scholarly journals Large Thermal Expansion LTCC System for Cofiring with Integrated Functional Ceramics Layers

Materials ◽  
2022 ◽  
Vol 15 (2) ◽  
pp. 564
Author(s):  
Beate Capraro ◽  
Manuel Heidenreich ◽  
Jörg Töpfer

We have studied the sintering behavior of CT708 LTCC tapes with large CTE of 10.6 ppm/K. This low-k dielectric LTCC material is a quartz-based glass ceramic composite system with partial crystallization of celsian upon firing. The shrinkage, densification and dielectric properties were examined using different heating rates and a sintering temperature of 900 °C. The maximum shrinkage rate is at 836 °C (for a heating rate of 2 K/min) with a sintering density of 95% and a permittivity of ε’ = 5.9 and tan δ = 0.0004 (at 1 GHz). Due to their similar shrinkage and thermal expansion properties, CT708 tapes may be cofired with functional ceramic layers. As an example, we report on cofiring of a multilayer laminate of CT708 and a Sc-substituted hexagonal ferrite for applications as integrated microwave circulator components. This demonstrates the feasibility of cofiring of functional ceramic tapes and tailored LTCC tapes and documents the potential for the realization of complex LTCC multilayer architectures.

2015 ◽  
Vol 756 ◽  
pp. 313-318 ◽  
Author(s):  
Valeriy M. Pogrebenkov ◽  
Kirill S. Kostikov ◽  
E.A. Sudarev ◽  
A.V. Elistratova ◽  
Ksenia S. Kamyshnaya ◽  
...  

Glass-ceramic composite materials based on lead-borate glass and eucryptite – a compound with a negative coefficient of linear thermal expansion (CTE), along with the conditions for their production are studied in this paper. Effects of the amount and granulometric composition of the eucryptite as well as time/temperature processing conditions on the change of the linear thermal expansion coefficient of the sintered samples are also examined.


Materials ◽  
2021 ◽  
Vol 14 (12) ◽  
pp. 3365
Author(s):  
Justyna Zygmuntowicz ◽  
Magdalena Gizowska ◽  
Justyna Tomaszewska ◽  
Paulina Piotrkiewicz ◽  
Radosław Żurowski ◽  
...  

This work focuses on research on obtaining and characterizing Al2O3/ZrO2 materials formed via slip casting method. The main emphasis in the research was placed on environmental aspects and those related to the practical use of ceramic materials. The goal was to analyze the environmental loads associated with the manufacturing of Al2O3/ZrO2 composites, as well as to determine the coefficient of thermal expansion of the obtained materials, classified as technical ceramics. This parameter is crucial in terms of their practical applications in high-temperature working conditions, e.g., as parts of industrial machines. The study reports on the four series of Al2O3/ZrO2 materials differing in the volume content of ZrO2. The sintering process was preceded by thermogravimetric measurements. The fabricated and sintered materials were characterized by dilatometric study, scanning electron microscopy, X-ray diffraction, and stereological analysis. Further, life cycle assessment was supplied. Based on dilatometric tests, it was observed that Al2O3/ZrO2 composites show a higher coefficient of thermal expansion than that resulting from the content of individual phases. The results of the life cycle analysis showed that the environmental loads (carbon footprint) resulting from the acquisition and processing of raw materials necessary for the production of sinters from Al2O3 and ZrO2 are comparable to those associated with the production of plastic products such as polypropylene or polyvinyl chloride.


2006 ◽  
Vol 914 ◽  
Author(s):  
George Andrew Antonelli ◽  
Tran M. Phung ◽  
Clay D. Mortensen ◽  
David Johnson ◽  
Michael D. Goodner ◽  
...  

AbstractThe electrical and mechanical properties of low-k dielectric materials have received a great deal of attention in recent years; however, measurements of thermal properties such as the coefficient of thermal expansion remain minimal. This absence of data is due in part to the limited number of experimental techniques capable of measuring this parameter. Even when data does exist, it has generally not been collected on samples of a thickness relevant to current and future integrated processes. We present a procedure for using x-ray reflectivity to measure the coefficient of thermal expansion of sub-micron dielectric thin films. In particular, we elucidate the thin film mechanics required to extract this parameter for a supported film as opposed to a free-standing film. Results of measurements for a series of plasma-enhanced chemical vapor deposited and spin-on low-k dielectric thin films will be provided and compared.


2017 ◽  
Vol 73 (9-10) ◽  
pp. 381-385 ◽  
Author(s):  
V. A. Rozenenkova ◽  
S. S. Solntsev ◽  
N. A. Mironova ◽  
S. V. Gavrilov

2006 ◽  
Vol 914 ◽  
Author(s):  
Jiping Ye ◽  
Satoshi Shimizu ◽  
Shigeo Sato ◽  
Nobuo Kojima ◽  
Junnji Noro

AbstractA recently developed bidirectional thermal expansion measurement (BTEM) method was applied to different types of low-k films to substantiate the reliability of the Poisson's ratio found with this technique and thereby to corroborate its practical utility. In this work, the Poisson's ratio was determined by obtaining the temperature gradient of the biaxial thermal stress from substrate curvature measurements, the temperature gradient of the whole thermal expansion strain along the film thickness from x-ray reflectivity (XRR) measurements, and reduced modulus of the film from nanoindentation measurements. For silicon oxide-based SiOC film having a thickness of 382.5 nm, the Poisson's ratio, Young's modulus and thermal extension coefficient (TEC) were determined to be Vf = 0.26, αf =21 ppm/K and Ef =9,7 GPa. These data are close to the levels of metals and polymers rather than the levels of fused silicon oxide, which is characterized by Vf = 0.17 and Er = 69.6 GPa. The alkyl component in the silicon oxide-based framework is thought to act as an agent in reducing the modulus and elevating the Poisson's ratio in SiOC low-k materials. In the case of an organic polymer SiLK film with a thickness of 501.5 nm, the Poisson's ratio, Young's modulus and TEC were determined to be Vf = 0.39, αf =74 ppm/K and Er =3.1 GPa, which are in the typical range of V= 0.34~0.47 with E =1.0~10 GPa for polymer materials. From the viewpoint of the relationship between the Poisson's ratio and Young's modulus as classified by different material types, the Poisson's ratios found for the silicon oxide-based SiOC and organic SiLK films are reasonable values, thereby confirming that BTEM is a reliable and effective method for evaluating the Poisson's ratio of thin films.


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