scholarly journals Identification of humic substances on the transformation of an organic substrate

2022 ◽  
Vol 11 (1) ◽  
pp. 10-16
Author(s):  
Olga BEZUGLOVA ◽  
Andrey KOMAROV ◽  
Alexey KOMAROV
2018 ◽  
Vol 9 (2) ◽  
pp. 264-274 ◽  
Author(s):  
Rubens Ribeiro Da Silva ◽  
Guilherme Nunes Lucena ◽  
Ângela Franciely Machado ◽  
Gilson Araújo De Freitas ◽  
Antônio Teixeira Matos ◽  
...  

The humic substances, major constituents of the organic matter of the substrates, play an important role in plant development, including: the availability of nutrients, the generation of negative charges (CEC) and the buffering effect. Based on this, this study aimed to use the molecular absorption spectroscopy in the ultraviolet-visible region (UV-VIS), the vibrational spectroscopy Fourier transform infrared (FTIR) and the elementary analysis CHN/O techniques to characterize the humic acid (HA) and fulvic acid (FA) fractions of the humic substances of five organic substrates, named as T1, T2, T3, T4, and T5, which were produced at the Federal University of Tocantins – Campus Gurupi. The molecular absorption spectra in UV-VIS and FTIR on the T1, T2, T3, T4 and T5 substrates showed humification, the formation of negative charges, which is related to the cation exchange capacity (CEC) and the complexation of metal ions that are considered nutrients. The biggest humification was shown for the T4 substrate, in function of its higher cabon-acid humic/carbon-acid fulvic ratio and the lower C/N ratio, allied to a negative charge generation, the low E4/E6 ratio found in the humic acid fraction. The complexation of metal nutrient ions indicates the greatest potencial of its use for seedlings production and the conservation of the chemical and physical properties of the organic substrate. 


2004 ◽  
Vol 40 (1) ◽  
pp. 8
Author(s):  
N. Dzyuban ◽  
E. S. Bikbulatov ◽  
E. M. Bikbulatova ◽  
I. A. Kuznetsova

2017 ◽  
Vol 17 (6) ◽  
pp. 204-209
Author(s):  
K.S. Votolin ◽  
◽  
S.I. Zherebtsov ◽  
M.Y. Klimovich ◽  
O.V. Smotrina ◽  
...  
Keyword(s):  

Author(s):  
Andrew J. Komrowski ◽  
N. S. Somcio ◽  
Daniel J. D. Sullivan ◽  
Charles R. Silvis ◽  
Luis Curiel ◽  
...  

Abstract The use of flip chip technology inside component packaging, so called flip chip in package (FCIP), is an increasingly common package type in the semiconductor industry because of high pin-counts, performance and reliability. Sample preparation methods and flows which enable physical failure analysis (PFA) of FCIP are thus in demand to characterize defects in die with these package types. As interconnect metallization schemes become more dense and complex, access to the backside silicon of a functional device also becomes important for fault isolation test purposes. To address these requirements, a detailed PFA flow is described which chronicles the sample preparation methods necessary to isolate a physical defect in the die of an organic-substrate FCIP.


Author(s):  
Nicola Senesi ◽  
Elisabetta Loffredo
Keyword(s):  

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