Roll-to-Roll Hot Embossing of High Aspect Ratio Micro Pillars for Superhydrophobic Applications

2019 ◽  
Vol 34 (5) ◽  
pp. 502-512 ◽  
Author(s):  
N. Kodihalli Shivaprakash ◽  
J. Zhang ◽  
T. Nahum ◽  
C. Barry ◽  
Q. Truong ◽  
...  
Author(s):  
Tianhong Cui ◽  
Kody Varahramyan ◽  
Yongjun Zhao ◽  
Jing Wang

This paper reports the simulation and fabrication of novel polymer-based tunneling sensors by hot embossing technique, one of the advanced polymer microfabrication technologies. ANSYS is the software tools used to simulate the mechanical microstructures of the polymer tunneling sensors. Following the optimum design of the sensors, the mold inserts of hot embossing are fabricated by anodic bonding of glass disk 5 mm think and silicon wafer, with high-aspect-ratio microstructures by ICP etching. Main structures of polymer-based tunneling sensors are hot embossed on PMMA, followed by plastic bonding to form lateral tunneling sensor platform.


2011 ◽  
Vol 21 (2) ◽  
pp. 025017 ◽  
Author(s):  
Mauno Schelb ◽  
Christoph Vannahme ◽  
Alexander Kolew ◽  
Timo Mappes

2018 ◽  
Vol 57 (48) ◽  
pp. 16335-16346 ◽  
Author(s):  
Krystopher S. Jochem ◽  
Wieslaw J. Suszynski ◽  
C. Daniel Frisbie ◽  
Lorraine F. Francis

2020 ◽  
Vol 15 (15) ◽  
pp. 1115-1119
Author(s):  
Zexiang Yan ◽  
Ying Wang ◽  
Xingchang Zeng ◽  
Jiangbo Lu ◽  
Xianglian Lv ◽  
...  

2013 ◽  
Vol 20 (10-11) ◽  
pp. 1967-1973 ◽  
Author(s):  
A. Kolew ◽  
M. Heilig ◽  
M. Schneider ◽  
D. Münch ◽  
R. Ezzat ◽  
...  

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