Low-Cost High-Performance InP-Based Photonic-Integrated Circuits enabled by a Generic Foundry Process

Author(s):  
F. M. Soares ◽  
Q. Cui ◽  
A. Seeger ◽  
K. Janiak ◽  
N. Grote
ISRN Optics ◽  
2012 ◽  
Vol 2012 ◽  
pp. 1-27 ◽  
Author(s):  
Zhou Fang ◽  
Ce Zhou Zhao

With the increasing bandwidth requirement in computing and signal processing, the inherent limitations in metallic interconnection are seriously threatening the future of traditional IC industry. Silicon photonics can provide a low-cost approach to overcome the bottleneck of the high data rate transmission by replacing the original electronic integrated circuits with photonic integrated circuits. Although the commercial promise has not been realized, this perspective gives huge impetus to the development of silicon photonics these years. This paper provides an overview of the progress and the state of the art of each component in silicon photonics, including waveguides, filters, modulators, detectors, and lasers, mainly in the last five years.


1989 ◽  
Vol 154 ◽  
Author(s):  
C. P. Wong

AbstractSilicone gels are becoming some of the most accepted protective coatings for VLSI integrated circuits due to their excellent electrical, thermal, and soft gel-like nature and properties, as well as their ultra-purity and ability to protect IC devices against severe environments. Recent studies indicate that proper IC Chip surface protection with high performance silicone gels in low-cost, non-hermetic plastic packaging might well replace the conventional hermetic ceramic packaging. This paper describes the use of the soft silicone gels and coatings in IC devices. It also describes the correlation between the material cure temperature and cure time versus their adhesion and electrical reliability during 85°C, 85% RH and bias accelerating testing.


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