scholarly journals Solid-state bonding of A6061/high-tensile steel plate by metal salt generation bonding technique with acetic acid

2019 ◽  
Vol 69 (11) ◽  
pp. 548-552
Author(s):  
Shinji Koyama ◽  
Kohei Ozawa ◽  
Takako Muraoka
2004 ◽  
Vol 92 (6) ◽  
pp. 3843-3856 ◽  
Author(s):  
Kun Xu ◽  
John C. Selby ◽  
Mark A. Shannon ◽  
James Economy

2014 ◽  
Vol 783-786 ◽  
pp. 2450-2455
Author(s):  
Shinji Koyama

In recent years, an enormous pressure was put on the need to design and develop products that are compliant with the stringent environmental regulations set up various countries. Among the problems that need to be addressed is the need to design and develop environmentally friendly products that are energy efficient and easy to recycle. In this study, the effect of metal salt generation processing on the tensile strength of the bonded interface of Al/Al and Al/Cu was investigated by SEM observations of interfacial microstructures and fractured surfaces. Aluminum surfaces were modified by boiling in 5% aqueous solution of NaOH for 30 s and 98% formic acid for 60 s. Copper surface were modified by boiling 98% formic acid for 60 s. Solid-state bonding was performed at bonding temperature of 673 ~ 813 K and under a pressure of 6 MPa ( bonding time of 1.8 ks). Using metal salt generation bonding technique, the bonded joint is able to reach 0.2% proof stress at lower bonding temperature and with less deformation.


Langmuir ◽  
2006 ◽  
Vol 22 (6) ◽  
pp. 2437-2440 ◽  
Author(s):  
David W. Mosley ◽  
Brian Y. Chow ◽  
Joseph M. Jacobson

2021 ◽  
Vol 67 ◽  
pp. 35-45
Author(s):  
Shuangjie Zhang ◽  
Wei Wang ◽  
Shibo Ma ◽  
Qiang Li

2011 ◽  
Vol 28 (6) ◽  
pp. 1175-1181 ◽  
Author(s):  
Wei Xu ◽  
Zhiyong Huang ◽  
Xiaojun Zhang ◽  
Qi Li ◽  
Zhenming Lu ◽  
...  

1991 ◽  
Vol 179-181 ◽  
pp. 1166
Author(s):  
K. Abe ◽  
T. Higuchi ◽  
Y. Fujino

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