scholarly journals Multiscale Modelling and Characterization of Mechanical Properties in Heat-Resistant Alloys

Crystals ◽  
2022 ◽  
Vol 12 (1) ◽  
pp. 105
Author(s):  
Ikumu Watanabe ◽  
Nobufumi Ueshima ◽  
Jovana Ruzic ◽  
Hongzhi Cui

Various heat-resistant alloys have been used in industry; however, the bridge between the bulk mechanical properties and the underlying micro- and nanoscopic local properties remains an issue [...]

2016 ◽  
Vol 368 ◽  
pp. 45-48
Author(s):  
Peter Burik ◽  
Ladislav Pešek ◽  
Zuzana Andršová ◽  
Pavel Kejzlar ◽  
Pavol Zubko

The macroscopic mechanical properties of steel are highly dependent upon microstructure, crystallographic orientation of grains and distribution of each phase present, etc. Nanomechanical testing using depth sensing indentation (DSI) provides a straightforward solution for quantitatively characterizing each of phases in microstructure because it is very powerful technique for characterization of materials in small volumes. Measuring the local properties of each microstructure component separately in multiphase materials gives information that is valuable for the development of new materials and for modelling. The work experimentally analyses the effect of strain history on the mechanical properties of individual components in steel sheets by depth sensing indentation. The measurements were carried out on broken tensile specimens.


Author(s):  
Gyeung Ho Kim ◽  
Mehmet Sarikaya ◽  
D. L. Milius ◽  
I. A. Aksay

Cermets are designed to optimize the mechanical properties of ceramics (hard and strong component) and metals (ductile and tough component) into one system. However, the processing of such systems is a problem in obtaining fully dense composite without deleterious reaction products. In the lightweight (2.65 g/cc) B4C-Al cermet, many of the processing problems have been circumvented. It is now possible to process fully dense B4C-Al cermet with tailored microstructures and achieve unique combination of mechanical properties (fracture strength of over 600 MPa and fracture toughness of 12 MPa-m1/2). In this paper, microstructure and fractography of B4C-Al cermets, tested under dynamic and static loading conditions, are described.The cermet is prepared by infiltration of Al at 1150°C into partially sintered B4C compact under vacuum to full density. Fracture surface replicas were prepared by using cellulose acetate and thin-film carbon deposition. Samples were observed with a Philips 3000 at 100 kV.


Author(s):  
K.L. More ◽  
R.A. Lowden

The mechanical properties of fiber-reinforced composites are directly related to the nature of the fiber-matrix bond. Fracture toughness is improved when debonding, crack deflection, and fiber pull-out occur which in turn depend on a weak interfacial bond. The interfacial characteristics of fiber-reinforced ceramics can be altered by applying thin coatings to the fibers prior to composite fabrication. In a previous study, Lowden and co-workers coated Nicalon fibers (Nippon Carbon Company) with silicon and carbon prior to chemical vapor infiltration with SiC and determined the influence of interfacial frictional stress on fracture phenomena. They found that the silicon-coated Nicalon fiber-reinforced SiC had low flexure strengths and brittle fracture whereas the composites containing carbon coated fibers exhibited improved strength and fracture toughness. In this study, coatings of boron or BN were applied to Nicalon fibers via chemical vapor deposition (CVD) and the fibers were subsequently incorporated in a SiC matrix. The fiber-matrix interfaces were characterized using transmission and scanning electron microscopy (TEM and SEM). Mechanical properties were determined and compared to those obtained for uncoated Nicalon fiber-reinforced SiC.


2012 ◽  
Vol 53 (6) ◽  
pp. 1090-1093 ◽  
Author(s):  
Yasuhiro Hoshiyama ◽  
Xiaoying Li ◽  
Hanshan Dong ◽  
Akio Nishimoto

Author(s):  
Thais Helena Sydenstricker Flores-Sahagun ◽  
Kelly Priscila Agapito ◽  
ROSA MARIA JIMENEZ AMEZCUA ◽  
Felipe Jedyn

Author(s):  
Nicholas Randall ◽  
Rahul Premachandran Nair

Abstract With the growing complexity of integrated circuits (IC) comes the issue of quality control during the manufacturing process. In order to avoid late realization of design flaws which could be very expensive, the characterization of the mechanical properties of the IC components needs to be carried out in a more efficient and standardized manner. The effects of changes in the manufacturing process and materials used on the functioning and reliability of the final device also need to be addressed. Initial work on accurately determining several key mechanical properties of bonding pads, solder bumps and coatings using a combination of different methods and equipment has been summarized.


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