High-Speed Hand-Held Wide Aperture Time-Domain Terahertz Imaging System

Author(s):  
David Zimdars ◽  
Greg Fichter ◽  
Chris Megdanoff ◽  
John Duquette ◽  
Margaret Murdock ◽  
...  
2020 ◽  
Vol 38 (16) ◽  
pp. 4237-4243 ◽  
Author(s):  
Eui Su Lee ◽  
Mugeon Kim ◽  
Kiwon Moon ◽  
Il-Min Lee ◽  
Dong Woo Park ◽  
...  

2021 ◽  
Vol 9 ◽  
Author(s):  
Hongfei Zhang ◽  
Yuanmeng Zhao ◽  
Chenyu Li ◽  
Cunlin Zhang

Chinese lacquerware is an important invention of arts and crafts in China. In this study, Chinese lacquerware is characterized using terahertz reflectometric imaging. The lacquerware studied herein comprises an ornamental wood panel covered by multiple layers of lacquers to portray motifs. For characterizing lacquerware, a terahertz time-domain spectroscopic reflectometric imaging system is proposed. The role of the proposed terahertz imaging system in highlighting the interface between layers during stratigraphic buildup in reflection geometry is proved. The proposed system provides a universal method for assessing the structural information of lacquered objects in a contactless and non-invasive manner; moreover, it provides two-dimensional images, subsurface three-dimensional images, and stratigraphic images (b-scans) in a contactless and non-invasive manner. Using the proposed system, we examine the buried layers of the lacquerware, including faults in the wooden layer and damages in the lacquerware. Research shows the promising prospects of terahertz time-domain spectroscopic reflectometric imaging as a non-destructive detection technique suited to lacquerware.


2015 ◽  
Vol 64 (11) ◽  
pp. 114206
Author(s):  
Lu Wen-Liang ◽  
Lou Shu-Qin ◽  
Wang Xin ◽  
Shen Yan ◽  
Sheng Xin-Zhi

2021 ◽  
Author(s):  
Yaheng Wang ◽  
Ryohei Kaname ◽  
Li Yi ◽  
Tadao Nagatsuma

2018 ◽  
Author(s):  
Daechul Choi ◽  
Yoonseong Kim ◽  
Jongyun Kim ◽  
Han Kim

Abstract In this paper, we demonstrate cases for actual short and open failures in FCB (Flip Chip Bonding) substrates by using novel non-destructive techniques, known as SSM (Scanning Super-conducting Quantum Interference Device Microscopy) and Terahertz TDR (Time Domain Reflectometry) which is able to pinpoint failure locations. In addition, the defect location and accuracy is verified by a NIR (Near Infra-red) imaging system which is also one of the commonly used non-destructive failure analysis tools, and good agreement was made.


Author(s):  
Chung Hsing Li ◽  
Tzu-Chao Yan ◽  
Yuhsin Chang ◽  
Chyong Chen ◽  
Chien-Nan Kuo

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