillers with 0.5 wt% PANIs loaded ECAs. Besides, this improvement has no negative effect on the shear strength and the aging life of ECAs. Moreover, the use of PANIs not only lowers the percolation threshold of ECAs, but also reduces the cost and improves the bonding reliability. Finally, PANIs enhanced ECAs patterns were successfully printed by a stencil printing method, which proved their potential applications in replacing conventional solder pastes and printing functional circuits.

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